JP5613723B2 - キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置 - Google Patents

キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置 Download PDF

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Publication number
JP5613723B2
JP5613723B2 JP2012137764A JP2012137764A JP5613723B2 JP 5613723 B2 JP5613723 B2 JP 5613723B2 JP 2012137764 A JP2012137764 A JP 2012137764A JP 2012137764 A JP2012137764 A JP 2012137764A JP 5613723 B2 JP5613723 B2 JP 5613723B2
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Japan
Prior art keywords
polishing
disk
grinding
carrier plate
shaped substrate
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JP2012137764A
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English (en)
Japanese (ja)
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JP2014002818A (ja
JP2014002818A5 (enrdf_load_stackoverflow
Inventor
中西　保之
保之 中西
勝宏 吉村
勝宏 吉村
瑞樹 田仲
瑞樹 田仲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
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Showa Denko KK
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Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2012137764A priority Critical patent/JP5613723B2/ja
Priority to SG10201510276UA priority patent/SG10201510276UA/en
Priority to SG10202005438WA priority patent/SG10202005438WA/en
Priority to MYPI2013701000A priority patent/MY164088A/en
Publication of JP2014002818A publication Critical patent/JP2014002818A/ja
Publication of JP2014002818A5 publication Critical patent/JP2014002818A5/ja
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Publication of JP5613723B2 publication Critical patent/JP5613723B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2012137764A 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置 Active JP5613723B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012137764A JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置
SG10201510276UA SG10201510276UA (en) 2012-06-19 2013-06-07 Slurry used in polishing a substrate
SG10202005438WA SG10202005438WA (en) 2012-06-19 2013-06-07 Slurry used in polishing a substrate
MYPI2013701000A MY164088A (en) 2012-06-19 2013-06-13 Carrier plate, method of manufacturing disc-shaped substrate, and double- sided machining device for machining both surfaces of disc-shaped substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012137764A JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置

Related Child Applications (1)

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JP2014118811A Division JP5982427B2 (ja) 2014-06-09 2014-06-09 両面加工装置に用いられるキャリアプレート

Publications (3)

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JP2014002818A JP2014002818A (ja) 2014-01-09
JP2014002818A5 JP2014002818A5 (enrdf_load_stackoverflow) 2014-05-01
JP5613723B2 true JP5613723B2 (ja) 2014-10-29

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JP2012137764A Active JP5613723B2 (ja) 2012-06-19 2012-06-19 キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置

Country Status (3)

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JP (1) JP5613723B2 (enrdf_load_stackoverflow)
MY (1) MY164088A (enrdf_load_stackoverflow)
SG (2) SG10201510276UA (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110752143A (zh) * 2019-09-03 2020-02-04 福建晶安光电有限公司 一种提升蓝宝石衬底平坦度的工艺
CN114521161B (zh) * 2019-09-30 2023-06-20 Hoya株式会社 基板配置辅助治具及基板的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1128657A (ja) * 1997-07-08 1999-02-02 Syst Seiko Kk 研磨具のドレッシング方法および装置
JP2000198064A (ja) * 1999-01-07 2000-07-18 Daido Steel Co Ltd 研磨機用キャリヤ
JP2000237949A (ja) * 1999-02-12 2000-09-05 Komag Inc 研磨パッドの清掃方法及び装置
JP2000280167A (ja) * 1999-03-30 2000-10-10 Kyocera Corp キャリアプレート及びこれを用いた両面研磨装置
JP2004023038A (ja) * 2002-06-20 2004-01-22 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの研磨装置

Also Published As

Publication number Publication date
JP2014002818A (ja) 2014-01-09
MY164088A (en) 2017-11-30
SG10201510276UA (en) 2016-01-28
SG10202005438WA (en) 2020-07-29

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