NL194005C - Een werkwijze, bad en cel voor het elektrolytisch afzetten van tin-bismutlegeringen. - Google Patents

Een werkwijze, bad en cel voor het elektrolytisch afzetten van tin-bismutlegeringen. Download PDF

Info

Publication number
NL194005C
NL194005C NL8820893A NL8820893A NL194005C NL 194005 C NL194005 C NL 194005C NL 8820893 A NL8820893 A NL 8820893A NL 8820893 A NL8820893 A NL 8820893A NL 194005 C NL194005 C NL 194005C
Authority
NL
Netherlands
Prior art keywords
bismuth
tin
bath
coating
electrolytic
Prior art date
Application number
NL8820893A
Other languages
English (en)
Dutch (nl)
Other versions
NL8820893A (nl
NL194005B (nl
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22208944&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL194005(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atochem North America filed Critical Atochem North America
Publication of NL8820893A publication Critical patent/NL8820893A/nl
Publication of NL194005B publication Critical patent/NL194005B/xx
Application granted granted Critical
Publication of NL194005C publication Critical patent/NL194005C/nl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
NL8820893A 1988-10-14 1988-10-14 Een werkwijze, bad en cel voor het elektrolytisch afzetten van tin-bismutlegeringen. NL194005C (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8803536 1988-10-14
PCT/US1988/003536 WO1990004048A1 (en) 1988-10-14 1988-10-14 A method, bath and cell for the electrodeposition of tin-bismuth alloys

Publications (3)

Publication Number Publication Date
NL8820893A NL8820893A (nl) 1990-10-01
NL194005B NL194005B (nl) 2000-12-01
NL194005C true NL194005C (nl) 2001-04-03

Family

ID=22208944

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8820893A NL194005C (nl) 1988-10-14 1988-10-14 Een werkwijze, bad en cel voor het elektrolytisch afzetten van tin-bismutlegeringen.

Country Status (13)

Country Link
EP (1) EP0397663B1 (pt)
JP (1) JP2983548B2 (pt)
KR (1) KR960008155B1 (pt)
AT (1) ATE105877T1 (pt)
BR (1) BR8807847A (pt)
DE (1) DE3889667T2 (pt)
DK (1) DK143590A (pt)
HK (1) HK103095A (pt)
LU (1) LU87746A1 (pt)
NL (1) NL194005C (pt)
NO (1) NO902630L (pt)
SE (1) SE502520C2 (pt)
WO (1) WO1990004048A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
ES2189064T3 (es) * 1997-10-22 2003-07-01 Goldschmidt Ag Th Proceso para la fabricacion de compuestos de bismuto.
AU2003272790A1 (en) 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
KR100849439B1 (ko) * 2007-08-13 2008-07-30 다이섹(주) 노광장비의 스텝퍼척 제조방법
JP2020169360A (ja) * 2019-04-03 2020-10-15 奥野製薬工業株式会社 電気めっき用Ｂｉ−Ｓｂ合金めっき液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198877A (en) * 1962-02-09 1965-08-03 Anaconda Wire & Cable Co Pothead closure sealed with bismuth-tin alloy
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
FR2071199A5 (pt) * 1969-12-19 1971-09-17 Ibm France
SU467145A1 (ru) * 1972-08-15 1975-04-15 Предприятие П/Я Х-5885 Электролит дл осаждени сплава олово-висмут
SU463747A1 (ru) * 1972-12-26 1975-03-15 Морской Гидрофизический Институт Ан Укр.Сср Электролит дл осаждени сплава олово-висмут
SU697610A1 (ru) * 1977-11-22 1979-11-15 Харьковский Ордена Ленина Политехнический Институт Им.В.И.Ленина Электролит дл нанесени покрытий сплавом олово-висмут
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Also Published As

Publication number Publication date
BR8807847A (pt) 1990-11-13
NO902630L (no) 1990-08-06
HK103095A (en) 1995-07-07
DE3889667D1 (de) 1994-06-23
KR960008155B1 (ko) 1996-06-20
SE502520C2 (sv) 1995-11-06
NL8820893A (nl) 1990-10-01
SE9002096L (sv) 1990-06-12
EP0397663A4 (en) 1991-01-09
DK143590D0 (da) 1990-06-12
NO902630D0 (no) 1990-06-13
EP0397663A1 (en) 1990-11-22
JPH03503068A (ja) 1991-07-11
DK143590A (da) 1990-07-27
KR900702085A (ko) 1990-12-05
LU87746A1 (en) 1991-05-07
ATE105877T1 (de) 1994-06-15
SE9002096D0 (sv) 1990-06-12
DE3889667T2 (de) 1994-10-13
EP0397663B1 (en) 1994-05-18
JP2983548B2 (ja) 1999-11-29
NL194005B (nl) 2000-12-01
WO1990004048A1 (en) 1990-04-19

Similar Documents

Publication Publication Date Title
US5039576A (en) Electrodeposited eutectic tin-bismuth alloy on a conductive substrate
US4331518A (en) Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US3905878A (en) Electrolyte for and method of bright electroplating of tin-lead alloy
US5552031A (en) Palladium alloy plating compositions
US4013523A (en) Tin-gold electroplating bath and process
NL194005C (nl) Een werkwijze, bad en cel voor het elektrolytisch afzetten van tin-bismutlegeringen.
TWI507571B (zh) 藉由電鑄法但不使用有毒金屬或類金屬而獲致黃金合金沉積的方法
US3576724A (en) Electrodeposition of rutenium
US4747916A (en) Plating bath for electrodeposition of aluminum and process for the same
US744170A (en) Process of depositing metallic coatings on metallic objects.
WO2000068149A1 (en) Rhodium sulfate compounds and rhodium plating
US4053372A (en) Tin-lead acidic plating bath
Warwick et al. The autocatalytic deposition of tin
EP0032463A1 (en) Electrodeposition of cadmium with selenium
US4592809A (en) Electroplating composition and process and surfactant compound for use therein
NL8001999A (nl) Bad voor het platteren met zilver en een legering van goud en zilver en een werkwijze voor het platteren daarmede.
US4270990A (en) Acidic electroplating baths with novel surfactants
NL8105601A (nl) Samenstellingen en werkwijzen voor het elektrolytisch afzetten van palladium en palladiumlegeringen.
AU632464B2 (en) A method, bath and cell for the electrodeposition of tin-bismuth alloys
US6248228B1 (en) Metal alloy halide electroplating baths
US5443714A (en) Process and electrolyte for depositing lead and lead-containing layers
IE56353B1 (en) Bath for the galvanic deposition of gold alloys
US3980532A (en) Deposition of brass by electroplating
Bhatgadde et al. Preparation and optimization of pyrophosphate bath for copper electroplating of microwave components
SU574485A1 (ru) Электролит блест щего лужени

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BC A request for examination has been filed
V1 Lapsed because of non-payment of the annual fee

Effective date: 20030501