SG10201510276UA - Slurry used in polishing a substrate - Google Patents
Slurry used in polishing a substrateInfo
- Publication number
- SG10201510276UA SG10201510276UA SG10201510276UA SG10201510276UA SG10201510276UA SG 10201510276U A SG10201510276U A SG 10201510276UA SG 10201510276U A SG10201510276U A SG 10201510276UA SG 10201510276U A SG10201510276U A SG 10201510276UA SG 10201510276U A SG10201510276U A SG 10201510276UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- substrate
- slurry used
- slurry
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
- 239000002002 slurry Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012137764A JP5613723B2 (ja) | 2012-06-19 | 2012-06-19 | キャリアプレートおよび円盤状基板の製造方法、円盤状基板の両面加工装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201510276UA true SG10201510276UA (en) | 2016-01-28 |
Family
ID=50035837
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201510276UA SG10201510276UA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
SG10202005438WA SG10202005438WA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202005438WA SG10202005438WA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5613723B2 (enrdf_load_stackoverflow) |
MY (1) | MY164088A (enrdf_load_stackoverflow) |
SG (2) | SG10201510276UA (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110752143A (zh) * | 2019-09-03 | 2020-02-04 | 福建晶安光电有限公司 | 一种提升蓝宝石衬底平坦度的工艺 |
CN114521161B (zh) * | 2019-09-30 | 2023-06-20 | Hoya株式会社 | 基板配置辅助治具及基板的制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1128657A (ja) * | 1997-07-08 | 1999-02-02 | Syst Seiko Kk | 研磨具のドレッシング方法および装置 |
JP2000198064A (ja) * | 1999-01-07 | 2000-07-18 | Daido Steel Co Ltd | 研磨機用キャリヤ |
JP2000237949A (ja) * | 1999-02-12 | 2000-09-05 | Komag Inc | 研磨パッドの清掃方法及び装置 |
JP2000280167A (ja) * | 1999-03-30 | 2000-10-10 | Kyocera Corp | キャリアプレート及びこれを用いた両面研磨装置 |
JP2004023038A (ja) * | 2002-06-20 | 2004-01-22 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの研磨装置 |
-
2012
- 2012-06-19 JP JP2012137764A patent/JP5613723B2/ja active Active
-
2013
- 2013-06-07 SG SG10201510276UA patent/SG10201510276UA/en unknown
- 2013-06-07 SG SG10202005438WA patent/SG10202005438WA/en unknown
- 2013-06-13 MY MYPI2013701000A patent/MY164088A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014002818A (ja) | 2014-01-09 |
MY164088A (en) | 2017-11-30 |
SG10202005438WA (en) | 2020-07-29 |
JP5613723B2 (ja) | 2014-10-29 |
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