KR102480377B1 - 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 - Google Patents

조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 Download PDF

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Publication number
KR102480377B1
KR102480377B1 KR1020217000738A KR20217000738A KR102480377B1 KR 102480377 B1 KR102480377 B1 KR 102480377B1 KR 1020217000738 A KR1020217000738 A KR 1020217000738A KR 20217000738 A KR20217000738 A KR 20217000738A KR 102480377 B1 KR102480377 B1 KR 102480377B1
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KR
South Korea
Prior art keywords
copper foil
carrier
roughened
copper
roughening process
Prior art date
Application number
KR1020217000738A
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English (en)
Korean (ko)
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KR20210019518A (ko
Inventor
마코토 호소카와
아키토시 다카나시
미사토 미조구치
신야 히라오카
Original Assignee
미쓰이금속광업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰이금속광업주식회사 filed Critical 미쓰이금속광업주식회사
Publication of KR20210019518A publication Critical patent/KR20210019518A/ko
Application granted granted Critical
Publication of KR102480377B1 publication Critical patent/KR102480377B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020217000738A 2018-08-10 2019-07-25 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판 KR102480377B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-152072 2018-08-10
JP2018152072 2018-08-10
PCT/JP2019/029224 WO2020031721A1 (ja) 2018-08-10 2019-07-25 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20210019518A KR20210019518A (ko) 2021-02-22
KR102480377B1 true KR102480377B1 (ko) 2022-12-23

Family

ID=69414103

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217000738A KR102480377B1 (ko) 2018-08-10 2019-07-25 조화 처리 구리박, 캐리어 구비 구리박, 동장 적층판 및 프린트 배선판

Country Status (6)

Country Link
JP (1) JP6905157B2 (ja)
KR (1) KR102480377B1 (ja)
CN (1) CN112424399B (ja)
MY (1) MY186454A (ja)
TW (1) TWI719567B (ja)
WO (1) WO2020031721A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019163962A1 (ja) * 2018-02-23 2019-08-29 古河電気工業株式会社 電解銅箔、並びに該電解銅箔を用いたリチウムイオン二次電池用負極、リチウムイオン二次電池、銅張積層板及びプリント配線板
JP7421208B2 (ja) * 2019-12-24 2024-01-24 日本電解株式会社 表面処理銅箔及びその製造方法
KR20220106200A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
KR20220106199A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판
JP7051988B1 (ja) 2020-11-27 2022-04-11 古河電気工業株式会社 粗化処理銅箔、銅張積層板、及びプリント配線板
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板
WO2022244828A1 (ja) 2021-05-20 2022-11-24 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN117321253A (zh) 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
JPWO2022244827A1 (ja) 2021-05-20 2022-11-24
CN118019880A (zh) * 2021-09-30 2024-05-10 三井金属矿业株式会社 粗糙化处理铜箔及覆铜层叠板、以及印刷电路板的制造方法
WO2023189839A1 (ja) * 2022-03-31 2023-10-05 三井金属鉱業株式会社 キャリア付金属箔

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
WO2018110579A1 (ja) * 2016-12-14 2018-06-21 古河電気工業株式会社 表面処理銅箔および銅張積層板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005048277A (ja) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔の製造方法
MY174931A (en) * 2015-01-22 2020-05-24 Mitsui Mining & Smelting Co Ltd Ultrathin copper foil with carrier and method for manufacturing same
JP5842077B1 (ja) * 2015-07-01 2016-01-13 三井金属鉱業株式会社 キャリア付銅箔、銅張積層板及びプリント配線板
WO2017006739A1 (ja) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN107923047B (zh) * 2015-07-29 2020-05-01 纳美仕有限公司 粗糙化处理铜箔、覆铜层叠板及印刷电路板
JP6200042B2 (ja) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
KR20220106199A (ko) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 조화 처리 동박, 캐리어를 구비하는 동박, 동장 적층판 및 프린트 배선판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
WO2018110579A1 (ja) * 2016-12-14 2018-06-21 古河電気工業株式会社 表面処理銅箔および銅張積層板

Also Published As

Publication number Publication date
TWI719567B (zh) 2021-02-21
MY186454A (en) 2021-07-22
JP6905157B2 (ja) 2021-07-21
TW202009329A (zh) 2020-03-01
CN112424399A (zh) 2021-02-26
CN112424399B (zh) 2023-07-25
KR20210019518A (ko) 2021-02-22
WO2020031721A1 (ja) 2020-02-13
JPWO2020031721A1 (ja) 2021-04-30

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