KR20160028953A - 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치 - Google Patents

절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치 Download PDF

Info

Publication number
KR20160028953A
KR20160028953A KR1020150117404A KR20150117404A KR20160028953A KR 20160028953 A KR20160028953 A KR 20160028953A KR 1020150117404 A KR1020150117404 A KR 1020150117404A KR 20150117404 A KR20150117404 A KR 20150117404A KR 20160028953 A KR20160028953 A KR 20160028953A
Authority
KR
South Korea
Prior art keywords
suction
cutting
adsorption
holes
tan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020150117404A
Other languages
English (en)
Korean (ko)
Inventor
준 오카모토
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160028953A publication Critical patent/KR20160028953A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H01L21/02—
    • H01L21/67712—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
KR1020150117404A 2014-09-04 2015-08-20 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치 Ceased KR20160028953A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-180254 2014-09-04
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置

Publications (1)

Publication Number Publication Date
KR20160028953A true KR20160028953A (ko) 2016-03-14

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150117404A Ceased KR20160028953A (ko) 2014-09-04 2015-08-20 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치

Country Status (5)

Country Link
JP (1) JP6382039B2 (https=)
KR (1) KR20160028953A (https=)
CN (1) CN105405805A (https=)
MY (1) MY173967A (https=)
TW (1) TWI566291B (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6886379B2 (ja) * 2017-09-28 2021-06-16 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、検査装置及び切断装置
JP7102157B2 (ja) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
JP7423161B2 (ja) * 2020-06-30 2024-01-29 株式会社ディスコ チャックテーブル
KR102888135B1 (ko) * 2021-03-18 2025-11-19 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
JP7262693B1 (ja) * 2022-10-21 2023-04-21 株式会社東光高岳 ワーク検査装置
JP7822348B2 (ja) * 2023-07-26 2026-03-02 Ｔｏｗａ株式会社 保持部材、切断用テーブル、切断装置、及び、半導体装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法

Also Published As

Publication number Publication date
TW201616566A (zh) 2016-05-01
JP6382039B2 (ja) 2018-08-29
TWI566291B (zh) 2017-01-11
MY173967A (en) 2020-02-28
JP2016054256A (ja) 2016-04-14
CN105405805A (zh) 2016-03-16

Similar Documents

Publication Publication Date Title
KR20160028953A (ko) 절단 장치, 흡착 기구 및 흡착 기구를 구비하는 장치
JP6338555B2 (ja) 吸着機構及び吸着方法並びに製造装置及び製造方法
JP6430170B2 (ja) 切断装置及び切断方法並びに吸着機構及びこれを用いる装置
JP4679638B2 (ja) 半導体パッケージピックアップ装置
KR101733290B1 (ko) 절단 장치 및 절단 방법
KR101739199B1 (ko) 워크 흡착판, 워크 절단 장치, 워크 절단 방법 및 워크 흡착판의 제조 방법
JP6598639B2 (ja) 産業機器
KR102157533B1 (ko) 보유 지지 부재, 보유 지지 부재의 제조 방법, 보유 지지 기구 및 제품의 제조 장치
KR101415162B1 (ko) 반도체 제조장치용 흡착유닛
KR20180111513A (ko) 절단 장치, 반도체 패키지의 부착 방법 및 전자 부품의 제조 방법
KR20170048041A (ko) 반도체 패키지들을 진공 흡착하기 위한 진공 테이블 및 이를 구비하는 반도체 패키지 이송 모듈
TW201442144A (zh) 晶圓支撐及校準設備
KR20210126495A (ko) 절삭 장치, 절삭 블레이드의 교환 방법 및 보드의 교환 방법
CN107068606A (zh) 加工装置
JP6474275B2 (ja) 加工装置
KR102312853B1 (ko) 반도체 패키지 이송 장치
JP5117772B2 (ja) 切削装置
CN105552015B (zh) 处理半导体封装体的装置及用该装置获其位置信息的方法
TW202505618A (zh) 保持構件、切斷用工作臺、切斷裝置、及半導體裝置的製造方法
JP2025018098A (ja) 保持部材、搬送装置、切断用テーブル、切断装置、半導体製造装置、保持部材の製造方法、及び、半導体装置の製造方法
JP6163881B2 (ja) 脆性材料基板の搬送ヘッド
CN117476536A (zh) 保持部件、切割装置及切割品的制造方法
JP2017038072A (ja) 脆性材料基板の搬送ヘッド

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000