NL1016549C2 - Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. - Google Patents

Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. Download PDF

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Publication number
NL1016549C2
NL1016549C2 NL1016549A NL1016549A NL1016549C2 NL 1016549 C2 NL1016549 C2 NL 1016549C2 NL 1016549 A NL1016549 A NL 1016549A NL 1016549 A NL1016549 A NL 1016549A NL 1016549 C2 NL1016549 C2 NL 1016549C2
Authority
NL
Netherlands
Prior art keywords
printed circuit
shield
electronic components
circuit board
conductive
Prior art date
Application number
NL1016549A
Other languages
English (en)
Dutch (nl)
Inventor
Stephanus Gerardus Blankenborg
Peter Leerkamp
Original Assignee
Stork Screens Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1016354A external-priority patent/NL1016354C1/nl
Application filed by Stork Screens Bv filed Critical Stork Screens Bv
Priority to NL1016549A priority Critical patent/NL1016549C2/nl
Priority to KR10-2003-7004891A priority patent/KR20030057535A/ko
Priority to PCT/NL2001/000727 priority patent/WO2002030170A1/fr
Priority to JP2002533421A priority patent/JP2004511107A/ja
Priority to CA002424885A priority patent/CA2424885C/fr
Priority to AU2002211084A priority patent/AU2002211084A1/en
Priority to DE60104140T priority patent/DE60104140T2/de
Priority to EP01979095A priority patent/EP1323341B1/fr
Priority to US10/398,497 priority patent/US7089646B2/en
Priority to AT01979095T priority patent/ATE270491T1/de
Priority to CNB018168582A priority patent/CN1213650C/zh
Priority to ES01979095T priority patent/ES2219569T3/es
Publication of NL1016549C2 publication Critical patent/NL1016549C2/nl
Application granted granted Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
NL1016549A 2000-10-06 2000-11-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. NL1016549C2 (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL1016549A NL1016549C2 (nl) 2000-10-06 2000-11-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
DE60104140T DE60104140T2 (de) 2000-10-06 2001-10-03 Verfahren zum herstellen einer gegen störstrahlung abgeschirmten gedruckten leiterplatte
PCT/NL2001/000727 WO2002030170A1 (fr) 2000-10-06 2001-10-03 Procedes de fabrication d'une carte de circuit imprime blindee contre le rayonnement perturbateur
JP2002533421A JP2004511107A (ja) 2000-10-06 2001-10-03 干渉放射線に対して遮蔽された印刷回路基板の製造方法
CA002424885A CA2424885C (fr) 2000-10-06 2001-10-03 Procedes de fabrication d'une carte de circuit imprime blindee contre le rayonnement perturbateur
AU2002211084A AU2002211084A1 (en) 2000-10-06 2001-10-03 Methods of manufacturing a printed circuit board shielded against interfering radiation
KR10-2003-7004891A KR20030057535A (ko) 2000-10-06 2001-10-03 방사 간섭에 대하여 차폐되는 인쇄회로기판의 생산 방법
EP01979095A EP1323341B1 (fr) 2000-10-06 2001-10-03 Procedes de fabrication d'une carte de circuit imprime blindee contre le rayonnement perturbateur
US10/398,497 US7089646B2 (en) 2000-10-06 2001-10-03 Methods of manufacturing a printed circuit board shielded against interfering radiation
AT01979095T ATE270491T1 (de) 2000-10-06 2001-10-03 Verfahren zum herstellen einer gegen störstrahlung abgeschirmten gedruckten leiterplatte
CNB018168582A CN1213650C (zh) 2000-10-06 2001-10-03 屏蔽干扰性辐射的印刷电路板的制造方法
ES01979095T ES2219569T3 (es) 2000-10-06 2001-10-03 Procedimiento para la fabricacion de una placa de circuito impreso blindada contra radiacion interferente.

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL1016354 2000-10-06
NL1016354A NL1016354C1 (nl) 2000-10-06 2000-10-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
NL1016549 2000-11-06
NL1016549A NL1016549C2 (nl) 2000-10-06 2000-11-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.

Publications (1)

Publication Number Publication Date
NL1016549C2 true NL1016549C2 (nl) 2002-04-10

Family

ID=26643249

Family Applications (1)

Application Number Title Priority Date Filing Date
NL1016549A NL1016549C2 (nl) 2000-10-06 2000-11-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.

Country Status (12)

Country Link
US (1) US7089646B2 (fr)
EP (1) EP1323341B1 (fr)
JP (1) JP2004511107A (fr)
KR (1) KR20030057535A (fr)
CN (1) CN1213650C (fr)
AT (1) ATE270491T1 (fr)
AU (1) AU2002211084A1 (fr)
CA (1) CA2424885C (fr)
DE (1) DE60104140T2 (fr)
ES (1) ES2219569T3 (fr)
NL (1) NL1016549C2 (fr)
WO (1) WO2002030170A1 (fr)

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KR100618085B1 (ko) * 2003-09-22 2006-08-29 예원플라즈마 주식회사 전자제품의 보드내 부품들의 이엠아이 및 이에스디 차폐장치 및 그 제조방법
CN1891022B (zh) * 2003-12-08 2011-08-31 莱尔德技术股份有限公司 用于电磁屏蔽系统的替换盖
JP4689287B2 (ja) * 2005-02-03 2011-05-25 北川工業株式会社 シールドケース及び導電材同士の接触、固定方法
US7446265B2 (en) * 2005-04-15 2008-11-04 Parker Hannifin Corporation Board level shielding module
GB2426633A (en) * 2005-05-27 2006-11-29 Arka Technologies Ltd Component securing means
US8104474B2 (en) * 2005-08-23 2012-01-31 Portaero, Inc. Collateral ventilation bypass system with retention features
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
CN101452729A (zh) * 2007-11-29 2009-06-10 深圳易拓科技有限公司 一种移动硬盘的抗电磁干扰方法及移动硬盘
KR101056323B1 (ko) * 2009-09-15 2011-08-11 삼성모바일디스플레이주식회사 평판표시장치
DE102009047681A1 (de) 2009-12-08 2011-06-09 Robert Bosch Gmbh Schaltungsmodul und Verfahren zur Herstellung eines solchen Schaltungsmoduls
JP5593714B2 (ja) 2010-01-29 2014-09-24 富士通株式会社 電子素子のシールド構造及びこれを備えた電子装置
DE102010026953B4 (de) * 2010-07-12 2015-02-26 Continental Automotive Gmbh Gehäuse einer elektronischen Schaltung für eine Kraftstoffpumpe
CN102340962A (zh) * 2010-07-28 2012-02-01 深圳富泰宏精密工业有限公司 固定结构及应用该固定结构的电子装置
US8340735B2 (en) * 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (fr) * 2010-08-06 2015-04-29 BlackBerry Limited Écran électromagnétique et chambre acoustique pour microphone dans un dispositif électronique mobile
TW201218731A (en) * 2010-10-28 2012-05-01 Hon Hai Prec Ind Co Ltd Mobile phone with metal hinge
CN101964830A (zh) * 2010-10-29 2011-02-02 鸿富锦精密工业（深圳）有限公司 带有金属铰链的手机
US8654537B2 (en) 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US8279625B2 (en) 2010-12-14 2012-10-02 Apple Inc. Printed circuit board radio-frequency shielding structures
KR101052559B1 (ko) * 2011-02-25 2011-07-29 김선기 전자파 차폐 및 보호용 실드케이스
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US9254588B1 (en) * 2011-11-28 2016-02-09 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit boards
US9900988B1 (en) * 2011-11-28 2018-02-20 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit board EMI sheilding and thermal management
US10631413B1 (en) * 2011-11-28 2020-04-21 The United States Of America As Represented By The Secretary Of The Army Enhanced protective layering process to accommodate circuit board heat dissipation
JP5299596B1 (ja) 2011-12-26 2013-09-25 Ｄｉｃ株式会社 粘着テープ
TWI468485B (zh) * 2012-05-21 2015-01-11 Dainippon Ink & Chemicals 黏膠帶
US9785185B2 (en) * 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
AU2013327016A1 (en) 2012-10-04 2015-04-30 Niitek, Inc. Shieldings for metal detector heads and manufacturing methods thereof
KR20140143991A (ko) * 2013-06-10 2014-12-18 삼성전기주식회사 무선 전력 전송용 차폐 장치 및 그를 이용한 무선 전력 전송 시스템
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
US9521741B1 (en) 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
JP6413405B2 (ja) * 2014-07-07 2018-10-31 Ａｇｃ株式会社 両面粘着フィルム、粘着層付き透明面材、および積層体
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN105592679B (zh) * 2016-03-09 2018-07-13 深圳市华星光电技术有限公司 Pcb固定结构及液晶显示装置
CN106132182A (zh) * 2016-06-27 2016-11-16 努比亚技术有限公司 印制电路板、移动终端、移动终端屏蔽框及制备方法
CN106028627A (zh) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 一种电路板总成
US20180084682A1 (en) * 2016-09-20 2018-03-22 Jones Tech (USA), Inc. Shielding structure for an electronic circuit
JP6691495B2 (ja) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
CN107411459A (zh) * 2017-07-17 2017-12-01 陈锋 一种防电磁辐射的被子
CN113543615B (zh) * 2021-06-29 2022-11-01 中国科学院长春光学精密机械与物理研究所 空间电子设备辐照防护方法
CN114203007B (zh) * 2021-12-14 2024-04-09 三门核电有限公司 一种棒位编码卡故障模拟系统及故障排查系统

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Publication number Priority date Publication date Assignee Title
US5313371A (en) * 1991-03-04 1994-05-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit packages
EP0806891A1 (fr) * 1996-05-08 1997-11-12 W.L. GORE & ASSOCIATES, INC. Assemblage d'un couvercle pour le blindage des composants électroniques contre les interférences électromagnétiques
EP0806892A1 (fr) * 1996-05-08 1997-11-12 W.L. GORE & ASSOCIATES, INC. Cage de Faraday
WO1998047340A1 (fr) * 1997-04-16 1998-10-22 Telefonaktiebolaget Lm Ericsson (Publ) Boitier de blindage et procede de fabrication d'un boitier de blindage
WO1999040770A1 (fr) * 1998-02-04 1999-08-12 Stork Screens B.V. Procede de fabrication d'un support pourvu d'un blindage contre les rayonnements d'interferences et materiel de blindage
WO2000048441A1 (fr) * 1999-02-09 2000-08-17 Ericsson, Inc. Boitier de blindage a extremites de parois effilees pour un montage en surface et radiotelephones comprenant ce boitier

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Publication number Priority date Publication date Assignee Title
US5313371A (en) * 1991-03-04 1994-05-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit packages
EP0806891A1 (fr) * 1996-05-08 1997-11-12 W.L. GORE & ASSOCIATES, INC. Assemblage d'un couvercle pour le blindage des composants électroniques contre les interférences électromagnétiques
EP0806892A1 (fr) * 1996-05-08 1997-11-12 W.L. GORE & ASSOCIATES, INC. Cage de Faraday
WO1998047340A1 (fr) * 1997-04-16 1998-10-22 Telefonaktiebolaget Lm Ericsson (Publ) Boitier de blindage et procede de fabrication d'un boitier de blindage
WO1999040770A1 (fr) * 1998-02-04 1999-08-12 Stork Screens B.V. Procede de fabrication d'un support pourvu d'un blindage contre les rayonnements d'interferences et materiel de blindage
WO2000048441A1 (fr) * 1999-02-09 2000-08-17 Ericsson, Inc. Boitier de blindage a extremites de parois effilees pour un montage en surface et radiotelephones comprenant ce boitier

Also Published As

Publication number Publication date
EP1323341A1 (fr) 2003-07-02
ATE270491T1 (de) 2004-07-15
CN1213650C (zh) 2005-08-03
CN1468503A (zh) 2004-01-14
KR20030057535A (ko) 2003-07-04
JP2004511107A (ja) 2004-04-08
US7089646B2 (en) 2006-08-15
US20040022046A1 (en) 2004-02-05
WO2002030170A1 (fr) 2002-04-11
CA2424885A1 (fr) 2002-04-11
DE60104140T2 (de) 2005-08-25
EP1323341B1 (fr) 2004-06-30
CA2424885C (fr) 2009-12-15
ES2219569T3 (es) 2004-12-01
AU2002211084A1 (en) 2002-04-15
DE60104140D1 (de) 2004-08-05

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Effective date: 20050601