MY186397A - Roughened copper foil, copper-clad laminate, and printed wiring board - Google Patents

Roughened copper foil, copper-clad laminate, and printed wiring board

Info

Publication number
MY186397A
MY186397A MYPI2018700155A MYPI2018700155A MY186397A MY 186397 A MY186397 A MY 186397A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY 186397 A MY186397 A MY 186397A
Authority
MY
Malaysia
Prior art keywords
roughened
copper foil
copper
wiring board
printed wiring
Prior art date
Application number
MYPI2018700155A
Other languages
English (en)
Inventor
Hiroaki Tsuyoshi
Ayumu Tateoka
Makoto Hosokawa
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY186397A publication Critical patent/MY186397A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Treatment Of Metals (AREA)
MYPI2018700155A 2015-07-29 2016-07-14 Roughened copper foil, copper-clad laminate, and printed wiring board MY186397A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015149717 2015-07-29
PCT/JP2016/070876 WO2017018232A1 (ja) 2015-07-29 2016-07-14 粗化処理銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
MY186397A true MY186397A (en) 2021-07-22

Family

ID=57885564

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700155A MY186397A (en) 2015-07-29 2016-07-14 Roughened copper foil, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6342078B2 (ja)
KR (1) KR102490491B1 (ja)
CN (1) CN107923047B (ja)
MY (1) MY186397A (ja)
TW (1) TWI609780B (ja)
WO (1) WO2017018232A1 (ja)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (ja) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
KR102136794B1 (ko) * 2017-03-09 2020-07-22 케이씨에프테크놀로지스 주식회사 우수한 밀착력을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR20200118144A (ko) * 2018-03-30 2020-10-14 미쓰이금속광업주식회사 동장 적층판
JP6606317B1 (ja) * 2018-04-25 2019-11-13 古河電気工業株式会社 表面処理銅箔、銅張積層板、及びプリント配線板
EP3567993B1 (en) * 2018-05-08 2022-02-23 Atotech Deutschland GmbH & Co. KG A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, and acidic aqueous non-etching protector solution
JP6985745B2 (ja) * 2018-06-20 2021-12-22 ナミックス株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
WO2019244890A1 (ja) 2018-06-22 2019-12-26 積水ポリマテック株式会社 熱伝導性シート
WO2020031721A1 (ja) * 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
JP7618954B2 (ja) * 2018-09-26 2025-01-22 積水ポリマテック株式会社 熱伝導性シート
JP6805217B2 (ja) * 2018-10-18 2020-12-23 Ｊｘ金属株式会社 導電性材料、成型品及び電子部品
CN112969824B (zh) * 2018-11-19 2024-10-18 三井金属矿业株式会社 表面处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6969703B2 (ja) * 2019-03-22 2021-11-24 株式会社Moldino 被覆切削工具
JP7456578B2 (ja) * 2019-05-09 2024-03-27 ナミックス株式会社 銅表面の加工装置
JP7328671B2 (ja) * 2019-05-09 2023-08-17 ナミックス株式会社 積層体
WO2021220524A1 (ja) * 2020-04-27 2021-11-04 ナミックス株式会社 複合銅部材
KR20230038643A (ko) * 2020-07-16 2023-03-21 미쓰이금속광업주식회사 동장 적층판 및 프린트 배선판
JP2023051784A (ja) * 2021-09-30 2023-04-11 ナミックス株式会社 銅部材

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4704025B2 (ja) * 2004-12-21 2011-06-15 Ｊｘ日鉱日石金属株式会社 高周波回路用粗化処理圧延銅箔及びその製造方法
KR20130054447A (ko) * 2009-03-27 2013-05-24 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박 및 그 제조 방법
JP5297546B1 (ja) * 2012-04-23 2013-09-25 三井金属鉱業株式会社 電極箔及び電子デバイス
KR20140124402A (ko) * 2012-11-26 2014-10-24 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 표면 처리 전해 동박, 적층판, 및 프린트 배선판
KR101574475B1 (ko) * 2013-02-14 2015-12-03 미쓰이금속광업주식회사 표면 처리 구리박 및 표면 처리 구리박을 사용해서 얻어지는 동장 적층판
JP6166614B2 (ja) * 2013-07-23 2017-07-19 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
CN109951964A (zh) * 2013-07-23 2019-06-28 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、及树脂基材
WO2015040998A1 (ja) * 2013-09-20 2015-03-26 三井金属鉱業株式会社 銅箔、キャリア箔付銅箔及び銅張積層板
JP2015134953A (ja) * 2014-01-17 2015-07-27 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP6342078B2 (ja) 2018-06-13
WO2017018232A1 (ja) 2017-02-02
JPWO2017018232A1 (ja) 2017-09-21
TWI609780B (zh) 2018-01-01
KR102490491B1 (ko) 2023-01-19
CN107923047A (zh) 2018-04-17
CN107923047B (zh) 2020-05-01
KR20180036693A (ko) 2018-04-09
TW201710079A (zh) 2017-03-16

Similar Documents

Publication Publication Date Title
MY186397A (en) Roughened copper foil, copper-clad laminate, and printed wiring board
PH12017502362B1 (en) Roughened copper foil, copper-clad laminate and printed wiring board
PH12020551282A1 (en) Surface treated copper foil, copper clad laminate, and printed circuit board
PH12019000429A1 (en) Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
MY186859A (en) Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
MY180511A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
MY205472A (en) Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board
MY186266A (en) Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
MY186454A (en) Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
EP3805316A4 (en) COMPOSITION OF RESIN, PREPREGNATED, LAMINATED WITH METALLIC FOIL, RESIN FOIL AND PRINTED CARD
MY176763A (en) Carrier-attached copper foil, laminate, method for manufacturing printed- wiring board and method for manufacturing electronic device
PH12016502502A1 (en) Printed circuit board, electronic component, and method for producing printed circuit board
MY177723A (en) Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board
MY173569A (en) Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
MY181562A (en) Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board
MY176308A (en) Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device
MY168616A (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
PH12014502509B1 (en) Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board
MY200914A (en) Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
MY185462A (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
MY181388A (en) Roughened copper foil, copper clad laminate, and printed circuit board
MY174931A (en) Ultrathin copper foil with carrier and method for manufacturing same
MY176312A (en) Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board
MY177771A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
MY201240A (en) Roughened copper foil, copper foil with carrier, copper-clad multi-layer board, and printed wiring board