HK103095A - Electrodeposition of tin-bismuth alloys - Google Patents

Electrodeposition of tin-bismuth alloys

Info

Publication number
HK103095A
HK103095A HK103095A HK103095A HK103095A HK 103095 A HK103095 A HK 103095A HK 103095 A HK103095 A HK 103095A HK 103095 A HK103095 A HK 103095A HK 103095 A HK103095 A HK 103095A
Authority
HK
Hong Kong
Prior art keywords
bismuth
tin
electrodeposition
baths
bismuth alloys
Prior art date
Application number
HK103095A
Other languages
English (en)
Inventor
Harold P Wilson
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22208944&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK103095(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Atochem North America filed Critical Atochem North America
Publication of HK103095A publication Critical patent/HK103095A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
HK103095A 1988-10-14 1995-06-29 Electrodeposition of tin-bismuth alloys HK103095A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1988/003536 WO1990004048A1 (en) 1988-10-14 1988-10-14 A method, bath and cell for the electrodeposition of tin-bismuth alloys

Publications (1)

Publication Number Publication Date
HK103095A true HK103095A (en) 1995-07-07

Family

ID=22208944

Family Applications (1)

Application Number Title Priority Date Filing Date
HK103095A HK103095A (en) 1988-10-14 1995-06-29 Electrodeposition of tin-bismuth alloys

Country Status (13)

Country Link
EP (1) EP0397663B1 (xx)
JP (1) JP2983548B2 (xx)
KR (1) KR960008155B1 (xx)
AT (1) ATE105877T1 (xx)
BR (1) BR8807847A (xx)
DE (1) DE3889667T2 (xx)
DK (1) DK143590A (xx)
HK (1) HK103095A (xx)
LU (1) LU87746A1 (xx)
NL (1) NL194005C (xx)
NO (1) NO902630L (xx)
SE (1) SE502520C2 (xx)
WO (1) WO1990004048A1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227046A (en) * 1991-10-07 1993-07-13 Unisys Corporation Low temperature tin-bismuth electroplating system
ES2189064T3 (es) * 1997-10-22 2003-07-01 Goldschmidt Ag Th Proceso para la fabricacion de compuestos de bismuto.
AU2003272790A1 (en) 2002-10-08 2004-05-04 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴
DE102005016819B4 (de) * 2005-04-12 2009-10-01 Dr.-Ing. Max Schlötter GmbH & Co KG Elektrolyt, Verfahren zur Abscheidung von Zinn-Wismut-Legierungsschichten und Verwendung des Elektrolyten
KR100849439B1 (ko) * 2007-08-13 2008-07-30 다이섹(주) 노광장비의 스텝퍼척 제조방법
JP2020169360A (ja) * 2019-04-03 2020-10-15 奥野製薬工業株式会社 電気めっき用Ｂｉ−Ｓｂ合金めっき液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198877A (en) * 1962-02-09 1965-08-03 Anaconda Wire & Cable Co Pothead closure sealed with bismuth-tin alloy
US3360446A (en) * 1964-05-08 1967-12-26 M & T Chemicals Inc Electrodepositing a tin-bismuth alloy and additives therefor
FR2071199A5 (xx) * 1969-12-19 1971-09-17 Ibm France
SU467145A1 (ru) * 1972-08-15 1975-04-15 Предприятие П/Я Х-5885 Электролит дл осаждени сплава олово-висмут
SU463747A1 (ru) * 1972-12-26 1975-03-15 Морской Гидрофизический Институт Ан Укр.Сср Электролит дл осаждени сплава олово-висмут
SU697610A1 (ru) * 1977-11-22 1979-11-15 Харьковский Ордена Ленина Политехнический Институт Им.В.И.Ленина Электролит дл нанесени покрытий сплавом олово-висмут
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
JPH0781196B2 (ja) * 1986-07-04 1995-08-30 株式会社大和化成研究所 有機スルホン酸塩からのビスマス及びビスマス合金めつき浴

Also Published As

Publication number Publication date
BR8807847A (pt) 1990-11-13
DE3889667T2 (de) 1994-10-13
NO902630L (no) 1990-08-06
SE502520C2 (sv) 1995-11-06
EP0397663A4 (en) 1991-01-09
JP2983548B2 (ja) 1999-11-29
LU87746A1 (en) 1991-05-07
NL8820893A (nl) 1990-10-01
EP0397663A1 (en) 1990-11-22
JPH03503068A (ja) 1991-07-11
WO1990004048A1 (en) 1990-04-19
EP0397663B1 (en) 1994-05-18
ATE105877T1 (de) 1994-06-15
SE9002096L (sv) 1990-06-12
NL194005B (nl) 2000-12-01
KR960008155B1 (ko) 1996-06-20
NL194005C (nl) 2001-04-03
DE3889667D1 (de) 1994-06-23
SE9002096D0 (sv) 1990-06-12
DK143590A (da) 1990-07-27
DK143590D0 (da) 1990-06-12
NO902630D0 (no) 1990-06-13
KR900702085A (ko) 1990-12-05

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)