MY162332A - Hydrous cutting fluid for slicing silicon ingot - Google Patents

Hydrous cutting fluid for slicing silicon ingot

Info

Publication number
MY162332A
MY162332A MYPI2013003499A MYPI2013003499A MY162332A MY 162332 A MY162332 A MY 162332A MY PI2013003499 A MYPI2013003499 A MY PI2013003499A MY PI2013003499 A MYPI2013003499 A MY PI2013003499A MY 162332 A MY162332 A MY 162332A
Authority
MY
Malaysia
Prior art keywords
cutting fluid
silicon ingot
hydroxyl groups
cutting
slicing
Prior art date
Application number
MYPI2013003499A
Inventor
Tsuyoshi Fukushima
Yoshitaka Katsukawa
Seiji Yamashita
Original Assignee
Sanyo Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Chemical Ind Ltd filed Critical Sanyo Chemical Ind Ltd
Publication of MY162332A publication Critical patent/MY162332A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00—Lubricating compositions containing more than 10% water
    • C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M107/00—Lubricating compositions characterised by the base-material being a macromolecular compound
    • C10M107/20—Lubricating compositions characterised by the base-material being a macromolecular compound containing oxygen
    • C10M107/30—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M107/32—Condensation polymers of aldehydes or ketones; Polyesters; Polyethers
    • C10M107/34—Polyoxyalkylenes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
    • C10N2020/01—Physico-chemical properties
    • C10N2020/04—Molecular weight; Molecular weight distribution
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2040/00—Specified use or application for which the lubricating composition is intended
    • C10N2040/32—Wires, ropes or cables lubricants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Lubricants (AREA)

Abstract

A CUTTING FLUID WHICH, IN THE STEP OF CUTTING A SILICON INGOT, IS SUPERIOR TO CONVENTIONAL PRODUCTS IN THE REMOVAL OF PROCESSING HEAT, INFILTRATION PROPERTY, INHIBITION OF REACTION BETWEEN WATER AND THE SILICON, AND ANTI-FOAMING PROPERTY TO THEREBY ATTAIN AN IMPROVEMENT IN CUTTING EFFICIENCY, IS PROVIDED AND WITH WHICH SILICON WAFERS HAVING SATISFACTORY FLATNESS ARE YIELDED. THE ACCURACY OF THE PROCESSED SURFACE CAN BE KEPT HIGH EVEN UNDER SEVERE SLICING CONDITIONS. THE CUTTING FLUID IS A HYDROUS CUTTING FLUID FOR SLICING SILICON INGOT, CHARACTERIZED BY COMPRISING A POLYOXYALKYLENE ADDUCT (A) OF A COMPOUND (A) HAVING 3-8 HYDROXYL GROUPS, THE ADDUCT (A) BEING REPRESENTED BY GENERAL FORMULA (1), AND WATER AS ESSENTIAL COMPONENTS, THE POLYOXYALKYLENE ADDUCT (A) HAVING AN HLB OF 6.0-20.0. R {O-(A1 O) M-H} R (1), WHEREIN IN FORMULA (1), R REPRESENTS THE RESIDUE FORMED BY REMOVING THE HYDROXYL GROUPS FROM A COMPOUND HAVING 3-8 HYDROXYL GROUPS; (A10) REPRESENTS A C2-4 OXYALKYLENE; M, INDICATING THE AVERAGE NUMBER OF MOLES OF A C2-4 ALKYLENE OXIDE WHICH HAS ADDED, IS A NUMBER OF 1 -350; AND F IS AN INTEGER OF 3-8.
MYPI2013003499A 2011-03-31 2012-03-29 Hydrous cutting fluid for slicing silicon ingot MY162332A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011081147 2011-03-31
JP2011165978 2011-07-28

Publications (1)

Publication Number Publication Date
MY162332A true MY162332A (en) 2017-05-31

Family

ID=46930220

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003499A MY162332A (en) 2011-03-31 2012-03-29 Hydrous cutting fluid for slicing silicon ingot

Country Status (5)

Country Link
JP (1) JP5634428B2 (en)
KR (1) KR101577588B1 (en)
CN (1) CN103502409B (en)
MY (1) MY162332A (en)
WO (1) WO2012132448A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6039935B2 (en) * 2012-06-29 2016-12-07 出光興産株式会社 Aqueous processing fluid
JP5913409B2 (en) * 2013-03-26 2016-04-27 三洋化成工業株式会社 Hydrous cutting fluid
JP2015071750A (en) * 2013-09-04 2015-04-16 三洋化成工業株式会社 Method for manufacturing metal workpiece
CN104911007A (en) * 2014-03-10 2015-09-16 吉坤日矿日石能源株式会社 Water-soluble cutting oil raw liquid composition, cutting oil composition and cutting processing method
CN105062650A (en) * 2015-08-11 2015-11-18 苏州市宝玛数控设备有限公司 Water-based cutting fluid for hard and brittle materials
JP7104541B2 (en) * 2018-03-30 2022-07-21 出光興産株式会社 Brittle material processing liquid composition
JP6843910B2 (en) * 2018-04-06 2021-03-17 三洋化成工業株式会社 Base oil for metal processing
CN113337326B (en) 2020-06-10 2023-05-23 沙索(中国)化学有限公司 Aqueous composition comprising a water-soluble glycerol-based polyalkylene glycol and use thereof
JP2022157907A (en) * 2021-03-31 2022-10-14 出光興産株式会社 Working fluid, working fluid composition and brittle material working fluid composition

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3953793B2 (en) * 2000-11-30 2007-08-08 三洋化成工業株式会社 lubricant
JP2003082336A (en) * 2001-09-12 2003-03-19 Asahi Denka Kogyo Kk Aqueous lapping solution and aqueos lapping agent
CN100516184C (en) * 2003-03-24 2009-07-22 三洋化成工业株式会社 Lubricant for water-miscible metal working oil
JP2005179630A (en) * 2003-03-24 2005-07-07 Sanyo Chem Ind Ltd Aqueous lubricant for metal-processing oil
JP5208409B2 (en) * 2006-12-15 2013-06-12 花王株式会社 Cleaning composition
JP5089179B2 (en) * 2007-01-19 2012-12-05 Ｊｘ日鉱日石エネルギー株式会社 Cutting / grinding method with ultra-trace oil supply
JP2010254813A (en) * 2009-04-24 2010-11-11 Kyodo Yushi Co Ltd Metal forming oil, metal forming method and metal formed product
JP5506235B2 (en) * 2009-04-24 2014-05-28 日本写真印刷株式会社 Matte-like conductive nanofiber sheet and method for producing the same
JP2011005818A (en) * 2009-06-29 2011-01-13 Sumco Corp Method for cutting of silicon ingot for solar cell
JP2012230929A (en) * 2009-08-28 2012-11-22 Sumco Corp Solar cell silicon wafer and manufacturing method thereof
CN102482613B (en) * 2009-08-31 2016-01-20 三洋化成工业株式会社 The manufacture method of water-soluble metalworking liquid, slicing silicon ingots, Silicon Wafer and electronic material

Also Published As

Publication number Publication date
CN103502409B (en) 2015-08-19
WO2012132448A1 (en) 2012-10-04
KR20140009333A (en) 2014-01-22
JP2013047319A (en) 2013-03-07
CN103502409A (en) 2014-01-08
JP5634428B2 (en) 2014-12-03
KR101577588B1 (en) 2015-12-15

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