MY170153A - Curable resin composition and semiconductor device using same - Google Patents
Curable resin composition and semiconductor device using sameInfo
- Publication number
- MY170153A MY170153A MYPI2015700025A MYPI2015700025A MY170153A MY 170153 A MY170153 A MY 170153A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY 170153 A MY170153 A MY 170153A
- Authority
- MY
- Malaysia
- Prior art keywords
- resin composition
- curable resin
- silsesquioxane
- semiconductor device
- polyorganosiloxane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/008—Additives improving gas barrier properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013160291 | 2013-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY170153A true MY170153A (en) | 2019-07-09 |
Family
ID=52431540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015700025A MY170153A (en) | 2013-08-01 | 2014-07-04 | Curable resin composition and semiconductor device using same |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5736524B1 (zh) |
KR (1) | KR101545471B1 (zh) |
CN (1) | CN104583326B (zh) |
MY (1) | MY170153A (zh) |
TW (1) | TWI510556B (zh) |
WO (1) | WO2015016000A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014125964A1 (ja) * | 2013-02-14 | 2014-08-21 | 株式会社ダイセル | 硬化性樹脂組成物、硬化物、封止材、及び半導体装置 |
CN106459584A (zh) * | 2014-06-06 | 2017-02-22 | 株式会社大赛璐 | 固化性树脂组合物、固化物、密封材料及半导体装置 |
JP2016216642A (ja) * | 2015-05-22 | 2016-12-22 | 株式会社ダイセル | 硬化性樹脂組成物及びその硬化物、封止剤、並びに半導体装置 |
JP2017002172A (ja) * | 2015-06-09 | 2017-01-05 | 株式会社ダイセル | 高硬度ポリシロキサン硬化物を与える硬化性樹脂組成物及びその硬化物 |
JP2017075216A (ja) * | 2015-10-13 | 2017-04-20 | 株式会社ダイセル | 硬化性樹脂組成物、その硬化物、及び半導体装置 |
CN108463508B (zh) * | 2016-01-15 | 2020-11-03 | 朋诺株式会社 | 缩合反应型聚硅氧烷组合物以及固化物 |
CN108699341B (zh) | 2016-02-22 | 2021-09-24 | 日亚化学工业株式会社 | 固化性树脂组合物、其固化物、及半导体装置 |
JP6927655B2 (ja) * | 2016-08-19 | 2021-09-01 | ダウ・東レ株式会社 | 電気・電子部品保護用室温硬化性オルガノポリシロキサン組成物 |
WO2018131545A1 (ja) * | 2017-01-16 | 2018-07-19 | 株式会社ダイセル | 硬化性樹脂組成物、その硬化物、及び半導体装置 |
JP7390962B2 (ja) * | 2020-04-14 | 2023-12-04 | 信越化学工業株式会社 | 硬化性有機ケイ素樹脂組成物 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011022947A (ja) * | 2009-07-18 | 2011-02-03 | Ati:Kk | 図柄認識装置 |
JP5300148B2 (ja) * | 2009-11-30 | 2013-09-25 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物 |
SG181122A1 (en) * | 2009-11-30 | 2012-07-30 | Nippon Kayaku Kk | Curable resin composition and cured product thereof |
JP4788837B2 (ja) * | 2010-01-26 | 2011-10-05 | 横浜ゴム株式会社 | シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体 |
TWI504681B (zh) * | 2010-03-08 | 2015-10-21 | Lintec Corp | A hardening composition, a hardened product, and a hardening composition |
EP2620441B1 (en) * | 2010-09-22 | 2018-10-31 | Kaneka Corporation | Modified product of polyhedral structure polysiloxane, polyhedral structure polysiloxane composition, cured product, and optical semiconductor device |
KR101332171B1 (ko) * | 2010-11-10 | 2013-11-25 | 요코하마 고무 가부시키가이샤 | 열경화형 실리콘 수지 조성물, 및, 이것을 이용하여 얻어지는 실리콘 수지 함유 구조체 및 광반도체 소자 봉지체 |
WO2012066998A1 (ja) * | 2010-11-18 | 2012-05-24 | 横浜ゴム株式会社 | 熱硬化型シリコーン樹脂組成物、シリコーン樹脂含有構造体、光半導体素子封止体、および、シラノール縮合触媒 |
JP2012111875A (ja) * | 2010-11-25 | 2012-06-14 | Daicel Corp | 硬化性樹脂組成物及び硬化物 |
JP2012162666A (ja) * | 2011-02-08 | 2012-08-30 | Kaneka Corp | 多面体構造ポリシロキサン系組成物 |
JP2012201706A (ja) * | 2011-03-23 | 2012-10-22 | Kaneka Corp | ポリシロキサン系組成物 |
EP2730603B1 (en) * | 2011-07-04 | 2019-05-22 | JNC Corporation | Compound comprising isocyanuric skeleton, epoxy groups, and silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconducto |
KR101512951B1 (ko) * | 2011-12-22 | 2015-04-16 | 주식회사 다이셀 | 경화성 수지 조성물 및 그의 경화물 |
MY154045A (en) * | 2012-05-25 | 2015-04-27 | Daicel Corp | Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device |
EP2944675B1 (en) * | 2013-01-09 | 2017-04-12 | Daicel Corporation | Curable resin composition, and cured product of same |
-
2014
- 2014-07-04 KR KR1020157004586A patent/KR101545471B1/ko active IP Right Grant
- 2014-07-04 MY MYPI2015700025A patent/MY170153A/en unknown
- 2014-07-04 WO PCT/JP2014/067862 patent/WO2015016000A1/ja active Application Filing
- 2014-07-04 CN CN201480002249.4A patent/CN104583326B/zh not_active Expired - Fee Related
- 2014-07-04 JP JP2014548793A patent/JP5736524B1/ja not_active Expired - Fee Related
- 2014-07-08 TW TW103123395A patent/TWI510556B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN104583326B (zh) | 2016-03-02 |
JPWO2015016000A1 (ja) | 2017-03-02 |
TW201506089A (zh) | 2015-02-16 |
TWI510556B (zh) | 2015-12-01 |
KR101545471B1 (ko) | 2015-08-18 |
KR20150028368A (ko) | 2015-03-13 |
WO2015016000A9 (ja) | 2015-03-12 |
JP5736524B1 (ja) | 2015-06-17 |
WO2015016000A1 (ja) | 2015-02-05 |
CN104583326A (zh) | 2015-04-29 |
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