MY173967A - Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism - Google Patents

Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Info

Publication number
MY173967A
MY173967A MYPI2015002168A MYPI2015002168A MY173967A MY 173967 A MY173967 A MY 173967A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY PI2015002168 A MYPI2015002168 A MY PI2015002168A MY 173967 A MY173967 A MY 173967A
Authority
MY
Malaysia
Prior art keywords
sucking
sucking mechanism
vacuum
sucking member
holes
Prior art date
Application number
MYPI2015002168A
Other languages
English (en)
Inventor
Okamoto Jun
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY173967A publication Critical patent/MY173967A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
MYPI2015002168A 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism MY173967A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Publications (1)

Publication Number Publication Date
MY173967A true MY173967A (en) 2020-02-28

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015002168A MY173967A (en) 2014-09-04 2015-09-03 Cutting apparatus, sucking mechanism, and apparatus mounted with the sucking mechanism

Country Status (5)

Country Link
JP (1) JP6382039B2 (https=)
KR (1) KR20160028953A (https=)
CN (1) CN105405805A (https=)
MY (1) MY173967A (https=)
TW (1) TWI566291B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
JP7423161B2 (ja) * 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
JP7262693B1 (ja) * 2022-10-21 2023-04-21 株式会社東光高岳 ワーク検査装置
JP7822348B2 (ja) * 2023-07-26 2026-03-02 Ｔｏｗａ株式会社 保持部材、切断用テーブル、切断装置、及び、半導体装置の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

Also Published As

Publication number Publication date
TW201616566A (zh) 2016-05-01
JP6382039B2 (ja) 2018-08-29
TWI566291B (zh) 2017-01-11
KR20160028953A (ko) 2016-03-14
JP2016054256A (ja) 2016-04-14
CN105405805A (zh) 2016-03-16

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