TWI642118B - 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 - Google Patents

半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 Download PDF

Info

Publication number
TWI642118B
TWI642118B TW103103948A TW103103948A TWI642118B TW I642118 B TWI642118 B TW I642118B TW 103103948 A TW103103948 A TW 103103948A TW 103103948 A TW103103948 A TW 103103948A TW I642118 B TWI642118 B TW I642118B
Authority
TW
Taiwan
Prior art keywords
displaceable
semiconductor die
force
semiconductor
tool
Prior art date
Application number
TW103103948A
Other languages
English (en)
Chinese (zh)
Other versions
TW201438117A (zh
Inventor
Johannes Cornelis DE BEIJER
迪貝賈約翰尼斯科內利斯
Michiel Hendrikus Antonius Wilhelmus RUTTEN
魯頓米歇爾漢卓庫斯安東努斯威廉默斯
Ger HUIZING
惠金卓
Mike Louis Theodoo Hoedemaker
浩德默克麥可路易斯西奧多
Original Assignee
Boschman Technologies Bv
波許曼科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boschman Technologies Bv, 波許曼科技有限公司 filed Critical Boschman Technologies Bv
Publication of TW201438117A publication Critical patent/TW201438117A/zh
Application granted granted Critical
Publication of TWI642118B publication Critical patent/TWI642118B/zh

Links

Classifications

    • H10P72/0441—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • H10P72/0428—
    • H10P72/0446—
    • H10P72/0604—
    • H10P74/20—
    • H10W70/40—
    • H10W70/60—
    • H10W72/0198—
    • H10W74/014—
    • H10W74/111—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • B29C2045/822—Pneumatic circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW103103948A 2013-02-06 2014-02-06 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 TWI642118B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
NL2010252 2013-02-06

Publications (2)

Publication Number Publication Date
TW201438117A TW201438117A (zh) 2014-10-01
TWI642118B true TWI642118B (zh) 2018-11-21

Family

ID=47891868

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103103948A TWI642118B (zh) 2013-02-06 2014-02-06 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備

Country Status (8)

Country Link
US (1) US9536760B2 (enExample)
EP (1) EP2954550B1 (enExample)
JP (1) JP6420259B2 (enExample)
KR (1) KR102205248B1 (enExample)
CN (1) CN105247671B (enExample)
NL (1) NL2010252C2 (enExample)
TW (1) TWI642118B (enExample)
WO (1) WO2014123413A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
IT201700000191A1 (it) 2017-01-02 2018-07-02 Amx Automatrix S R L Pressa e metodo di sinterizzazione di componenti elettronici su un substrato
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
US11227779B2 (en) * 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
DE102017216545A1 (de) 2017-09-19 2018-11-29 Conti Temic Microelectronic Gmbh Vorrichtung und Verfahren zur Herstellung einer Niedertemperatur-Drucksinterverbindung für eine elektronische Baugruppe
EP3791700A1 (en) * 2018-05-08 2021-03-17 W.L. Gore & Associates, Inc. Flexible and durable printed circuits on stretchable and non-stretchable substrates
NL2021137B1 (en) * 2018-06-15 2019-12-20 Boschman Tech Bv Sintering Process Product Carrier
IT201800006846A1 (it) * 2018-07-02 2020-01-02 Gruppo di pressatura per una pressa di sinterizzazione di componenti elettronici su un substrato
IT201800007256A1 (it) * 2018-07-17 2020-01-17 Organo pressore, gruppo di pressatura e pressa di sinterizzazione di componenti elettronici su un substrato
US11227807B2 (en) 2018-11-16 2022-01-18 Hewlett-Packard Development Company, L.P. Two-step molding for a lead frame
JP6667879B1 (ja) * 2018-12-19 2020-03-18 アサヒ・エンジニアリング株式会社 電子部品の実装装置
DE102018133456A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133420A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018010352B4 (de) 2018-12-21 2021-05-12 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133434B4 (de) 2018-12-21 2021-03-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats
JP2020119983A (ja) * 2019-01-23 2020-08-06 トヨタ自動車株式会社 半導体素子接合装置、及び半導体素子接合方法
JP6762578B2 (ja) * 2019-02-09 2020-09-30 アサヒ・エンジニアリング株式会社 電子部品実装装置
NL2024038B1 (en) * 2019-10-17 2021-06-22 Boschman Tech B V Component Processing Apparatus, such as a Pressure Sintering Apparatus or a Component Encapsulation Apparatus
KR102196397B1 (ko) * 2020-05-13 2020-12-30 제엠제코(주) 메탈포스트, 이를 포함하는 반도체 패키지 및 반도체 패키지 제조방법
DE102020114442A1 (de) 2020-05-29 2021-12-02 Danfoss Silicon Power Gmbh Halbleiterbauelement
DE102020207343A1 (de) 2020-06-15 2021-12-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optischer und/oder optoelektronischer Systeme mit verbesserter Wärmeabfuhr und verbesserter thermischer und/oder mechanischer Stabilität, sowie mittels dieses Verfahrens erhaltene optische und/oder optoelektronische Systeme
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices
US12072251B2 (en) * 2022-03-01 2024-08-27 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
CN116631917B (zh) * 2023-07-19 2023-12-19 江苏快克芯装备科技有限公司 气压膜压接装置
AT527921B1 (de) 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030569A (en) * 1996-06-21 2000-02-29 Advanced Systems Automation Limited Packaging process using a wedge device for linear force amplification in a press
US6196821B1 (en) * 1998-01-16 2001-03-06 Lily Chen Mold assembly for injection molding flat-type heat sinks
TW201110303A (en) * 2009-09-03 2011-03-16 Advanced Semiconductor Eng Semiconductor package and method of manufacturing the same
US20130028998A1 (en) * 2011-07-29 2013-01-31 Masanori Maekawa Molding die set and resin molding apparatus having the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL193526C (nl) * 1991-02-26 2000-01-04 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen met een kunststof.
JP3026550B2 (ja) * 1996-05-07 2000-03-27 富士通株式会社 半導体装置の製造方法
JPH11121479A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 半導体部品の実装方法および実装装置
CN100515720C (zh) * 1999-12-16 2009-07-22 第一精工株式会社 树脂封装用模具装置
JP2002110744A (ja) * 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd 半導体実装装置、および半導体実装方法
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
JP2003133706A (ja) * 2001-10-22 2003-05-09 Matsushita Electric Ind Co Ltd 圧着装置および圧着方法
JP4017480B2 (ja) * 2002-09-24 2007-12-05 Ｔｏｗａ株式会社 樹脂封止金型
JP2005026608A (ja) * 2003-07-02 2005-01-27 Tokyo Electron Ltd 接合方法および接合装置
JP2006156796A (ja) * 2004-11-30 2006-06-15 Towa Corp 半導体チップの樹脂封止成形方法、及び、装置
US7520052B2 (en) * 2005-06-27 2009-04-21 Texas Instruments Incorporated Method of manufacturing a semiconductor device
EP1939926B1 (en) * 2005-10-12 2012-03-21 Murata Manufacturing Co. Ltd. Bonding apparatus
JP2007317738A (ja) * 2006-05-23 2007-12-06 Matsushita Electric Ind Co Ltd 部品圧着実装機の加重測定方法と装置、それらを用いた部品圧着実装機
US7948034B2 (en) * 2006-06-22 2011-05-24 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor bonding
JP2008192725A (ja) * 2007-02-02 2008-08-21 Spansion Llc 半導体装置及びその製造方法並びに半導体装置の製造装置
JP5070896B2 (ja) * 2007-03-19 2012-11-14 富士通セミコンダクター株式会社 電子部品の樹脂封止方法、樹脂封止用金型及び半導体装置の製造方法
CN100576478C (zh) * 2007-09-29 2009-12-30 南茂科技股份有限公司 晶粒重新配置的封装方法
JP5434910B2 (ja) * 2008-03-27 2014-03-05 株式会社ニコン 接合装置および接合方法
JP5777660B2 (ja) * 2013-05-17 2015-09-09 アサヒ・エンジニアリング株式会社 樹脂成形装置及び半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6030569A (en) * 1996-06-21 2000-02-29 Advanced Systems Automation Limited Packaging process using a wedge device for linear force amplification in a press
US6196821B1 (en) * 1998-01-16 2001-03-06 Lily Chen Mold assembly for injection molding flat-type heat sinks
TW201110303A (en) * 2009-09-03 2011-03-16 Advanced Semiconductor Eng Semiconductor package and method of manufacturing the same
US20130028998A1 (en) * 2011-07-29 2013-01-31 Masanori Maekawa Molding die set and resin molding apparatus having the same

Also Published As

Publication number Publication date
US20150371880A1 (en) 2015-12-24
KR102205248B1 (ko) 2021-01-21
WO2014123413A1 (en) 2014-08-14
US9536760B2 (en) 2017-01-03
EP2954550A1 (en) 2015-12-16
EP2954550B1 (en) 2017-06-28
NL2010252C2 (en) 2014-08-07
JP6420259B2 (ja) 2018-11-07
CN105247671B (zh) 2017-12-22
TW201438117A (zh) 2014-10-01
CN105247671A (zh) 2016-01-13
JP2016507164A (ja) 2016-03-07
KR20150136476A (ko) 2015-12-07

Similar Documents

Publication Publication Date Title
TWI642118B (zh) 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備
US12224208B2 (en) Method of separating electronic devices having a back layer and apparatus
KR102332745B1 (ko) 열압착 본딩 시스템 및 열압착 본딩 시스템 작동 방법
JP6861609B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
KR102522168B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
US20030194833A1 (en) Method and apparatus for underfilling semiconductor devices
JP6525805B2 (ja) モールド金型及びモールド装置
CN104103530A (zh) 电子元件的压缩树脂封装方法及压缩树脂封装装置
KR102527948B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
US10096502B2 (en) Method and apparatus for assembling and testing a multi-integrated circuit package
US7352039B2 (en) Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device
JP2010214595A (ja) 樹脂封止装置
JP2018202737A (ja) 樹脂モールド金型及び樹脂モールド装置
WO2018100807A1 (ja) 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
WO2018100808A1 (ja) 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
TWI743241B (zh) 助焊系統、包括助焊系統的接合機及其操作方法
TWI360187B (en) Method and device for encapsulating electronic com
KR20090066593A (ko) 플립칩 본딩장치 및 플립칩 본딩방법
CN120527245A (zh) 激光辅助键合装置和将半导体裸片键合到衬底上的方法
KR20110026151A (ko) 솔더 범프 형성 장치