Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
  • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/757—Means for aligning
  • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/758—Means for moving parts
  • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
  • H01L2224/75822—Rotational mechanism
  • H01L2224/75823—Pivoting mechanism
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/758—Means for moving parts
  • H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
  • H01L2224/75824—Translational mechanism
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/758—Means for moving parts
  • H01L2224/75841—Means for moving parts of the bonding head
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/758—Means for moving parts
  • H01L2224/75841—Means for moving parts of the bonding head
  • H01L2224/75842—Rotational mechanism
  • H01L2224/75843—Pivoting mechanism
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
  • H01L2224/759—Means for monitoring the connection process
  • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding

Definitions

• the present invention relates to a method for mounting components on a substrate, which is provided at a substrate position according to claim 1, and a device for mounting
• component used in the claims relates to electronic and / or optical components, in particular to semiconductor chips (also called this) on a substrate.
• the components are assembled in the semiconductor industry with the help of semiconductor automatic assembly machines, which are known to the person skilled in the art as “die bonders” or automatic assembly machines.
• the components are often semiconductor chips that can be placed and bonded on predefined substrate positions on different substrates.
• the components are picked up by a transducer, such as a clamping gripper or a suction element.
• the transducer is moved over the substrate and the components are attached to the
• the transducer can be mounted on a bonding head so that it can rotate about its longitudinal axis.
• the bondhead is attached to a pick-and-place system that the
• the Z direction corresponds to the vertical direction
• the XY plane forms the horizontal plane.
• the aim of the invention is to enable improved tilt control when placing components from a substrate.
• the object of the invention is to provide a possibility of controlling the inclination that is simple and inexpensive to produce, which, while maintaining simple handling, is as long-lasting and almost wear-free as possible
• a method for mounting components on a substrate which is provided on a substrate base at a substrate position, is provided.
• the method comprises the following envisaged steps: providing one Bond head, which is relative to the substrate along a first Bond head, which is relative to the substrate along a first Bond head, which is relative to the substrate along a first Bond head, which is relative to the substrate along a first Bond head, which is relative to the substrate along a first Bond head, which is relative to the substrate along a first
• Movement axis and a second movement axis is displaceable, the second movement axis being substantially perpendicular to the first movement axis;
• Receiving element with a contact surface wherein the pick-up is arranged on the bonding head, and wherein the contact surface is designed and arranged such that it can be releasably or releasably arranged on the components, and the contact surface is further designed and arranged such that it is around the first Axis of movement is rotatable;
• Adjustment position for rigid engagement with the first engagement element Moving the bond head into the first adjustment position; bringing the first engagement element into rigid engagement with the first adjustment element;
• the bondhead Moving the bondhead to the substrate position, the bondhead maintaining the rotation of the contact surface about the second axis of movement.
• the complexity of the bonding head (and all parts or elements attached to it) can be reduced - this can in particular reduce the costs for the device itself.
• the weight can be reduced, so that the bonding head (and all parts or elements attached to it) can move significantly faster than is possible with conventional devices.
• the tilt correction can only be done according to mechanical principles - such passive embodiments provide a high degree of complexity and / or weight reduction.
• Attachment of components provided on a substrate wherein the method further comprises the following steps provided: forming and arranging the bondhead to be displaceable relative to the substrate along a third axis of movement, the third
• Axis of movement is; Forming and arranging the contact surface so that it is rotatable about the third axis of movement; after rigidly engaging the first engaging element with the first adjusting element, displacing the bonding head along the first movement axis or along the second movement axis or along the third
• the components are preferably mounted plane-parallel to the substrate at the substrate position - by providing the required degrees of inclination around two axes of movement, the risk of an inclination problem in operation can be significantly reduced.
• Attachment of components provided on a substrate wherein the method further comprises the following steps provided: forming and arranging the bondhead to be displaceable relative to the substrate along a third axis of movement, the third
• Axis of movement substantially perpendicular to the first Axis of movement and substantially perpendicular to the second
• Axis of movement is; Forming and arranging the contact surface so that it is rotatable about the third axis of movement; Providing a second engagement element which is arranged on the bonding head; Providing a second adjustment element in a second adjustment position, the second adjustment element being configured and arranged such that it is rigidly engaged with the second engagement element; Moving the
• Bond head in the second adjustment position; bringing the second engagement element into rigid engagement with the second adjustment element; Moving the bondhead along the first axis of movement or along the second axis of movement or along the third axis of movement relative to the second adjusting element, the contact surface being around the third
• Axis of motion rotates; Releasing the second engagement element from the second adjustment element; and moving the bondhead to
• Substrate position wherein the bond head maintains the rotation of the contact surface about the third axis of movement.
• Adjusting elements and adjusting positions a preferred implementation of the invention can be achieved in such a way that even the time required to go from the setting of the first inclination to the setting of the second inclination can be significantly reduced.
• the bondhead is configured and arranged to rotate the contact surface using an elastic element, a spring element, a magnetic element, an electrical element, an electromagnetic element, a vacuum element, a gas-powered element, a friction element Hydraulic element, an inductive element, or any combination thereof maintains.
• a preferred method for acquiring position data further comprises the following intended steps: providing an inclination measuring device which is designed and arranged such that it rotates the contact surface about the first and / or the second movement axis and / or about measures the third axis of motion; Providing a processor which is designed and arranged in such a way that it determines the degree of displacement along the first movement axis, about a desired rotation about the first and / or the second movement axis and / or about the third
• Get axis of motion and a further embodiment and arrangement of the processor to stop the displacement along the first axis of movement when the desired inclination of the contact surface is reached.
• a preferred method for acquiring position data further comprises the following intended steps: providing an inclination sensor which is designed and arranged such that it measures an inclination of the substrate; and providing a processor configured and arranged to determine the degree of displacement along the first axis of movement about a desired rotation about the first and / or second axis of movement and / or about the third axis of movement below
• a preferred method for detecting temperatures further comprises the following intended steps:
• Providing a temperature sensor which is designed and arranged such that it detects a temperature and / or a respective temperature of the
• a preferred method for detecting temperatures further comprises the following intended steps:
• Providing a temperature sensor which is designed and arranged such that it detects a temperature and / or a respective temperature of the
• the substrate (160) and / or the substrate base and providing a processor configured and arranged to determine the degree of displacement along the first axis of movement by a desired rotation about the first and / or the second and / or to get the third axis of movement using the measured temperature of the substrate.
• the temperature measurement is carried out by means of temperature sensors and / or a non-contact temperature measurement by means of radiation, for example laser-based or infrared-based temperature measurement.
• a preferred method for controlling the rotation of the contact surface of the pickup further comprises the following intended steps: measuring the inclination and / or rotation of the bonding head and / or to the contact surface and / or a bonded component relative to the substrate, wherein at least the position of the bondhead can be optically detected by means of a reference mark; Determining a compensation variable for compensation of the inclination and / or rotation from the measurements; Moving the bondhead to a first position to be compensated with the compensation size; rigidly engaging the first engaging member with the first adjustment; Performing a first compensation; Moving the bondhead to a second position to be compensated with the compensation size; bring the second engagement element into rigid engagement with the first adjustment element; Perform a second compensation.
• the tilt that is to say the inclination and / or rotation of the bonding head relative to the substrate is preferably measured using an optical image recognition method, one, preferably optical,
• Reference mark for example a so-called feducial attached to the bond head, is captured by a camera and used for referencing. In this way, advantageous continuous monitoring is also possible during the movements during the assembly. This provides a situation-related compensation, for example due to mechanical play or simple error propagation of mechanical deviations.
• a device for fastening components on a substrate is provided.
• a preferred embodiment of a device for mounting components on a substrate which is provided on a substrate position, comprises a bonding head which is displaceable relative to the substrate along a first movement axis and a second movement axis, the second movement axis being substantially perpendicular to the first movement axis stands; a pickup with a contact surface, the pickup being arranged on the bonding head, and the contact surface being designed and arranged such that it is detachable or can be releasably arranged on components, and the contact surface is further designed and arranged such that it is around the first
• Axis of movement is rotatable; a first engaging member disposed on the bondhead; a first adjustment element in a first adjustment position for rigid engagement with the first engagement element.
• a device for mounting components on a substrate comprise a bonding head which is displaceable into the first adjustment position, the first engagement element being rigidly engaged with the first adjustment element; wherein during the engagement the bondhead can be displaced relative to the first adjusting element along the first movement axis or along the second movement axis, and the contact surface rotates about the first movement axis.
• preferred embodiments of a device comprise a first engagement element, which can be detached or detached from the first adjusting element.
• preferred embodiments of a device comprise a bonding head which is displaceable to the substrate position, the
• Contact surface is designed and arranged so that it maintains the rotation about the first axis of movement.
• the bonding head is further developed and arranged to be relative to the substrate along a third
• Movement axis to be displaceable the third movement axis being substantially perpendicular to the first movement axis and in
• the contact surface is further designed and arranged such that it can be rotated about the third axis of movement.
• the first engagement element is further developed and arranged around the bonding head along the first
• the bonding head is further developed and arranged to rotate the contact area about the third
• the bonding head is further developed and arranged to be relative to the substrate along a third
• Movement axis to be displaceable the third movement axis being substantially perpendicular to the first movement axis and in
• the contact surface is further arranged so that it can be rotated about the third axis of movement, the device further comprising a second engagement element which is on the
• Bond head is arranged, and a second adjustment element in a second adjustment position, wherein the second adjustment element is designed and arranged such that it is rigidly engaged with the second engagement element, wherein the bond head is also displaceable in the second adjustment position, wherein the second engagement element is rigid is engaged with the second adjusting element, and the bonding head along the first axis of movement or along the second axis of movement or along the third
• Axis of movement is displaceable relative to the second adjusting element, wherein the contact surface rotates about the third movement axis, and the second engagement element is detachable or releasable from the second adjustment element, and the bonding head is further designed and arranged to maintain the rotation of the contact surface about the third movement axis after detachment from the second adjustment element, includes.
• Figure 1 shows an embodiment of a device for mounting components in the sense of the invention
• Figure 2 shows an example of a bondhead configured and arranged to rotate about a second axis of motion
• FIGS. 3A to 3D show the use of the configuration and arrangement from FIG. 2 for the mounting of components on a substrate
• FIGS. 4A and 4B represent a modified variant of the embodiment shown in FIG. 2;
• FIG. 5 illustrates a method for mounting components on a substrate in the sense of the invention;
• Figure 6 shows a further embodiment for the inclination adjustment with a combination of rack and pinion as engagement
• FIG. 7 shows a further embodiment of the invention as a combination of toothed rack and pinion as an engagement and adjustment element at two adjustment positions.
• FIG. 1 shows a preferred embodiment of a device 100 for mounting components 150 in the form of a
• Assembly device 100 e.g. a die bonder or one
• the method 200 is used to mount electronic or optical components 150 (not shown), in particular semiconductor chips, on a substrate 160
• Placement device 100 comprises a movable bonding head 110, on which a pick-up 180 as a receiving element, such as e.g. a suction element or a clamping gripper is attached.
• the mounting device 100 further comprises a substrate base 190, on which the substrate 160 rests and is held.
• the placement device 100 is configured and arranged such that the bond head 110 and / or the pickup 180 is displaced relative to the substrate 160 along a first movement axis 170, which is shown here as an essentially vertical direction or Z direction.
• the device is typically configured and arranged in such a way that a longitudinal axis 140 of the bonding head 110 and / or the pickup 180 essentially coincides with the essentially vertical direction or Z direction 170.
• the placement device 100 is further configured and arranged such that the bond head 110 and / or the pickup 180 can be displaced relative to the substrate 160 along a second movement axis 175, here shown as an essentially horizontal or X direction.
• the second axis of movement 175 is substantially perpendicular to the first axis of movement 170.
• the placement device 100 is further configured and arranged such that the bonding head 110 and / or the pickup 180 relative to the substrate 160 along a third movement axis 177, here as in FIG Shown essentially horizontal direction or Y direction, can be shifted.
• the third movement axis 177 extends essentially perpendicular to the first movement axis 170 and also essentially perpendicular to the second movement axis 175
• Device 100 spans the XY plane from the second movement axis 175 and the third 177 movement axis.
• the configuration of the device 100 typically uses electrically and / or pneumatically driven axes for movement to provide the relative movement, with the pickup 180 and / or the substrate 160 configured and arranged to be along one or more movement axes 170, 175 , 177 moves. Since a relative movement is required, the movement for the
• Substrate base 190 for the pickup 180, for the contact area 185, for the bondhead 110, an attachment point of the bondhead 110 to the rest of the device 100, or any combination thereof.
• Such an axis of movement 170, 175, 177 can consist of a guide (not shown) and a movable part, e.g. a slide movable in the guide.
• the carriage can be stored in different ways, e.g. through an air bearing or a ball bearing.
• One or more combinations of guide carriages can be provided at different locations in the device 100 for each movement axis.
• Each axis of movement can also consist of one or more drives (not shown) to move the associated carriage along the associated guide
• a relative displacement between the bondhead 110 and the pickup 180 as a receiving element can also be provided in one or more movement axes 170, 175, 177.
• the device 100 can be configured to allow relative rotation between the pickup 80 and the bondhead 110 about its longitudinal axis 140. A bearing of the
• Sensor 180 can be provided on the bondhead 110.
• the pickup 180 consists of a contact surface 185 (not shown) for releasable or releasable attachment to components 150 during the positioning on the substrate 160 on one
• the contact area 185 is typically used to monitor the movement of the device during one or more
• Contact surface 185 is used, wherein each step can use a further contact surface 185 depending on the type of bonding.
• the bondhead 110 and the pickup 180 are connected to one another and the pickup 180 comprises the contact area 185, it is obvious to the person skilled in the art that the position of the contact area 185 is derived from the position of the bondhead 110 and / or the pickup 180 with corresponding conversion rules can or vice versa.
• the components 150 are preferably positioned essentially parallel to the substrate 160 at their respective substrate positions 165.
• the components 150 are preferably positioned in an XY plane that is essentially plane-parallel to the XY plane in which the substrate position 165 lies. Deviations from the plane-parallel state are referred to as inclination, respectively tilting or twisting - inclined, respectively twisted or tilted positioning of the
• Components 150 can cause undesirable properties such as reduced holding force and / or adhesive force, inadequate or missing electrical Contact, irregular heat transfer between the components 150 and the substrate 160 or damage the components 150. Shear forces can cause the components 150 to slip, which under certain circumstances can lead to a positioning error. In extreme cases, the components may not function properly, be defective or have a reduced reliability.
• the device 100 is further configured and arranged such that the bond head 110 and / or the pickup 180 can be rotated relative to the substrate 160 about at least one horizontal axis - the second 175 and / or the third movement axis 177 ,
• the highest level of control is achieved by many degrees of movement and rotation (degrees of freedom), but this typically increases the complexity of the device 100.
• the orientation of the contact surface 185 relative to the substrate 160 can be controlled with this one or more angles of rotation in order to minimize deviations in inclination.
• Each degree of rotation requires one or more drives or actuators.
• a measuring system e.g. one or more measuring devices may be required to ensure the required accuracy and control. Since a relative movement is required, the
• Rotation can be configured for the substrate base 190, for the pickup 180, for the bondhead 110, for the contact area 185, one
• Maximum speed typically measured in UPH (in English: Units Per Hour; in German: Units per hour), may limit or require more powerful drives to compensate for the increased inertia.
• the size of the bondhead 110 and / or the pickup 180 can also increase as elements are added.
• Tilt adjustment implemented with several actuators and encoders.
• Inclination adjustment is provided, which enables an automatic adjustment while minimizing the weight and / or increase in size of the bondhead 110 and / or the pickup 180.
• the set-up time can be shortened, which increases the operating time of the device 100.
• FIG. 2 shows an example of a bond head 110, which is arranged so as to be rotatable about the second movement axis 175.
• the left view in FIG. 2 schematically shows the bond head 110 and the pickup 180 - its longitudinal axis 140 is also shown in order to illustrate the possible relative rotation.
• the coordinate system is shown on the right-hand side - the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally.
• the bondhead 110 is viewed along the second axis of motion 175 (X) in this example, i.e. the second axis of movement 175 (X) goes into the page (paper plane).
• the bondhead 110 is around the second
• Movement axis 175 (X) is configured and arranged rotatably - in this example, the bondhead 110 is via a bondhead attachment 105 pivotally connected to the rest of the device 100, which enables rotation about the pivot point 115.
• the device 100 also consists of a first one
• Engagement element 120 which is fastened to the bond head 110 and a first adjustment element 130 (shown in FIG. 1) at a first adjustment position 132 (shown in FIG. 1) for rigid engagement with the first
• the first adjustment position 132 can be located at any point that the bondhead 110 can reach with the available axes of movement or degrees of freedom.
• the device 100 is further configured and arranged such that the bonding head 110 can be displaced into the first adjustment position 132, the first engagement element 120 rigidly engaging in the first adjustment element 130.
• Adjustment element 130 configured and arranged so that they can be switched on and off rigidly.
• the first engagement element 120 and the first adjustment element 130 form the first engagement pair.
• You can e.g. as a pair of racks, ball socket, flakes and guide, bolt and groove, protrusion and recess, bolt and hole pair, north and south
• Magnetic poles or overhang and clamp pair are executed. Several pairs of interventions can also be used.
• Each pair of interventions can optionally be configured so that only mechanical principles are used.
• This passive design can avoid additional weight and complexity through electrical or pneumatic supply and / or drives.
• Engaging couple can exchange their mechanical configuration without affecting the functionality of the pair.
• a Rack as an engagement element in combination with a pinion as
• Adjustment element or a rack can be included as an adjustment element in combination with a pinion as an engagement element.
• Rigidly locked means that the intervention is of sufficient rigidity and duration to make the required tilt adjustment
• the first engaging element 120 shown in FIG. 2 is a
• Dowel pin selected to rigidly engage a groove (not shown).
• the device 100 is further configured and arranged such that the bond head 110 is displaceable relative to the first adjustment position during the engagement along the first movement axis 170, the
• Contact surface 185 rotates about the second movement axis 175; and after the release of the first engagement element 120 from the first adjustment element 130, the bonding head 110 is displaceable into the substrate position 165 and that
• Contact surface 185 is configured and arranged in such a way that the rotation about the second movement axis 175 is retained.
• a tilt position block 117 is provided in order to maintain the rotation about the second movement axis 175 - that is to say the inclination adjustment about the second movement axis 175.
• the tilt position block 117 can also be viewed as blocking an undesired tilt movement about the second movement axis 175.
• Any common motion lock can be used, such as a friction brake, a hydraulic brake, a pneumatic brake, a screw thread, an electromagnetic brake, an electric brake, an induction brake Screw drive, a magnetic brake or any combination of these.
• a resilient element can also be used to create adequate preload.
• the tilt position block 117 can be configured to use only mechanical principles. This passive
• Execution can avoid additional weight and complexity through electrical or pneumatic supply and / or drives.
• the device 100 is configured and arranged such that the bond head 110 can rotate about the pivot point 115 (and about the second movement axis 175) when a corresponding force is applied along the tip (distal end) of the first engagement element 120 the first movement axis 170 is exercised.
• the inclination of the contact surface 185 is advantageously set or set before the components 150 are mounted on the substrate 160, so that the inclination of the contact surface 185 in the
• Substrate position 165 shows a configuration and arrangement for controlling the inclination of the bondhead 10, the inclination set and / or the setting is selected such that the required inclination of the contact surface 185 is achieved.
• FIG. 2 shows the pickup 180, which is attached to the end of the bonding head 110 and works closest to the substrate 160.
• the pickup 180 consists of the contact surface 185 at the end of the pickup 180 farthest from the bondhead 110.
• the inclination values of the bond head 110 can be easily converted and vice versa. As an alternative or in addition, such conversion values can be measured using a suitable calibration method.
• Tilt lock can be provided in the pickup 180 or even in the support surface 185.
• the use of a large number of functions for tilt adjustment and tilt locking is also provided, so that rough and / or fine adjustment is possible.
• FIG. 3 shows the use of the configuration and arrangement of FIG. 2 for the assembly of components on a substrate according to the method 200 of the invention. The possible steps of the method are also shown in FIG. 5.
• FIG. 3A shows the same view of that shown in Figure 2
• Bond head 110 and the same coordinate system.
• the bond head 110 is shifted by 250 into the first adjustment position 132.
• the first engagement element 120 and the first adjustment element 130 are located close to one another.
• the first engagement element 120 then becomes with the first
• Adjustment element 130 rigidly engaged. The actions required depend, among other things, on the configuration and arrangement of the first
• the device 100 can be configured and arranged such that a rigid engagement 260 takes place as a direct result of the displacement of the bonding head 110 into the first adjustment position 132.
• a sequence of movements along the available movement axes 170, 175, 177 after the first pair of interventions 120, 130 is close to each other.
• the embodiment of Figure 3 requires a pin contained in the engagement member 120 to fit into a groove penetrate into the adjusting element 130. As shown, both the pin 120 and the groove 130 extend along the second axis of movement 175 into the paper plane. The engagement can therefore take place by moving the bonding head 110 into a first adjustment position 132, which is defined such that the pin 120 is positioned just above the groove 130, which is the
• the bondhead 110 can then be slid into the paper along the second axis of movement 175, whereby the pin 120 enters the groove 130.
• Rigid engagement 260 can then be accomplished by appropriately selecting the mechanical tolerances of pin 120 and groove 130 and maintaining a fixed position along second movement axis 175 when tilt 270 is adjusted (see below).
• a clamp can be used to ensure that the rigidity of the procedure is sufficient.
• the arrangement of the first pair of engagements 120, 130 is a pin 120 in a groove 130 which is at an angle of approximately 20 degrees to the first
• Movement axes 170 (Z) is arranged in a YZ plane.
• the third movement axis 170 is defined as Y. Movement of the bondhead 110 along the first movement axes 170 provides a force on the first engagement element 120 along the third
• Movement axes 177 As shown, an upward movement 170 provides a left force 177 and a downward movement 170 a right force 170.
• a groove with a larger angle, e.g. between 30 degrees and 60 degrees, can also be used.
• the device 100 is configured and arranged such that a force on the first engagement element 120 along the third movement axis 177 causes the bondhead 110 to rotate about the pivot point 115 (around the second movement axis 175).
• the device 100 is configured and arranged such that rotation of the bondhead 110 about the pivot point 115 (about the second
• Movement axis 175) causes a rotation (or inclination) of the contact surface 185 about the second movement axis 175.
• the invention provides for an inclination of the contact surface 185 with the drives and actuators already present for the displacement of the bonding head along the movement axes 170, 175, 177. There are no additional drives and / or actuators for this inclination
• Figure 3C shows the rotation of the bondhead 110 against the
• the first engagement element 120 is then decoupled from the first adjustment element 130.
• the tilt (rotation about the second axis of movement 175) is maintained by the tilt position block 117.
• the bondhead 110 can be set to any inclination value in the range of
• Tilt mechanism can be set by simply applying the appropriate force on the engaging member 120 - there are no others
• Tilt position block 117 provides multiple degrees of lock, it may be advantageous to provide less lock during rotation of the bondhead 110 and more lock before releasing the first
• the tilt position block 117 can be configured and arranged such that it has a higher degree of blocking when the bond head 110 moves out when it is disengaged 280.
• the bond head 110 After disengaging 280, the bond head 110 is moved into the respective substrate position 165 on the substrate 160. As in Figure 3D the bondhead 110 has the rotation about the second
• the bonding head 110 reaches the respective substrate position 165 when the contact surface 185 is located directly above the position on the substrate at which the respective component 150 is to be mounted. Depending on the inclination setting, the expected position can therefore be corrected.
• a component 150 is on the
• device 100 may be configured to perform the incline adjustment while device 150 is attached to contact surface 185.
• the device 100 is configured such that a displacement along at least one movement axis 170, 175, 177 results in an inclination of the contact surface 185; and the intended inclination remains when the components are assembled
• the invention is based on the knowledge that an inclination correction is possible with existing drives and / or actuators that move along at least one of these movement axes 170, 175, 177
• device 100 can be configured and be arranged so that it uses motion along one axis of motion to cause rotation about another axis of motion
• the device 100 can also be configured and arranged to offer more than one tilt according to the invention.
• FIG. 4 shows a further embodiment of the invention, which represents a modified version of the embodiment shown in FIG. 2.
• FIG. 4A schematically shows the bond head 110 and the pickup 180.
• the coordinate system is shown on the right side - the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally.
• the bondhead 110 is viewed along the second axis of motion 175 (X) in this example, i.e. the second axis of movement 175 (X) goes to the side. From this point of view, the device 100 and the bond head 110 appear as shown in FIG. 2.
• the rotatability about the pivot point 115 and thus the second axis of movement 175 is the same.
• the differences are: the further bond head attachment 106 is modified compared to that shown in FIG.
• the bond head 110 can also be rotated about the third movement axis (see FIG. 4B below); and the further engagement element 122 is modified in comparison to FIG. 2 in such a way that it enables a rigid engagement which enables rotation about two axes.
• the further engaging element 122 consists of a ball (or something spherical) at its distal end.
• the associated further adjustment element 131 is on the first
• Adjustment position 132 is provided and can e.g. one accordingly
• a base is shown here, which is aligned along the third axis of movement 177.
• a rigid engagement can take place by displacing the bond head 110 into the first adjustment position 132, so that the ball at the distal end of the further engagement element 122 is aligned along the first 170 and second 175 movement axes, followed by a displacement along the third movement axes 177 Turn around
• FIG. 4B schematically shows the bonding head 110 and the pickup 180.
• the coordinate system is shown on the right side - the first movement axis 170 (Z) is shown vertically and the second movement axis 175 (X) is shown horizontally.
• the bondhead 110 is viewed along the third movement axis 177 (Y) - in other words, the third movement axis 177 (X) comes out of the page (paper plane ⁇ .
• the bondhead 110 is also around the third movement axis 177 (Y) rotatably configured and arranged - the bondhead 110 is pivotally connected to the remaining device 100 via a further bondhead attachment 106, which also enables rotation about the further pivot point 116 and about the third movement axis 177.
• a further tilt position block 118 is between the further one
• Bondkopfbefestist 106 and the rest of the device 100 attached to the rotation about the third axis of movement 177 - that is
• the further tilt position block 118 can also be viewed as blocking undesired tilting movements about the third movement axis 177.
• the further tilt position block 118 can also be configured so that it only uses mechanical principles (passive
• the associated further adjustment element 131 at the first adjustment position 132 is shown in the third movement axis 177 - the socket 131 is here invisible and is therefore identified by a dashed line.
• the rigid engagement takes place in the same way as in FIG. 4A - displacement of the bond head 110 so that the ball 122 is aligned along the first 170 and second 175 movement axes, followed by a displacement along the third movement axes 177
• the device 100 is configured and arranged in such a way that the bondhead 110 can rotate: about the pivot point 115 (and about the second movement axis 175) if a corresponding force is exerted on the tip (distal end) of the further engagement element 121 is exercised along the first axis of movement 170; and around the further pivot point 116 (and around the third movement axis 177) when a corresponding force is exerted on the tip (distal end) of the further engagement element 121 along the second movement axis 175.
• the components 150 for the assembly process are preferably parallel to the substrate 160 at the substrate position 165 - the required inclination around two axes of movement reduces the risk that a tilt problem interrupts the operation of the device 100. It is obvious to those skilled in the art that various
• Configurations and movements can be used to ensure the same rotation.
• a single engagement element can also have more than one
• Adjustment element can be used at more than one snap-in position.
• a further sleeve can be provided at a further adjustment position. Adjustment positions are considered to be different if the rigid engagement cannot be maintained since the bondhead 110 is moved between these snap-in positions - for FIGS. 4A and 4B they are
• Adjustment positions are not considered different.
• the device 100 can be configured to offer at these different positions: tilt about the same axis of motion, different degrees of tilt about the same axis of motion, tilt about different axes of motion, different tilt directions about the same axis of motion, and any combination thereof.
• a single adjusting element can also have more than one
• Engagement element can be used at more than one adjustment position. Is e.g. If the bonding head 110 is provided with two spherical engagement elements, a socket can be provided in the device 100. There are two adjustment positions in the invention, since rigid engagement is not possible since the bond head 110 is moved between the two adjustment positions.
• the device 100 can be configured to offer at these different positions: tilt about the same axis of motion, different degrees of tilt about the same axis of motion, tilt about different axes of motion, different tilt directions about the same axis of motion, and any combination thereof.
• One or more engagement elements can also be used with one or more adjustment elements, which increases flexibility.
• FIG. 5 gives an overview of the method 200 for mounting components on a substrate in accordance with the invention.
• Procedure includes:
• Figure 6 shows an alternative embodiment for the
• Embodiments of the invention can be used.
• the bondhead 110 is arranged rotatably about the second movement axis 175, similar to that shown in FIG. 2.
• the left view in FIG. 6 schematically shows the bond head 110 and the pickup 180.
• the coordinate system is shown on the right side - the first movement axis 170 (Z) is shown vertically and the third movement axis 177 (Y) is shown horizontally.
• the bondhead 110 is viewed along the second axis of motion 175 (X) in this example, i.e. the second axis of movement 175 (X) goes to the side.
• the bondhead 110 is pivotally attached to the rest of the device 100 via a bondhead attachment 105, so that rotation about the pivot point 115 is possible.
• the engagement element 121 consists of a pinion which is arranged at its distal end. Internally, a conventional spindle drive (not shown) is attached to the pinion 121 so that rotation of the pinion causes the spindle drive to rotate. The screw drive is further attached to the bondhead 110 such that rotation of the
• Screw drive enables rotation of the bondhead 110 about the pivot point 115 and about the second axis of movement. This results in a rotation (inclination) of the contact surface 185 around the second
• the inclination adjustment mechanism further consists of an elastic element 119, which is attached between the bondhead 110 and the bondhead attachment 105. This ensures one
• Screw drive is preloaded - an alternative mechanism for blocking the tilt position.
• the rotation about the second movement axis 175 is blocked.
• the adjustment element provided in the first adjustment position 132 is a toothed rack 133, which is configured and arranged in such a way that it interacts with the pinion 121, so that rotation of the pinion 121 is possible.
• the rack 133 extends along the first movement axis 170.
• the engagement can be done by moving the bonding head 110 into the first adjustment position 132, so that the pinion at the distal end of the pinion 121 along the first 170, second 175 and third 177
• Axis of movement is aligned so that pinion 121 and rack 133 are close together.
• Movement axis 175 to the rack 133 ensures a rigid engagement.
• the available swivel range depends on the snap-in position of the pinion 121 in the first movement axes 170. If the range is not sufficient because the pinion reaches the end of the rack 133, the pinion 121 can be disengaged, moved to the other end of the rack 133 and rigidly coupled again become.
• the axis of movement 175 is held by the prestressing of the bonding head 110 against the screw drive by the elastic element 119.
• Suitable elastic elements 119 can e.g. Feathers,
• Bonding head 110 is provided, which can rotate about the second movement axis 175 and the third movement axis 177.
• the tilt adjustment and holding mechanism is the same as shown in Figure 6.
• the bond head consists of two pinions 121 - one of which is configured and arranged for rotation about the second movement axis 175 and the other for rotation about the third movement axis 177.
• the device 100 is configured and arranged such that it provides two toothed racks 133 - one at a first adjustment position 132 and the other at a second adjustment position 137.
• the rigid engagement in the first adjustment position 132 takes place by moving the bonding head 110 into the first adjustment position 132, so that the pinion at the distal end of the pinion 121 is aligned along the first 170, second 175 and third 177 movement axes, so that pinion 121 and rack 133 are close together.
• a displacement along the first movement axes 170 to the rack 133 ensures a rigid engagement.
• Axis of motion 175 at substantially equal positions along first 170 and third 177 axes of motion causes pinion 121 to rotate, causing spindle drive (not shown) to rotate and bondhead 110 to rotate about second axis 175.
• a rotation (inclination) of the contact surface 185 (not shown) about the second axis 175 is therefore also provided.
• the rigid engagement in the second adjustment position 137 takes place by moving the bonding head 110 into the second adjustment position 137, so that the pinion at the distal end of the pinion 121 is aligned along the first 170, second 175 and third 177 movement axes, so that pinion 121 and rack 133 are close together.
• a displacement along the first movement axes 170 to the rack 133 ensures a rigid engagement.
• the subsequent movement along the third Axis of motion 177 at substantially equal positions along first 170 and second 175 axes of motion causes pinion 121 to rotate, causing spindle drive (not shown) to rotate and bondhead 110 to rotate about third axis 177.
• a rotation (inclination) of the contact surface 185 (not shown) about the third axis 177 is therefore also provided.
• the rack 133 in the first adjustment position 132 extends along the second movement axis 175.
• the rack 133 in the second adjustment position 137 extends along the third
• Axis of motion 177 As mentioned above with respect to Figure 6, different orientations of each rack 133 can be used.
• device 100 can be configured and arranged to use movement along an axis of movement to enable rotation (tilt) about the same axis of movement:
• the device 100 is further configured such that the bond head 110 can be displaced between the first 132 and second 137 adjustment positions by movement essentially along the first movement axis 170. Since both inclinations have to be set in order to achieve a high plane parallelism between the components 150 and the substrate, the time for the Tilt adjustment can be reduced if the adjustment positions are close to each other. Limiting the movement to one
• the axis of motion can further shorten the time required.
• a further reduction can also be achieved in that the disengagement direction of one adjustment position essentially coincides with the engagement direction of the other adjustment position.
• tilt errors In general, two types of tilt errors can occur - a static tilt due to mechanical and angular tolerances in the device 100, and (in particular) in the bondhead 110, in the pickup 180 and in the contact area 185.
• the other cause of tilting errors are dynamic factors such as thermal expansion and wear of the mechanical parts.
• the inclination will only be checked after one hundred to five hundred substrates 160.
• the invention offers a relatively inexpensive and relatively quick adjustment facility which makes it possible to check and adjust the inclination after each substrate or during operation on a substrate.
• a processor configured and arranged to determine the degree of displacement along the first axis of motion 170 to obtain a desired rotation about the second 175 and / or the third axis of motion 177; and by further configuring and arranging the processor to stop the displacement along the first axis 170 when a desired inclination of the contact surface 185 is achieved, a high degree of automation can be provided.
• the measurement of one or more forces on the contact surface 185 during operation, in particular the assembly of components 150 on the substrate 160, can provide information about any inclination problems that may occur.
• Components 150 and / or the substrate 160 and / or the contact surface 185 are measured and / or monitored.
• a processor or further configuring an existing processor to determine the degree of displacement along the first axis 170 to achieve a desired rotation about the second axis 175 and / or the third movement 177 using the measured temperatures, a high degree can be experienced Compensation for the dynamic tilting errors occurring during operation can be achieved.
• the invention is directed to an apparatus and a method for mounting components on a substrate. Processing is often interrupted during operation because the components are not parallel to the substrate
• the tilt correction mechanism consists of one or more engagement elements 120, one or more
• Adjustment elements 130 and one or more tilt position blocks 117 can be used.
• passive elements and mechanisms can be used.

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• 2018
  • 2018-06-23 DE DE102018115144.6A patent/DE102018115144A1/de active Pending
• 2019
  • 2019-06-23 US US17/252,756 patent/US12230599B2/en active Active
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