MY164088A - Carrier plate, method of manufacturing disc-shaped substrate, and double- sided machining device for machining both surfaces of disc-shaped substrate - Google Patents

Carrier plate, method of manufacturing disc-shaped substrate, and double- sided machining device for machining both surfaces of disc-shaped substrate

Info

Publication number
MY164088A
MY164088A MYPI2013701000A MYPI2013701000A MY164088A MY 164088 A MY164088 A MY 164088A MY PI2013701000 A MYPI2013701000 A MY PI2013701000A MY PI2013701000 A MYPI2013701000 A MY PI2013701000A MY 164088 A MY164088 A MY 164088A
Authority
MY
Malaysia
Prior art keywords
disc
shaped substrate
carrier plate
machining
double
Prior art date
Application number
MYPI2013701000A
Other languages
English (en)
Inventor
Nakanishi Yasuyuki
Yoshimura Katsuhiro
tanaka Mizuki
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of MY164088A publication Critical patent/MY164088A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
MYPI2013701000A 2012-06-19 2013-06-13 Carrier plate, method of manufacturing disc-shaped substrate, and double- sided machining device for machining both surfaces of disc-shaped substrate MY164088A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012137764A JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置

Publications (1)

Publication Number Publication Date
MY164088A true MY164088A (en) 2017-11-30

Family

ID=50035837

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013701000A MY164088A (en) 2012-06-19 2013-06-13 Carrier plate, method of manufacturing disc-shaped substrate, and double- sided machining device for machining both surfaces of disc-shaped substrate

Country Status (3)

Country Link
JP (1) JP5613723B2 (enrdf_load_stackoverflow)
MY (1) MY164088A (enrdf_load_stackoverflow)
SG (2) SG10201510276UA (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110752143A (zh) * 2019-09-03 2020-02-04 福建晶安光电有限公司 一种提升蓝宝石衬底平坦度的工艺
CN114521161B (zh) * 2019-09-30 2023-06-20 Hoya株式会社 基板配置辅助治具及基板的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128657A (ja) * 1997-07-08 1999-02-02 Syst Seiko Kk 研磨具のドレッシング方法および装置
JP2000198064A (ja) * 1999-01-07 2000-07-18 Daido Steel Co Ltd 研磨機用キャリヤ
JP2000237949A (ja) * 1999-02-12 2000-09-05 Komag Inc 研磨パッドの清掃方法及び装置
JP2000280167A (ja) * 1999-03-30 2000-10-10 Kyocera Corp キャリアプレート及びこれを用いた両面研磨装置
JP2004023038A (ja) * 2002-06-20 2004-01-22 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの研磨装置

Also Published As

Publication number Publication date
JP2014002818A (ja) 2014-01-09
SG10201510276UA (en) 2016-01-28
SG10202005438WA (en) 2020-07-29
JP5613723B2 (ja) 2014-10-29

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