MY173537A - Manufacturing apparatus and manufacturing method - Google Patents

Manufacturing apparatus and manufacturing method

Info

Publication number
MY173537A
MY173537A MYPI2016700554A MYPI2016700554A MY173537A MY 173537 A MY173537 A MY 173537A MY PI2016700554 A MYPI2016700554 A MY PI2016700554A MY PI2016700554 A MYPI2016700554 A MY PI2016700554A MY 173537 A MY173537 A MY 173537A
Authority
MY
Malaysia
Prior art keywords
cut
qfn
along
qfn substrate
substrate
Prior art date
Application number
MYPI2016700554A
Other languages
English (en)
Inventor
Okamoto Jun
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of MY173537A publication Critical patent/MY173537A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Structure Of Printed Boards (AREA)
MYPI2016700554A 2015-03-04 2016-02-17 Manufacturing apparatus and manufacturing method MY173537A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015042803A JP6525643B2 (ja) 2015-03-04 2015-03-04 製造装置及び製造方法

Publications (1)

Publication Number Publication Date
MY173537A true MY173537A (en) 2020-02-03

Family

ID=56847225

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016700554A MY173537A (en) 2015-03-04 2016-02-17 Manufacturing apparatus and manufacturing method

Country Status (5)

Country Link
JP (1) JP6525643B2 (zh)
KR (1) KR101779701B1 (zh)
CN (1) CN105938808B (zh)
MY (1) MY173537A (zh)
TW (1) TWI618193B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6800745B2 (ja) * 2016-12-28 2020-12-16 株式会社ディスコ 半導体パッケージの製造方法
JP7043346B2 (ja) * 2018-05-18 2022-03-29 株式会社ディスコ 切削装置
JP2020088262A (ja) * 2018-11-29 2020-06-04 株式会社ディスコ パッケージ基板の分割方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592489B2 (ja) * 1988-03-18 1997-03-19 富士通株式会社 ウエハダイシング方法
JPH0574932A (ja) * 1991-09-17 1993-03-26 Fujitsu Ltd 半導体ウエハのダイシング方法
JP3229035B2 (ja) * 1992-09-25 2001-11-12 ローム株式会社 シリコンウエハーの切断方法
JP3521325B2 (ja) 1999-07-30 2004-04-19 シャープ株式会社 樹脂封止型半導体装置の製造方法
JP2002343817A (ja) 2001-05-11 2002-11-29 Tomoegawa Paper Co Ltd 半導体装置ユニット
JP2003031526A (ja) * 2001-07-16 2003-01-31 Mitsumi Electric Co Ltd モジュールの製造方法及びモジュール
JP2006222359A (ja) * 2005-02-14 2006-08-24 Hitachi Cable Ltd 発光ダイオードアレイの製造方法
US7694688B2 (en) * 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
JP2009170501A (ja) * 2008-01-11 2009-07-30 Disco Abrasive Syst Ltd 切削装置
JP2011035142A (ja) * 2009-07-31 2011-02-17 Sanyo Electric Co Ltd 回路装置の製造方法
US8801307B2 (en) * 2009-09-25 2014-08-12 Nikon Corporation Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element
JP2011159679A (ja) * 2010-01-29 2011-08-18 Furukawa Electric Co Ltd:The チップの製造方法
JP2011211159A (ja) * 2010-03-10 2011-10-20 Renesas Electronics Corp 半導体装置の製造方法
US9349679B2 (en) * 2010-08-31 2016-05-24 Utac Thai Limited Singulation method for semiconductor package with plating on side of connectors
JP5899614B2 (ja) * 2010-11-26 2016-04-06 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP2013069814A (ja) * 2011-09-21 2013-04-18 Renesas Electronics Corp 半導体装置の製造方法
JP5897454B2 (ja) * 2012-12-03 2016-03-30 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法
JP6111168B2 (ja) * 2013-08-23 2017-04-05 株式会社ディスコ パッケージ基板の分割方法

Also Published As

Publication number Publication date
TW201701409A (zh) 2017-01-01
JP2016162973A (ja) 2016-09-05
JP6525643B2 (ja) 2019-06-05
CN105938808A (zh) 2016-09-14
KR101779701B1 (ko) 2017-10-10
KR20160108170A (ko) 2016-09-19
CN105938808B (zh) 2018-10-26
TWI618193B (zh) 2018-03-11

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