MY179461A - Base plate, and semiconductor device provided with base plate - Google Patents

Base plate, and semiconductor device provided with base plate

Info

Publication number
MY179461A
MY179461A MYPI2016701892A MYPI2016701892A MY179461A MY 179461 A MY179461 A MY 179461A MY PI2016701892 A MYPI2016701892 A MY PI2016701892A MY PI2016701892 A MYPI2016701892 A MY PI2016701892A MY 179461 A MY179461 A MY 179461A
Authority
MY
Malaysia
Prior art keywords
base plate
joined
semiconductor device
concave
device provided
Prior art date
Application number
MYPI2016701892A
Other languages
English (en)
Inventor
Tao Hiroaki
Ichihara Chikara
Jiko Norihiro
Tauchi Yuki
Mitsui Toshiyuki
Original Assignee
Kobe Steel Ltd
Shinko Leadmikk Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd, Shinko Leadmikk Co Ltd filed Critical Kobe Steel Ltd
Publication of MY179461A publication Critical patent/MY179461A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/26175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connection Of Plates (AREA)
MYPI2016701892A 2013-11-29 2014-11-26 Base plate, and semiconductor device provided with base plate MY179461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248233 2013-11-29

Publications (1)

Publication Number Publication Date
MY179461A true MY179461A (en) 2020-11-06

Family

ID=53199100

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016701892A MY179461A (en) 2013-11-29 2014-11-26 Base plate, and semiconductor device provided with base plate

Country Status (7)

Country Link
JP (1) JP6371204B2 (zh)
KR (1) KR101922783B1 (zh)
CN (1) CN105814681B (zh)
DE (1) DE112014006336T5 (zh)
MY (1) MY179461A (zh)
TW (1) TWI668808B (zh)
WO (1) WO2015080161A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6572732B2 (ja) * 2015-10-27 2019-09-11 三菱マテリアル株式会社 パワーモジュール
WO2017119082A1 (ja) * 2016-01-06 2017-07-13 新電元工業株式会社 半導体デバイスの載置台及び車載装置
JP6761592B2 (ja) * 2016-03-31 2020-09-30 大日本印刷株式会社 電子デバイス及びその製造方法
JP6610590B2 (ja) * 2017-03-21 2019-11-27 トヨタ自動車株式会社 半導体装置とその製造方法
JP6930189B2 (ja) * 2017-04-11 2021-09-01 富士電機株式会社 モジュールの製造方法、はんだ、およびモジュール
JP6890496B2 (ja) * 2017-07-27 2021-06-18 京セラ株式会社 電子部品搭載基板、電子装置および電子部品搭載基板の製造方法
CN110010557B (zh) * 2018-01-05 2021-10-26 深圳市绎立锐光科技开发有限公司 基板、利用基板形成封装结构的方法和封装结构
JP7005373B2 (ja) 2018-02-09 2022-01-21 三菱電機株式会社 パワーモジュールおよび電力変換装置
JP6933592B2 (ja) * 2018-02-23 2021-09-08 日立Astemo株式会社 イグナイタ
JP7074621B2 (ja) * 2018-09-05 2022-05-24 株式会社東芝 半導体装置及びその製造方法
JP7237647B2 (ja) * 2019-02-26 2023-03-13 京セラ株式会社 回路基板および電子装置
JP7482815B2 (ja) 2021-03-09 2024-05-14 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2022179872A (ja) 2021-05-24 2022-12-06 富士電機株式会社 半導体装置
WO2023223881A1 (ja) * 2022-05-18 2023-11-23 ローム株式会社 電子装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0637122A (ja) * 1992-07-15 1994-02-10 Hitachi Ltd 半導体装置
JPH0758273A (ja) * 1993-08-16 1995-03-03 Sony Corp リードフレーム及びそれを用いた半導体装置
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
CN100346488C (zh) * 2002-02-28 2007-10-31 罗姆股份有限公司 发光二极管灯
JP3913090B2 (ja) * 2002-02-28 2007-05-09 ローム株式会社 発光ダイオードランプ
JP2006140402A (ja) * 2004-11-15 2006-06-01 Toshiba Corp 半導体集積回路装置
JP4904767B2 (ja) * 2005-10-17 2012-03-28 富士電機株式会社 半導体装置
KR100752011B1 (ko) * 2006-04-12 2007-08-28 삼성전기주식회사 패키지 기판의 스트립 포맷 및 그 배열
JP2009070907A (ja) * 2007-09-11 2009-04-02 Toyota Motor Corp 半導体装置
JP2009094157A (ja) * 2007-10-04 2009-04-30 Sharp Corp ヒートスプレッダ、半導体装置、電子機器、ヒートスプレッダの製造方法、及び半導体装置の製造方法
JP4989552B2 (ja) * 2008-05-08 2012-08-01 トヨタ自動車株式会社 電子部品
JP5124396B2 (ja) * 2008-09-01 2013-01-23 新電元工業株式会社 放熱基板ユニット
JP5282075B2 (ja) 2010-08-25 2013-09-04 株式会社豊田自動織機 放熱装置
JP5577221B2 (ja) * 2010-11-11 2014-08-20 新電元工業株式会社 リードフレーム及び半導体装置
JP5691475B2 (ja) * 2010-12-15 2015-04-01 富士電機株式会社 半導体装置およびその製造方法
JP5884291B2 (ja) 2011-04-20 2016-03-15 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板ユニット
JP5869890B2 (ja) 2011-07-29 2016-02-24 株式会社神戸製鋼所 放熱板、及び放熱板の製法
JP2013115338A (ja) 2011-11-30 2013-06-10 Sumitomo Wiring Syst Ltd ダイオードの取付構造
JP2013123016A (ja) * 2011-12-12 2013-06-20 Denso Corp 半導体装置
JP6019706B2 (ja) * 2012-04-24 2016-11-02 ダイキン工業株式会社 パワーモジュール

Also Published As

Publication number Publication date
JP2015128154A (ja) 2015-07-09
KR101922783B1 (ko) 2018-11-27
CN105814681B (zh) 2020-01-10
TW201528442A (zh) 2015-07-16
JP6371204B2 (ja) 2018-08-08
TWI668808B (zh) 2019-08-11
WO2015080161A1 (ja) 2015-06-04
KR20160075713A (ko) 2016-06-29
DE112014006336T5 (de) 2016-10-20
CN105814681A (zh) 2016-07-27

Similar Documents

Publication Publication Date Title
MY179461A (en) Base plate, and semiconductor device provided with base plate
USD727090S1 (en) Device for stabilizing an object
USD704201S1 (en) Leg mounted portable computer holder
MX2016008684A (es) Miembros que se acoplan con el suelo de calzado que tienen porciones cóncavas.
CA168770S (en) Case for a mobile device
TWD179621S (zh) 可攜式電子裝置的充電器的部分
MY168518A (en) Accessory for mobile device and device for mounting mobile device having same on vehicle
CA143268S (en) Fastener
CA153838S (en) Bench
USD693308S1 (en) Power extension device
TWD171272S (zh) 藍芽低能量信標裝置之部分
CA143267S (en) Fastener
GB2532660A (en) Fixings
TWD162306S (zh) 具有視訊連接器及乙太網路連接器之無線視訊轉接器之部分
USD715002S1 (en) Sheet of nail appliques
CA143269S (en) Fastener
TW201614777A (en) Techniques and configurations associated with a package load assembly
MX2017005539A (es) Miembro de desgaste para herramienta.
USD782027S1 (en) Applicator device
USD746344S1 (en) Emulsion plate
CL2012001854S1 (es) Parte de un telefono movil, con una franja perimetral frontal biselada que define un contorno rectangular de vertices redondeados, lados superior e inferior rectos y lados mayores laterales que se ensanchan en el centro y curvan hacia atras.
TWD181168S (zh) 電子零件散熱器用冷卻裝置
GB2518087A (en) Fixture for shaping a laminate substrate
SE1651629A1 (sv) Compression garment
USD829323S1 (en) Incontinence device