MY186454A - Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board - Google Patents
Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring boardInfo
- Publication number
- MY186454A MY186454A MYPI2021000356A MYPI2021000356A MY186454A MY 186454 A MY186454 A MY 186454A MY PI2021000356 A MYPI2021000356 A MY PI2021000356A MY PI2021000356 A MYPI2021000356 A MY PI2021000356A MY 186454 A MY186454 A MY 186454A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- roughened
- copper
- wiring board
- printed wiring
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018152072 | 2018-08-10 | ||
PCT/JP2019/029224 WO2020031721A1 (ja) | 2018-08-10 | 2019-07-25 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186454A true MY186454A (en) | 2021-07-22 |
Family
ID=69414103
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2021000356A MY186454A (en) | 2018-08-10 | 2019-07-25 | Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6905157B2 (ja) |
KR (1) | KR102480377B1 (ja) |
CN (1) | CN112424399B (ja) |
MY (1) | MY186454A (ja) |
TW (1) | TWI719567B (ja) |
WO (1) | WO2020031721A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6582156B1 (ja) * | 2018-02-23 | 2019-09-25 | 古河電気工業株式会社 | 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板 |
JP7421208B2 (ja) * | 2019-12-24 | 2024-01-24 | 日本電解株式会社 | 表面処理銅箔及びその製造方法 |
WO2021157362A1 (ja) * | 2020-02-04 | 2021-08-12 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
KR20220106199A (ko) * | 2020-02-04 | 2022-07-28 | 미쓰이금속광업주식회사 | 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판 |
JP7051988B1 (ja) * | 2020-11-27 | 2022-04-11 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板、及びプリント配線板 |
JP7273883B2 (ja) | 2021-04-09 | 2023-05-15 | 福田金属箔粉工業株式会社 | 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板 |
JPWO2022244827A1 (ja) | 2021-05-20 | 2022-11-24 | ||
CN117321253A (zh) | 2021-05-20 | 2023-12-29 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 |
WO2022244828A1 (ja) | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板 |
CN118019880A (zh) * | 2021-09-30 | 2024-05-10 | 三井金属矿业株式会社 | 粗糙化处理铜箔及覆铜层叠板、以及印刷电路板的制造方法 |
JP7427846B1 (ja) | 2022-03-31 | 2024-02-05 | 三井金属鉱業株式会社 | キャリア付金属箔 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005048277A (ja) * | 2003-07-15 | 2005-02-24 | Mitsui Mining & Smelting Co Ltd | キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法 |
KR101929844B1 (ko) * | 2015-01-22 | 2018-12-17 | 미쓰이금속광업주식회사 | 캐리어 부착 극박 동박 및 그 제조 방법 |
JP5842077B1 (ja) * | 2015-07-01 | 2016-01-13 | 三井金属鉱業株式会社 | キャリア付銅箔、銅張積層板及びプリント配線板 |
CN107614760B (zh) * | 2015-07-03 | 2018-07-13 | 三井金属矿业株式会社 | 粗糙化处理铜箔、覆铜层叠板和印刷电路板 |
JP6342078B2 (ja) * | 2015-07-29 | 2018-06-13 | 三井金属鉱業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP6200042B2 (ja) * | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
MY186859A (en) * | 2016-04-14 | 2021-08-26 | Mitsui Mining & Smelting Co Ltd | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same |
JP6462961B2 (ja) * | 2016-12-14 | 2019-01-30 | 古河電気工業株式会社 | 表面処理銅箔および銅張積層板 |
KR20220106199A (ko) * | 2020-02-04 | 2022-07-28 | 미쓰이금속광업주식회사 | 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판 |
-
2019
- 2019-07-25 MY MYPI2021000356A patent/MY186454A/en unknown
- 2019-07-25 JP JP2020536455A patent/JP6905157B2/ja active Active
- 2019-07-25 CN CN201980047289.3A patent/CN112424399B/zh active Active
- 2019-07-25 KR KR1020217000738A patent/KR102480377B1/ko active IP Right Grant
- 2019-07-25 WO PCT/JP2019/029224 patent/WO2020031721A1/ja active Application Filing
- 2019-08-02 TW TW108127478A patent/TWI719567B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI719567B (zh) | 2021-02-21 |
CN112424399B (zh) | 2023-07-25 |
JPWO2020031721A1 (ja) | 2021-04-30 |
JP6905157B2 (ja) | 2021-07-21 |
KR20210019518A (ko) | 2021-02-22 |
KR102480377B1 (ko) | 2022-12-23 |
CN112424399A (zh) | 2021-02-26 |
WO2020031721A1 (ja) | 2020-02-13 |
TW202009329A (zh) | 2020-03-01 |
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