MY170153A - Curable resin composition and semiconductor device using same - Google Patents

Curable resin composition and semiconductor device using same

Info

Publication number
MY170153A
MY170153A MYPI2015700025A MYPI2015700025A MY170153A MY 170153 A MY170153 A MY 170153A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY PI2015700025 A MYPI2015700025 A MY PI2015700025A MY 170153 A MY170153 A MY 170153A
Authority
MY
Malaysia
Prior art keywords
resin composition
curable resin
silsesquioxane
semiconductor device
polyorganosiloxane
Prior art date
Application number
MYPI2015700025A
Other languages
English (en)
Inventor
Yasunobu Nakagawa
Ryo Itaya
Original Assignee
Daicel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp filed Critical Daicel Corp
Publication of MY170153A publication Critical patent/MY170153A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/008—Additives improving gas barrier properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/549—Silicon-containing compounds containing silicon in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
MYPI2015700025A 2013-08-01 2014-07-04 Curable resin composition and semiconductor device using same MY170153A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013160291 2013-08-01

Publications (1)

Publication Number Publication Date
MY170153A true MY170153A (en) 2019-07-09

Family

ID=52431540

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015700025A MY170153A (en) 2013-08-01 2014-07-04 Curable resin composition and semiconductor device using same

Country Status (6)

Country Link
JP (1) JP5736524B1 (ja)
KR (1) KR101545471B1 (ja)
CN (1) CN104583326B (ja)
MY (1) MY170153A (ja)
TW (1) TWI510556B (ja)
WO (1) WO2015016000A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014125964A1 (ja) * 2013-02-14 2014-08-21 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
JP6474801B2 (ja) * 2014-06-06 2019-02-27 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
JP2016216642A (ja) * 2015-05-22 2016-12-22 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに半導体装置
JP2017002172A (ja) * 2015-06-09 2017-01-05 株式会社ダイセル 高硬度ポリシロキサン硬化物を与える硬化性樹脂組成物及びその硬化物
JP2017075216A (ja) * 2015-10-13 2017-04-20 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
WO2017122762A1 (ja) * 2016-01-15 2017-07-20 ペルノックス株式会社 縮合反応型シリコーン組成物及び硬化物
US10870758B2 (en) 2016-02-22 2020-12-22 Daicel Corporation Curable resin composition, cured product thereof, and semiconductor device
CN109563347A (zh) * 2016-08-19 2019-04-02 道康宁东丽株式会社 用于保护电气/电子部件的室温可固化的有机聚硅氧烷组合物
WO2018131545A1 (ja) * 2017-01-16 2018-07-19 株式会社ダイセル 硬化性樹脂組成物、その硬化物、及び半導体装置
JP7390962B2 (ja) * 2020-04-14 2023-12-04 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011022947A (ja) * 2009-07-18 2011-02-03 Ati:Kk 図柄認識装置
JP5300148B2 (ja) * 2009-11-30 2013-09-25 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物
KR20120114237A (ko) * 2009-11-30 2012-10-16 닛뽄 가야쿠 가부시키가이샤 경화성 수지 조성물 및 그 경화물
JP4788837B2 (ja) * 2010-01-26 2011-10-05 横浜ゴム株式会社 シリコーン樹脂組成物およびその使用方法、シリコーン樹脂、シリコーン樹脂含有構造体、ならびに光半導体素子封止体
TWI504681B (zh) * 2010-03-08 2015-10-21 Lintec Corp A hardening composition, a hardened product, and a hardening composition
WO2012039322A1 (ja) * 2010-09-22 2012-03-29 株式会社カネカ 多面体構造ポリシロキサン変性体、多面体構造ポリシロキサン系組成物、硬化物、及び、光半導体デバイス
KR101332171B1 (ko) * 2010-11-10 2013-11-25 요코하마 고무 가부시키가이샤 열경화형 실리콘 수지 조성물, 및, 이것을 이용하여 얻어지는 실리콘 수지 함유 구조체 및 광반도체 소자 봉지체
JP5045862B2 (ja) * 2010-11-18 2012-10-10 横浜ゴム株式会社 熱硬化型シリコーン樹脂組成物、シリコーン樹脂含有構造体、光半導体素子封止体、および、シラノール縮合触媒
JP2012111875A (ja) * 2010-11-25 2012-06-14 Daicel Corp 硬化性樹脂組成物及び硬化物
JP2012162666A (ja) * 2011-02-08 2012-08-30 Kaneka Corp 多面体構造ポリシロキサン系組成物
JP2012201706A (ja) * 2011-03-23 2012-10-22 Kaneka Corp ポリシロキサン系組成物
WO2013005633A1 (ja) * 2011-07-04 2013-01-10 Jnc株式会社 イソシアヌル骨格、エポキシ基およびＳｉＨ基を有するオルガノポリシロキサンまたはシルセスキオキサン骨格を含む化合物および該化合物を密着付与材として含む熱硬化性樹脂組成物、硬化物、および光半導体用封止材
US9181397B2 (en) * 2011-12-22 2015-11-10 Daicel Corporation Curable resin composition and cured product thereof
WO2013176238A1 (ja) * 2012-05-25 2013-11-28 株式会社ダイセル 硬化性樹脂組成物及びその硬化物、封止剤、並びに光半導体装置
EP2944675B1 (en) * 2013-01-09 2017-04-12 Daicel Corporation Curable resin composition, and cured product of same

Also Published As

Publication number Publication date
KR101545471B1 (ko) 2015-08-18
KR20150028368A (ko) 2015-03-13
CN104583326B (zh) 2016-03-02
JPWO2015016000A1 (ja) 2017-03-02
JP5736524B1 (ja) 2015-06-17
CN104583326A (zh) 2015-04-29
TW201506089A (zh) 2015-02-16
WO2015016000A1 (ja) 2015-02-05
WO2015016000A9 (ja) 2015-03-12
TWI510556B (zh) 2015-12-01

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