CN102453595A - Cutting fluid specially used for semiconductor - Google Patents
Cutting fluid specially used for semiconductor Download PDFInfo
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- CN102453595A CN102453595A CN2010105134659A CN201010513465A CN102453595A CN 102453595 A CN102453595 A CN 102453595A CN 2010105134659 A CN2010105134659 A CN 2010105134659A CN 201010513465 A CN201010513465 A CN 201010513465A CN 102453595 A CN102453595 A CN 102453595A
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- cutting fluid
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Abstract
The invention discloses cutting fluid specially used for a semiconductor, the cutting fluid is synthesized by using a special technological formula. The cutting fluid has the advantages of no peculiar smell, no volatilization, low flammability and stable chemical performance, is mainly used for multi-wire saw of solar wafers, and has the functions of suspension, dispersion and cooling, and can be dissolved in water. The cutting fluid specially used for semiconductor is an ideal green environment-friendly product which can replace an import product and reduce the cost. The cutting fluid of the invention has excellent lubricity and rust-inhibiting property, and wetability and cooling performance required during high speed cutting, and can be used for cutting various semi-conducting materials and general non ferrous metals.
Description
Technical field
The present invention relates to a kind of alkaline semiconductor silicon material water base cutting liquid that is used for silicon wafer and other compound semiconductor materials crystal block cutting, specifically, relate to the special-purpose cutting of a kind of semi-conductor liquid.
Background technology
Present domestic proposition is about the invention document of semi-conductor cutting fluid; For example; A kind of alkaline semiconductor silicon material water base cutting liquid that is used for silicon wafer and other compound semiconductor materials crystal block cutting of Hebei University of Technology invention mainly contains polyoxyethylene glycol, pH value regulator, sequestrant and forms, and can make that single mechanical effect changes uniform and stable chemical machinery effect in the section; Solved the stress problem in the slice process and reduced damage, reduced the silicon chip surface fine fisssure with broken.A kind of water-soluble metalworking liquid that is used for hard brittle material processing of Liaoning AoKe Chemical Co., Ltd's invention; Form by having gathered oxycompound, anti-extreme pressure chelating anti-settling agent, dissolution accelerator, this cutting fluid can be in the application aspect the processing of silicon single crystal, polysilicon, InGaN or jewel.
Summary of the invention
The object of the present invention is to provide a kind of new exclusive cutting fluid, can effectively reduce surface tension, the power of reducing friction, cutting blade is thin, and yield rate obviously is superior to the lubricated product of other cutting.
The present invention relates to a kind of alkaline semiconductor silicon material water base cutting liquid that is used for silicon wafer and other compound semiconductor materials crystal block cutting; Mainly form by polyoxyethylene glycol, pH value regulator, sequestrant; Its component and production concentration mass fraction are: molecular weight 200-1000 polyoxyethylene glycol 30-90; PH value regulator 9-30, sequestrant 1-10, deionized water surplus.The present invention will have now neutral cutting fluid be improved to have chemical slabbing action and with the alkaline cutting fluid of silicon generation chemical reaction; Make that single mechanical effect changes uniform and stable chemical machinery effect in the section; Solved the stress problem in the slice process effectively and reduced damage, reduced the silicon chip surface fine fisssure with broken.Make following process removal amount few, both improved slice efficiency and yield rate, solved the sedimentary again problem of smear metal and pelletizing powder effectively, avoided the chemically bonded adsorption phenomena of silicon chip surface.
The special-purpose cutting of above-mentioned semi-conductor liquid, be preferable over gather second two liquor-saturated with oxyethane be raw material, form by sequestrant pH value regulator.
The special-purpose cutting of above-mentioned semi-conductor liquid is preferable over specific conductivity less than 0.4.
The special-purpose cutting of above-mentioned semi-conductor liquid is preferable over organic alcohol, oxyethane, catalyzer adding reactor drum polyreaction (airtight), produces product (alcohol ether) through neutralization.Temperature of reaction is the 130-140 degree.
In terms of existing technologies, overcome and cut the shortcoming that the liquid use range is big, specific aim is not strong in the past, the cutting that aims at solar silicon wafers is used, and stronger to different multi-line cutting machine flexibility.This new exclusive cutting fluid has following advantage:
1, reduces RM and response procedures.2, the development new catalyst improves reaction efficiency, reduces the product specific conductivity.3, the molecular weight size is even, and surface tension is little, and band sand ability is strong.4, cleansing power is strong, and dispersion agent is a permeate agent, and cleansing power is strong.5, do not adsorb silicon chip, reached silicon chip alkali matter and dissolved the requirement of dissolving with sour matter.
Description of drawings
Fig. 1 is a patent process flow sheet of the present invention.
Embodiment
For make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, below in conjunction with accompanying drawing and embodiment the present invention done further detailed explanation.
With reference to Fig. 1, Fig. 1 is the process flow sheet of the special-purpose cutting fluid embodiment of the present invention, and step is: in advance oxyethane is pressed into the workshop test tank with nitrogen; By processing requirement polyoxyethylene glycol, sodium hydroxide (catalyzer) are dropped into reaction kettle; Stir, slowly be pressed into oxyethane (nitrogen force feed) then, heating (steam) heats up; 130-140 ℃ of reaction, reaction formula is following:
Reaction with closing still in the vacuum suction, drops into quantitative properties-correcting agent with reaction mass after finishing, and stirs certain hour at 40 ℃, then is the novel cutting fluid of this product.
More than the special-purpose cutting fluid of a kind of semi-conductor provided by the present invention is described in detail; Used specific embodiment among this paper principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, part all can change on embodiment and range of application.In sum, this description should not be construed as limitation of the present invention.
Claims (4)
1. the special-purpose cutting fluid of semi-conductor is characterized in that, mainly is made up of polyoxyethylene glycol, pH value regulator, sequestrant; Its component and production concentration mass fraction are: molecular weight 200-1000 polyoxyethylene glycol 30-90; PH value regulator 9-30, sequestrant 1-10, deionized water surplus.
2. the special-purpose cutting fluid of semi-conductor according to claim 1 is characterized in that, with gather second two liquor-saturated with oxyethane be raw material, form by sequestrant p H value regulator.
3. the special-purpose cutting fluid of semi-conductor according to claim 1 is characterized in that novel cutting fluid specific conductivity is less than 0.4.
4. the special-purpose cutting fluid of semi-conductor according to claim 1 is characterized in that, adds reactor drum polyreaction (airtight) by machine alcohol, oxyethane, catalyzer, produces product (alcohol ether) through neutralization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105134659A CN102453595A (en) | 2010-10-21 | 2010-10-21 | Cutting fluid specially used for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105134659A CN102453595A (en) | 2010-10-21 | 2010-10-21 | Cutting fluid specially used for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102453595A true CN102453595A (en) | 2012-05-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105134659A Pending CN102453595A (en) | 2010-10-21 | 2010-10-21 | Cutting fluid specially used for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102453595A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102784977A (en) * | 2012-07-31 | 2012-11-21 | 江南大学 | Silicon crystal line cutting fluid |
| CN104673472A (en) * | 2013-11-28 | 2015-06-03 | 深圳市富兰克科技有限公司 | Silicon crystal cutting fluid |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858169A (en) * | 2006-05-31 | 2006-11-08 | 河北工业大学 | Semiconductor silicon material water base cutting liquid |
-
2010
- 2010-10-21 CN CN2010105134659A patent/CN102453595A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1858169A (en) * | 2006-05-31 | 2006-11-08 | 河北工业大学 | Semiconductor silicon material water base cutting liquid |
Non-Patent Citations (1)
| Title |
|---|
| 赵地顺: "《相转移催化原理及应用》", 30 June 2007, article "聚乙二醇的合成", pages: 54 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102784977A (en) * | 2012-07-31 | 2012-11-21 | 江南大学 | Silicon crystal line cutting fluid |
| CN104673472A (en) * | 2013-11-28 | 2015-06-03 | 深圳市富兰克科技有限公司 | Silicon crystal cutting fluid |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120516 |