MY204833A - Actuator for a bonding head - Google Patents

Actuator for a bonding head

Info

Publication number
MY204833A
MY204833A MYPI2020006742A MYPI2020006742A MY204833A MY 204833 A MY204833 A MY 204833A MY PI2020006742 A MYPI2020006742 A MY PI2020006742A MY PI2020006742 A MYPI2020006742 A MY PI2020006742A MY 204833 A MY204833 A MY 204833A
Authority
MY
Malaysia
Prior art keywords
bonding head
substrate
tilt correction
actuator
tilt
Prior art date
Application number
MYPI2020006742A
Other languages
English (en)
Inventor
Markus Aebischer
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of MY204833A publication Critical patent/MY204833A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75822—Rotational mechanism
    • H01L2224/75823—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
    • H01L2224/75824—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75841—Means for moving parts of the bonding head
    • H01L2224/75842—Rotational mechanism
    • H01L2224/75843—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
MYPI2020006742A 2018-06-23 2019-06-23 Actuator for a bonding head MY204833A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (1)

Publication Number Publication Date
MY204833A true MY204833A (en) 2024-09-18

Family

ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2020006742A MY204833A (en) 2018-06-23 2019-06-23 Actuator for a bonding head

Country Status (8)

Country Link
US (1) US12230599B2 (enExample)
JP (1) JP7333391B2 (enExample)
KR (1) KR102800366B1 (enExample)
CN (1) CN113169091B (enExample)
DE (1) DE102018115144A1 (enExample)
MY (1) MY204833A (enExample)
SG (1) SG11202012866TA (enExample)
WO (1) WO2019244136A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH10107495A (ja) 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
DE502006008968D1 (de) * 2006-10-31 2011-04-07 Kulicke & Soffa Die Bonding Gmbh Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat zeugs relativ zu einem substrat
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
WO2014098174A1 (ja) * 2012-12-21 2014-06-26 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP6422499B2 (ja) 2014-08-13 2018-11-14 株式会社新川 実装装置および測定方法
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

Also Published As

Publication number Publication date
CN113169091B (zh) 2024-12-17
WO2019244136A3 (de) 2020-03-12
CN113169091A (zh) 2021-07-23
KR102800366B1 (ko) 2025-04-25
US12230599B2 (en) 2025-02-18
JP7333391B2 (ja) 2023-08-24
SG11202012866TA (en) 2021-02-25
KR20210022050A (ko) 2021-03-02
DE102018115144A1 (de) 2019-12-24
JP2021529441A (ja) 2021-10-28
WO2019244136A9 (de) 2020-05-07
WO2019244136A8 (de) 2020-12-03
US20210272925A1 (en) 2021-09-02
WO2019244136A2 (de) 2019-12-26

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