NL1012004C2 - Werkwijze voor het verplaatsen van wafers alsmede ring. - Google Patents
Werkwijze voor het verplaatsen van wafers alsmede ring. Download PDFInfo
- Publication number
- NL1012004C2 NL1012004C2 NL1012004A NL1012004A NL1012004C2 NL 1012004 C2 NL1012004 C2 NL 1012004C2 NL 1012004 A NL1012004 A NL 1012004A NL 1012004 A NL1012004 A NL 1012004A NL 1012004 C2 NL1012004 C2 NL 1012004C2
- Authority
- NL
- Netherlands
- Prior art keywords
- ring
- wafer
- space
- heat treatment
- transport
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1012004A NL1012004C2 (nl) | 1999-05-07 | 1999-05-07 | Werkwijze voor het verplaatsen van wafers alsmede ring. |
KR1020017014141A KR100667718B1 (ko) | 1999-05-07 | 2000-05-08 | 웨이퍼 및 링의 운반 방법 |
PCT/NL2000/000297 WO2000068977A1 (en) | 1999-05-07 | 2000-05-08 | Method for transferring wafers and ring |
DE60030968T DE60030968T2 (de) | 1999-05-07 | 2000-05-08 | Transfermethode für halbleiterscheiben und haltering |
US10/009,851 US7048488B1 (en) | 1999-05-07 | 2000-05-08 | Apparatus for transferring wafer and ring |
EP00927958A EP1177571B1 (en) | 1999-05-07 | 2000-05-08 | Method for transferring wafers and ring |
CNB008072035A CN1157761C (zh) | 1999-05-07 | 2000-05-08 | 传输晶片的方法,热处理装置和环圈组合 |
JP2000617480A JP4632551B2 (ja) | 1999-05-07 | 2000-05-08 | ウエハおよびリングの移送方法、熱処理設備リングの組み合せ、及びウエハとリングのセット |
AU46260/00A AU4626000A (en) | 1999-05-07 | 2000-05-08 | Method for transferring wafers and ring |
TW089110988A TW452840B (en) | 1999-05-07 | 2000-06-05 | Method for transferring wafers and ring |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1012004A NL1012004C2 (nl) | 1999-05-07 | 1999-05-07 | Werkwijze voor het verplaatsen van wafers alsmede ring. |
NL1012004 | 1999-05-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL1012004C2 true NL1012004C2 (nl) | 2000-11-13 |
Family
ID=19769156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL1012004A NL1012004C2 (nl) | 1999-05-07 | 1999-05-07 | Werkwijze voor het verplaatsen van wafers alsmede ring. |
Country Status (10)
Country | Link |
---|---|
US (1) | US7048488B1 (zh) |
EP (1) | EP1177571B1 (zh) |
JP (1) | JP4632551B2 (zh) |
KR (1) | KR100667718B1 (zh) |
CN (1) | CN1157761C (zh) |
AU (1) | AU4626000A (zh) |
DE (1) | DE60030968T2 (zh) |
NL (1) | NL1012004C2 (zh) |
TW (1) | TW452840B (zh) |
WO (1) | WO2000068977A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6877250B2 (en) * | 1999-12-29 | 2005-04-12 | Asm International N.V. | Apparatus, method and system for the treatment of a wafer |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1018086C2 (nl) | 2001-05-16 | 2002-11-26 | Asm Int | Werkwijze en inrichting voor het thermisch behandelen van substraten. |
US6835039B2 (en) | 2002-03-15 | 2004-12-28 | Asm International N.V. | Method and apparatus for batch processing of wafers in a furnace |
US7427329B2 (en) | 2002-05-08 | 2008-09-23 | Asm International N.V. | Temperature control for single substrate semiconductor processing reactor |
US6843201B2 (en) | 2002-05-08 | 2005-01-18 | Asm International Nv | Temperature control for single substrate semiconductor processing reactor |
US7256375B2 (en) | 2002-08-30 | 2007-08-14 | Asm International N.V. | Susceptor plate for high temperature heat treatment |
US6788991B2 (en) | 2002-10-09 | 2004-09-07 | Asm International N.V. | Devices and methods for detecting orientation and shape of an object |
US6950774B2 (en) | 2003-01-16 | 2005-09-27 | Asm America, Inc. | Out-of-pocket detection system using wafer rotation as an indicator |
US7033126B2 (en) | 2003-04-02 | 2006-04-25 | Asm International N.V. | Method and apparatus for loading a batch of wafers into a wafer boat |
US7181132B2 (en) | 2003-08-20 | 2007-02-20 | Asm International N.V. | Method and system for loading substrate supports into a substrate holder |
US7022627B2 (en) | 2003-10-31 | 2006-04-04 | Asm International N.V. | Method for the heat treatment of substrates |
US7410355B2 (en) | 2003-10-31 | 2008-08-12 | Asm International N.V. | Method for the heat treatment of substrates |
US6940047B2 (en) | 2003-11-14 | 2005-09-06 | Asm International N.V. | Heat treatment apparatus with temperature control system |
US20060004493A1 (en) * | 2004-06-30 | 2006-01-05 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
US20060286807A1 (en) * | 2005-06-16 | 2006-12-21 | Jack Hwang | Use of active temperature control to provide emmisivity independent wafer temperature |
US7217670B2 (en) | 2004-11-22 | 2007-05-15 | Asm International N.V. | Dummy substrate for thermal reactor |
MX2007010234A (es) * | 2005-02-22 | 2007-11-07 | Baldwin Filters Inc | Aparato de filtro. |
US8057669B2 (en) * | 2005-02-22 | 2011-11-15 | Baldwin Filters, Inc. | Filter element and filter assembly including locking mechanism |
JP4755498B2 (ja) * | 2006-01-06 | 2011-08-24 | 東京エレクトロン株式会社 | 加熱装置及び加熱方法 |
US8002463B2 (en) * | 2008-06-13 | 2011-08-23 | Asm International N.V. | Method and device for determining the temperature of a substrate |
US8241493B2 (en) * | 2008-06-16 | 2012-08-14 | Baldwin Filters, Inc. | Filter with ejection mechanism |
US8128819B2 (en) | 2008-06-16 | 2012-03-06 | Baldwin Filters Inc. | Fluid filter, fluid filter assembly, and mounting method |
US8815090B2 (en) * | 2008-06-16 | 2014-08-26 | Baldwin Filters, Inc. | Filter with water separation device |
US20110097491A1 (en) * | 2009-10-27 | 2011-04-28 | Levy David H | Conveyance system including opposed fluid distribution manifolds |
CN102087986B (zh) * | 2009-12-04 | 2012-02-22 | 无锡华润上华半导体有限公司 | 晶片传送装置 |
EP2444993A1 (en) * | 2010-10-21 | 2012-04-25 | Applied Materials, Inc. | Load lock chamber, substrate processing system and method for venting |
CN102569142B (zh) * | 2012-02-03 | 2017-04-26 | 上海华虹宏力半导体制造有限公司 | 硅片转移装置、转移托环、半导体工艺反应设备 |
US8991619B2 (en) | 2012-03-26 | 2015-03-31 | Baldwin Filters, Inc. | Filter assembly with water evacuation and methods |
CA2896352C (en) | 2013-01-04 | 2020-10-27 | Baldwin Filters, Inc. | Three-part end cap and filter element including same |
US9349643B2 (en) | 2013-04-01 | 2016-05-24 | Brewer Science Inc. | Apparatus and method for thin wafer transfer |
US11097974B2 (en) | 2014-07-31 | 2021-08-24 | Corning Incorporated | Thermally strengthened consumer electronic glass and related systems and methods |
US10077204B2 (en) | 2014-07-31 | 2018-09-18 | Corning Incorporated | Thin safety glass having improved mechanical characteristics |
US10611664B2 (en) | 2014-07-31 | 2020-04-07 | Corning Incorporated | Thermally strengthened architectural glass and related systems and methods |
CN108698922B (zh) | 2016-01-12 | 2020-02-28 | 康宁股份有限公司 | 薄的热强化和化学强化的玻璃基制品 |
US11795102B2 (en) | 2016-01-26 | 2023-10-24 | Corning Incorporated | Non-contact coated glass and related coating system and method |
GB2553792A (en) * | 2016-09-14 | 2018-03-21 | Rec Solar Pte Ltd | Tray for holding at least one wafer |
EP3519075A4 (en) | 2016-10-03 | 2020-05-27 | Parker-Hannifin Corporation | FILTER ELEMENT WITH TORSION LOCK AND ASSEMBLY |
CN110769913B (zh) | 2017-05-31 | 2021-11-16 | 帕克-汉尼芬公司 | 带有扭锁和/或滑动活塞的过滤元件、组件和方法 |
TW201920028A (zh) | 2017-08-24 | 2019-06-01 | 美商康寧公司 | 具有改良回火能力之玻璃 |
KR102538177B1 (ko) * | 2017-11-16 | 2023-05-31 | 삼성전자주식회사 | 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치 |
TWI785156B (zh) | 2017-11-30 | 2022-12-01 | 美商康寧公司 | 具有高熱膨脹係數及對於熱回火之優先破裂行為的非離子交換玻璃 |
KR20220044538A (ko) | 2019-08-06 | 2022-04-08 | 코닝 인코포레이티드 | 균열을 저지하기 위한 매장된 응력 스파이크를 갖는 유리 적층물 및 이를 제조하는 방법 |
US11764101B2 (en) * | 2019-10-24 | 2023-09-19 | ASM IP Holding, B.V. | Susceptor for semiconductor substrate processing |
CN114378751B (zh) * | 2020-10-20 | 2022-11-01 | 长鑫存储技术有限公司 | 晶圆用承载环的安装夹具 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468259A (en) * | 1981-12-04 | 1984-08-28 | Ushio Denki Kabushiki Kaisha | Uniform wafer heating by controlling light source and circumferential heating of wafer |
EP0405301A2 (en) * | 1989-06-29 | 1991-01-02 | Applied Materials, Inc. | Apparatus for handling semiconductor wafers |
US5162047A (en) * | 1989-08-28 | 1992-11-10 | Tokyo Electron Sagami Limited | Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers |
WO1998001890A1 (en) * | 1996-07-08 | 1998-01-15 | Advanced Semiconductor Materials International N.V. | Method and apparatus for contactless treatment of a semiconductor substrate in wafer form |
EP0821403A2 (en) * | 1996-07-24 | 1998-01-28 | Applied Materials, Inc. | Semiconductor wafer support with graded thermal mass |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947236A (en) | 1971-11-29 | 1976-03-30 | Lasch Jr Cecil A | Fluid bearing transfer and heat treating apparatus and method |
NL8103979A (nl) | 1981-08-26 | 1983-03-16 | Bok Edward | Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat. |
NL8203318A (nl) | 1982-08-24 | 1984-03-16 | Integrated Automation | Inrichting voor processing van substraten. |
JPS6074626A (ja) | 1983-09-30 | 1985-04-26 | Fujitsu Ltd | ウエハー処理方法及び装置 |
FR2596070A1 (fr) | 1986-03-21 | 1987-09-25 | Labo Electronique Physique | Dispositif comprenant un suscepteur plan tournant parallelement a un plan de reference autour d'un axe perpendiculaire a ce plan |
KR930002562B1 (ko) | 1986-11-20 | 1993-04-03 | 시미즈 겐세쯔 가부시끼가이샤 | 클린룸내에서 사용되는 방진저장 캐비넷장치 |
JPS63136532A (ja) | 1986-11-27 | 1988-06-08 | Nec Kyushu Ltd | 半導体基板熱処理装置 |
US5000113A (en) * | 1986-12-19 | 1991-03-19 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
US5788425A (en) | 1992-07-15 | 1998-08-04 | Imation Corp. | Flexible system for handling articles |
US5592581A (en) * | 1993-07-19 | 1997-01-07 | Tokyo Electron Kabushiki Kaisha | Heat treatment apparatus |
FI97731C (fi) | 1994-11-28 | 1997-02-10 | Mikrokemia Oy | Menetelmä ja laite ohutkalvojen valmistamiseksi |
JP3218164B2 (ja) | 1995-05-31 | 2001-10-15 | 東京エレクトロン株式会社 | 被処理体の支持ボート、熱処理装置及び熱処理方法 |
JPH0992625A (ja) | 1995-09-20 | 1997-04-04 | Tokyo Electron Ltd | 熱処理用ボ−ト |
KR100443415B1 (ko) | 1996-02-23 | 2004-11-03 | 동경 엘렉트론 주식회사 | 열처리장치 |
US6133550A (en) * | 1996-03-22 | 2000-10-17 | Sandia Corporation | Method and apparatus for thermal processing of semiconductor substrates |
JPH09320977A (ja) * | 1996-05-29 | 1997-12-12 | Dainippon Screen Mfg Co Ltd | 基板の接触式温度測定装置 |
US6183565B1 (en) * | 1997-07-08 | 2001-02-06 | Asm International N.V | Method and apparatus for supporting a semiconductor wafer during processing |
KR19980016446U (ko) * | 1996-09-18 | 1998-06-25 | 문정환 | 반도체 포토장비의 웨이퍼 척 |
KR100250636B1 (ko) * | 1996-11-13 | 2000-05-01 | 윤종용 | 반도체 장치 제조용 가열챔버의 원형 가열판 |
US5983906A (en) * | 1997-01-24 | 1999-11-16 | Applied Materials, Inc. | Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment |
US5879459A (en) | 1997-08-29 | 1999-03-09 | Genus, Inc. | Vertically-stacked process reactor and cluster tool system for atomic layer deposition |
US6325858B1 (en) * | 1997-11-03 | 2001-12-04 | Asm America, Inc. | Long life high temperature process chamber |
JPH11176822A (ja) * | 1997-12-05 | 1999-07-02 | Hitachi Ltd | 半導体処理装置 |
US6280183B1 (en) * | 1998-04-01 | 2001-08-28 | Applied Materials, Inc. | Substrate support for a thermal processing chamber |
US6228173B1 (en) * | 1998-10-12 | 2001-05-08 | Tokyo Electron Limited | Single-substrate-heat-treating apparatus for semiconductor process system |
US6168668B1 (en) * | 1998-11-25 | 2001-01-02 | Applied Materials, Inc. | Shadow ring and guide for supporting the shadow ring in a chamber |
NL1011017C2 (nl) * | 1999-01-13 | 2000-07-31 | Asm Int | Inrichting voor het positioneren van een wafer. |
US6228171B1 (en) * | 1999-01-29 | 2001-05-08 | Tokyo Electron Ltd. | Heat processing apparatus |
NL1011487C2 (nl) * | 1999-03-08 | 2000-09-18 | Koninkl Philips Electronics Nv | Werkwijze en inrichting voor het roteren van een wafer. |
NL1011856C2 (nl) * | 1999-04-21 | 2000-10-24 | Asm Internat B V | Floating wafer reactor alsmede werkwijze voor het regelen van de temperatuur daarvan. |
US6100505A (en) * | 1999-05-27 | 2000-08-08 | Advanced Micro Devices, Inc. | Hotplate offset ring |
US6347919B1 (en) * | 1999-12-17 | 2002-02-19 | Eaton Corporation | Wafer processing chamber having separable upper and lower halves |
NL1013938C2 (nl) * | 1999-12-23 | 2001-06-26 | Asm Int | Inrichting voor het behandelen van een wafer. |
JP3567855B2 (ja) * | 2000-01-20 | 2004-09-22 | 住友電気工業株式会社 | 半導体製造装置用ウェハ保持体 |
NL1015397C2 (nl) * | 2000-06-07 | 2001-12-10 | Asm Int | Inrichting voor het behandelen van een wafer. |
US6559039B2 (en) * | 2001-05-15 | 2003-05-06 | Applied Materials, Inc. | Doped silicon deposition process in resistively heated single wafer chamber |
JP3825277B2 (ja) * | 2001-05-25 | 2006-09-27 | 東京エレクトロン株式会社 | 加熱処理装置 |
US6776849B2 (en) * | 2002-03-15 | 2004-08-17 | Asm America, Inc. | Wafer holder with peripheral lift ring |
-
1999
- 1999-05-07 NL NL1012004A patent/NL1012004C2/nl not_active IP Right Cessation
-
2000
- 2000-05-08 AU AU46260/00A patent/AU4626000A/en not_active Abandoned
- 2000-05-08 WO PCT/NL2000/000297 patent/WO2000068977A1/en active IP Right Grant
- 2000-05-08 US US10/009,851 patent/US7048488B1/en not_active Expired - Lifetime
- 2000-05-08 DE DE60030968T patent/DE60030968T2/de not_active Expired - Lifetime
- 2000-05-08 EP EP00927958A patent/EP1177571B1/en not_active Expired - Lifetime
- 2000-05-08 KR KR1020017014141A patent/KR100667718B1/ko active IP Right Grant
- 2000-05-08 CN CNB008072035A patent/CN1157761C/zh not_active Expired - Lifetime
- 2000-05-08 JP JP2000617480A patent/JP4632551B2/ja not_active Expired - Lifetime
- 2000-06-05 TW TW089110988A patent/TW452840B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4468259A (en) * | 1981-12-04 | 1984-08-28 | Ushio Denki Kabushiki Kaisha | Uniform wafer heating by controlling light source and circumferential heating of wafer |
EP0405301A2 (en) * | 1989-06-29 | 1991-01-02 | Applied Materials, Inc. | Apparatus for handling semiconductor wafers |
US5162047A (en) * | 1989-08-28 | 1992-11-10 | Tokyo Electron Sagami Limited | Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers |
WO1998001890A1 (en) * | 1996-07-08 | 1998-01-15 | Advanced Semiconductor Materials International N.V. | Method and apparatus for contactless treatment of a semiconductor substrate in wafer form |
EP0821403A2 (en) * | 1996-07-24 | 1998-01-28 | Applied Materials, Inc. | Semiconductor wafer support with graded thermal mass |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6877250B2 (en) * | 1999-12-29 | 2005-04-12 | Asm International N.V. | Apparatus, method and system for the treatment of a wafer |
Also Published As
Publication number | Publication date |
---|---|
KR100667718B1 (ko) | 2007-01-15 |
TW452840B (en) | 2001-09-01 |
DE60030968T2 (de) | 2007-05-03 |
CN1349656A (zh) | 2002-05-15 |
CN1157761C (zh) | 2004-07-14 |
DE60030968D1 (de) | 2006-11-09 |
US7048488B1 (en) | 2006-05-23 |
KR20010112476A (ko) | 2001-12-20 |
EP1177571A1 (en) | 2002-02-06 |
JP2002544664A (ja) | 2002-12-24 |
AU4626000A (en) | 2000-11-21 |
EP1177571B1 (en) | 2006-09-27 |
WO2000068977A1 (en) | 2000-11-16 |
JP4632551B2 (ja) | 2011-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL1012004C2 (nl) | Werkwijze voor het verplaatsen van wafers alsmede ring. | |
CN105378142B (zh) | 用于溅射系统的玻璃托盘 | |
KR102104688B1 (ko) | 태양 전지 제조를 위한 이중 마스크 장치 | |
NL1022210C2 (nl) | Systeem voor het vervaardigen van halfgeleiderproducten. | |
KR101533138B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
KR101018850B1 (ko) | 고온 열처리를 위한 서셉터 플레이트 | |
KR100815574B1 (ko) | 침지 처리 시스템에서 한 세트의 반도체 웨이퍼를 핸들링하는 에지 파지장치 및 방법 | |
US20030177790A1 (en) | Method and device for storing and transporting flat glass in a contactless manner | |
JP6249586B2 (ja) | ワーク分割装置及びワーク分割方法 | |
NL1034780C2 (nl) | Inrichting voor het laagsgewijs laten neerslaan van verschillende materialen op een halfgeleider-substraat alsmede een hefpin voor toepassing in een dergelijke inrichting. | |
KR100419812B1 (ko) | 열처리장치및공정 | |
EP0978867A2 (en) | Heating device of the light irradiation type and holding device therefor | |
KR20130103604A (ko) | 기판 열처리 기구 | |
KR102002210B1 (ko) | 기판 반송 기구의 세정 방법 및 기판 처리 시스템 | |
KR102220348B1 (ko) | 웨이퍼 분리 장치 | |
KR101501322B1 (ko) | 열처리 장치 | |
CN110880466A (zh) | 晶片舟 | |
JP2004286425A (ja) | 線材を用いた搬送機構並びにそれを使用した熱処理炉及び熱処理方法 | |
JP2000177013A (ja) | 溶着部品のアニール装置及びアニール方法 | |
JP2020061434A (ja) | 基板冷却装置及び基板冷却方法 | |
CN111048444A (zh) | 加热板冷却方法和基板处理装置及方法 | |
KR20040002456A (ko) | 기판 지지구조와 그 적재장치 및 로봇 핸드 | |
KR102360141B1 (ko) | 기판 처리 장치 및 방법 | |
KR101942511B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
JP6739417B2 (ja) | 熱処理設備 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PD2B | A search report has been drawn up | ||
VD1 | Lapsed due to non-payment of the annual fee |
Effective date: 20031201 |