MY162332A - Hydrous cutting fluid for slicing silicon ingot - Google Patents

Hydrous cutting fluid for slicing silicon ingot

Info

Publication number
MY162332A
MY162332A MYPI2013003499A MYPI2013003499A MY162332A MY 162332 A MY162332 A MY 162332A MY PI2013003499 A MYPI2013003499 A MY PI2013003499A MY PI2013003499 A MYPI2013003499 A MY PI2013003499A MY 162332 A MY162332 A MY 162332A
Authority
MY
Malaysia
Prior art keywords
cutting fluid
silicon ingot
hydroxyl groups
cutting
slicing
Prior art date
Application number
MYPI2013003499A
Other languages
English (en)
Inventor
Tsuyoshi Fukushima
Yoshitaka Katsukawa
Seiji Yamashita
Original Assignee
Sanyo Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Chemical Ind Ltd filed Critical Sanyo Chemical Ind Ltd
Publication of MY162332A publication Critical patent/MY162332A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20—Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M107/32—Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
    • C10M107/34—Polyoxyalkylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/04—Molecular weight; Molecular weight distribution
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/32—Wires, ropes or cables lubricants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Lubricants (AREA)
MYPI2013003499A 2011-03-31 2012-03-29 Hydrous cutting fluid for slicing silicon ingot MY162332A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011081147 2011-03-31
JP2011165978 2011-07-28

Publications (1)

Publication Number Publication Date
MY162332A true MY162332A (en) 2017-05-31

Family

ID=46930220

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003499A MY162332A (en) 2011-03-31 2012-03-29 Hydrous cutting fluid for slicing silicon ingot

Country Status (5)

Country Link
JP (1) JP5634428B2 (ja)
KR (1) KR101577588B1 (ja)
CN (1) CN103502409B (ja)
MY (1) MY162332A (ja)
WO (1) WO2012132448A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6039935B2 (ja) * 2012-06-29 2016-12-07 出光興産株式会社 水性加工液
JP5913409B2 (ja) * 2013-03-26 2016-04-27 三洋化成工業株式会社 含水切削液
JP2015071750A (ja) * 2013-09-04 2015-04-16 三洋化成工業株式会社 金属加工品の製造方法
CN104911007A (zh) * 2014-03-10 2015-09-16 吉坤日矿日石能源株式会社 水溶性切削油原液组合物、切削油组合物和切削加工方法
CN105062650A (zh) * 2015-08-11 2015-11-18 苏州市宝玛数控设备有限公司 硬脆性材料水基切割液
JP7104541B2 (ja) * 2018-03-30 2022-07-21 出光興産株式会社 脆性材料加工液組成物
JP6843910B2 (ja) * 2018-04-06 2021-03-17 三洋化成工業株式会社 金属加工用基油
CN113337326B (zh) * 2020-06-10 2023-05-23 沙索(中国)化学有限公司 一种包含水溶性的基于甘油的聚亚烷基二醇的水性组合物及其用途
JP2022157907A (ja) * 2021-03-31 2022-10-14 出光興産株式会社 加工液、加工液用組成物及び脆性材料加工液組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953793B2 (ja) * 2000-11-30 2007-08-08 三洋化成工業株式会社 潤滑剤
JP2003082336A (ja) * 2001-09-12 2003-03-19 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
CN100516184C (zh) * 2003-03-24 2009-07-22 三洋化成工业株式会社 水系金属加工油用润滑剂
JP2005179630A (ja) * 2003-03-24 2005-07-07 Sanyo Chem Ind Ltd 水系金属加工油用潤滑剤
JP5208409B2 (ja) * 2006-12-15 2013-06-12 花王株式会社 洗浄剤組成物
JP5089179B2 (ja) * 2007-01-19 2012-12-05 Ｊｘ日鉱日石エネルギー株式会社 極微量油剤供給式切削・研削加工方法
JP5506235B2 (ja) * 2009-04-24 2014-05-28 日本写真印刷株式会社 艶消し状導電性ナノファイバーシート及びその製造方法
JP2010254813A (ja) * 2009-04-24 2010-11-11 Kyodo Yushi Co Ltd 金属加工用油剤、金属加工方法及び金属加工品
JP2011005818A (ja) * 2009-06-29 2011-01-13 Sumco Corp 太陽電池用シリコンインゴットの切断方法
JP2012230929A (ja) * 2009-08-28 2012-11-22 Sumco Corp 太陽電池用シリコンウェーハおよびその製造方法
TWI432568B (zh) * 2009-08-31 2014-04-01 Sanyo Chemical Ind Ltd 矽錠切片用水溶性切削液

Also Published As

Publication number Publication date
WO2012132448A1 (ja) 2012-10-04
CN103502409B (zh) 2015-08-19
JP2013047319A (ja) 2013-03-07
JP5634428B2 (ja) 2014-12-03
KR20140009333A (ko) 2014-01-22
KR101577588B1 (ko) 2015-12-15
CN103502409A (zh) 2014-01-08

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