MY190782A - Ni-ta-based alloy, target material and magnetic recording medium - Google Patents

Ni-ta-based alloy, target material and magnetic recording medium

Info

Publication number
MY190782A
MY190782A MYPI2019001636A MYPI2019001636A MY190782A MY 190782 A MY190782 A MY 190782A MY PI2019001636 A MYPI2019001636 A MY PI2019001636A MY PI2019001636 A MYPI2019001636 A MY PI2019001636A MY 190782 A MY190782 A MY 190782A
Authority
MY
Malaysia
Prior art keywords
based alloy
content
recording medium
magnetic recording
target material
Prior art date
Application number
MYPI2019001636A
Other languages
English (en)
Inventor
Imoto Miyuki
Original Assignee
Sanyo Special Steel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Special Steel Co Ltd filed Critical Sanyo Special Steel Co Ltd
Publication of MY190782A publication Critical patent/MY190782A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
    • G11B5/7371—Non-magnetic single underlayer comprising nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02—Alloys based on vanadium, niobium, or tantalum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
    • G11B5/7373—Non-magnetic single underlayer comprising chromium
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/62—Record carriers characterised by the selection of the material
    • G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
    • G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
    • G11B5/7377—Physical structure of underlayer, e.g. texture
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Powder Metallurgy (AREA)
  • Magnetic Record Carriers (AREA)
MYPI2019001636A 2016-09-27 2017-09-26 Ni-ta-based alloy, target material and magnetic recording medium MY190782A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016187722A JP2018053280A (ja) 2016-09-27 2016-09-27 ＮｉＴａ系合金、ターゲット材および磁気記録媒体
PCT/JP2017/034762 WO2018062189A1 (ja) 2016-09-27 2017-09-26 ＮｉＴａ系合金、ターゲット材及び磁気記録媒体

Publications (1)

Publication Number Publication Date
MY190782A true MY190782A (en) 2022-05-12

Family

ID=61760792

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001636A MY190782A (en) 2016-09-27 2017-09-26 Ni-ta-based alloy, target material and magnetic recording medium

Country Status (5)

Country Link
JP (1) JP2018053280A (ja)
CN (1) CN109790600A (ja)
MY (1) MY190782A (ja)
TW (1) TW201817890A (ja)
WO (1) WO2018062189A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109811195A (zh) * 2019-03-18 2019-05-28 河北四通新型金属材料股份有限公司 一种高纯镍钽中间合金及其制备方法
TWI769081B (zh) * 2021-09-17 2022-06-21 光洋應用材料科技股份有限公司 鉻鎳鈦合金靶材及其製法
CN114892042B (zh) * 2022-04-20 2022-12-13 嘉兴鸷锐新材料科技有限公司 一种耐高温铁镍合金及其制备方法和应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233735A (ja) * 1985-08-06 1987-02-13 Mitsui Eng & Shipbuild Co Ltd 高耐食アモルフアス合金
JPS62235448A (ja) * 1986-04-03 1987-10-15 Nec Corp 非晶質合金
JPH0340213A (ja) * 1989-07-06 1991-02-21 Furukawa Electric Co Ltd:The 磁気記録媒体
JP4377721B2 (ja) * 2004-03-11 2009-12-02 株式会社東芝 半導体装置の製造方法
US7828913B1 (en) * 2004-08-03 2010-11-09 Huddleston James B Peritectic, metastable alloys containing tantalum and nickel
JP5726615B2 (ja) * 2010-11-22 2015-06-03 山陽特殊製鋼株式会社 磁気記録媒体のシード層用合金およびスパッタリングターゲット材
JP6048651B2 (ja) * 2011-11-17 2016-12-21 三菱マテリアル株式会社 スパッタリングターゲットおよびその製造方法
JP6514664B2 (ja) * 2016-05-25 2019-05-15 山陽特殊製鋼株式会社 スパッタリングターゲット材

Also Published As

Publication number Publication date
WO2018062189A1 (ja) 2018-04-05
TW201817890A (zh) 2018-05-16
CN109790600A (zh) 2019-05-21
JP2018053280A (ja) 2018-04-05

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