TWI719567B - 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 - Google Patents

粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 Download PDF

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Publication number
TWI719567B
TWI719567B TW108127478A TW108127478A TWI719567B TW I719567 B TWI719567 B TW I719567B TW 108127478 A TW108127478 A TW 108127478A TW 108127478 A TW108127478 A TW 108127478A TW I719567 B TWI719567 B TW I719567B
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TW
Taiwan
Prior art keywords
copper foil
roughened
carrier
copper
layer
Prior art date
Application number
TW108127478A
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English (en)
Chinese (zh)
Other versions
TW202009329A (zh
Inventor
細川眞
髙梨哲聡
溝口美智
平岡慎哉
Original Assignee
日商三井金屬鑛業股份有限公司
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Publication of TW202009329A publication Critical patent/TW202009329A/zh
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Publication of TWI719567B publication Critical patent/TWI719567B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW108127478A 2018-08-10 2019-08-02 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板 TWI719567B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018152072 2018-08-10
JP2018-152072 2018-08-10

Publications (2)

Publication Number Publication Date
TW202009329A TW202009329A (zh) 2020-03-01
TWI719567B true TWI719567B (zh) 2021-02-21

Family

ID=69414103

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108127478A TWI719567B (zh) 2018-08-10 2019-08-02 粗糙化處理銅箔、附載體之銅箔、覆銅層合板及印刷配線板

Country Status (6)

Country Link
JP (1) JP6905157B2 (ja)
KR (1) KR102480377B1 (ja)
CN (1) CN112424399B (ja)
MY (1) MY186454A (ja)
TW (1) TWI719567B (ja)
WO (1) WO2020031721A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6582156B1 (ja) * 2018-02-23 2019-09-25 古河電気工業株式会社 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
CN115038818A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
WO2021157362A1 (ja) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP7051988B1 (ja) * 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
KR20240009937A (ko) 2021-05-20 2024-01-23 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
WO2022244826A1 (ja) 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
KR20240009404A (ko) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판
WO2023054398A1 (ja) * 2021-09-30 2023-04-06 三井金属鉱業株式会社 粗化処理銅箔及び銅張積層板、並びにプリント配線板の製造方法
JP7427846B1 (ja) 2022-03-31 2024-02-05 三井金属鉱業株式会社 キャリア付金属箔

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
TW201636457A (zh) * 2015-01-22 2016-10-16 Mitsui Mining & Smelting Co 附載體極薄銅箔及其製造方法
CN106455341A (zh) * 2015-08-06 2017-02-22 Ｊｘ金属株式会社 附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板
WO2017006739A1 (ja) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2017018232A1 (ja) * 2015-07-29 2017-02-02 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
JP6462961B2 (ja) * 2016-12-14 2019-01-30 古河電気工業株式会社 表面処理銅箔および銅張積層板
CN115038818A (zh) * 2020-02-04 2022-09-09 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
TW201636457A (zh) * 2015-01-22 2016-10-16 Mitsui Mining & Smelting Co 附載體極薄銅箔及其製造方法
CN106455341A (zh) * 2015-08-06 2017-02-22 Ｊｘ金属株式会社 附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法

Also Published As

Publication number Publication date
WO2020031721A1 (ja) 2020-02-13
JP6905157B2 (ja) 2021-07-21
TW202009329A (zh) 2020-03-01
JPWO2020031721A1 (ja) 2021-04-30
KR20210019518A (ko) 2021-02-22
CN112424399B (zh) 2023-07-25
KR102480377B1 (ko) 2022-12-23
CN112424399A (zh) 2021-02-26
MY186454A (en) 2021-07-22

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