JP2012172117A5 - - Google Patents

Download PDF

Info

Publication number
JP2012172117A5
JP2012172117A5 JP2011037634A JP2011037634A JP2012172117A5 JP 2012172117 A5 JP2012172117 A5 JP 2012172117A5 JP 2011037634 A JP2011037634 A JP 2011037634A JP 2011037634 A JP2011037634 A JP 2011037634A JP 2012172117 A5 JP2012172117 A5 JP 2012172117A5
Authority
JP
Japan
Prior art keywords
mass
water
less
abrasive wire
fixed abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011037634A
Other languages
Japanese (ja)
Other versions
JP2012172117A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011037634A priority Critical patent/JP2012172117A/en
Priority claimed from JP2011037634A external-priority patent/JP2012172117A/en
Priority to KR1020137024673A priority patent/KR20140018265A/en
Priority to PCT/JP2012/054115 priority patent/WO2012115099A1/en
Priority to EP12749002.7A priority patent/EP2679661A4/en
Priority to SG2013047295A priority patent/SG191245A1/en
Priority to CN201280008985.1A priority patent/CN103391992B/en
Priority to TW101105989A priority patent/TWI521057B/en
Publication of JP2012172117A publication Critical patent/JP2012172117A/en
Publication of JP2012172117A5 publication Critical patent/JP2012172117A5/ja
Pending legal-status Critical Current

Links

Claims (6)

（Ｃ）カルボン酸と、（Ｄ）水に溶解して塩基性を示す化合物と、（Ｅ）水と、を含み、
さらに、（Ａ）アルコールとエチレンオキサイドとプロピレンオキサイドとの共重合体、及びポリオキシアルキレングリコール類から選ばれる少なくとも一種類以上のノニオン系界面活性剤を含み、
２５℃における電気伝導度が３００μＳ／ｃｍ以上３０００μＳ／ｃｍ以下であり、
２５℃におけるｐＨが５以上１０以下であり、
平均粒子径１．５μｍのシリコン粉を１０質量％添加し撹拌して形成した擬似使用液の粘度が、２５℃で３０ｍＰａ・ｓ未満である、
固定砥粒ワイヤソー用水溶性加工液。 (C) a carboxylic acid, (D) a compound that dissolves in water and exhibits basicity, and (E) water,
And (A) a copolymer of alcohol, ethylene oxide and propylene oxide, and at least one nonionic surfactant selected from polyoxyalkylene glycols,
The electrical conductivity at 25 ° C. is 300 μS / cm or more and 3000 μS / cm or less,
PH at 25 ° C. is 5 or more and 10 or less,
The viscosity of the pseudo use liquid formed by adding 10% by mass of silicon powder having an average particle size of 1.5 μm and stirring is less than 30 mPa · s at 25 ° C.,
Water-soluble machining fluid for fixed abrasive wire saws. さらに、（Ｂ）グリコール類を含む、請求項１に記載の固定砥粒ワイヤソー用水溶性加工液。 Further, (B) including glycols, fixed abrasive wire saw aqueous machining fluid of Claim 1. （Ａ）アルコールとエチレンオキサイドとプロピレンオキサイドとの共重合体、及びポリオキシアルキレングリコール類のうち少なくとも１種類以上のノニオン系界面活性剤を０．１質量％以上８質量％以下と、
（Ｂ）グリコール類を０．１質量％以上８０質量％以下と、
（Ｃ）カルボン酸を０．０１質量％以上５質量％以下と、
（Ｄ）水に溶解して塩基性を示す化合物を０．０１質量％以上７質量％以下と、
（Ｅ）水と、を含み、
２５℃における電気伝導度が３００μＳ／ｃｍ以上３０００μＳ／ｃｍ以下であり、
２５℃におけるｐＨが５以上１０以下であり、
平均粒子径１．５μｍのシリコン粉を１０質量％添加し撹拌して形成した擬似使用液の粘度が、２５℃で３０ｍＰａ・ｓ未満である、
固定砥粒ワイヤソー用水溶性加工液。 (A) 0.1% by mass or more and 8% by mass or less of at least one nonionic surfactant among a copolymer of alcohol, ethylene oxide and propylene oxide, and polyoxyalkylene glycols;
(B) 0.1 to 80% by mass of glycols,
(C) 0.01% by mass or more and 5% by mass or less of carboxylic acid,
(D) 0.01% by mass or more and 7% by mass or less of a compound that is dissolved in water and exhibits basicity;
(E) including water,
The electrical conductivity at 25 ° C. is 300 μS / cm or more and 3000 μS / cm or less,
PH at 25 ° C. is 5 or more and 10 or less,
The viscosity of the pseudo use liquid formed by adding 10% by mass of silicon powder having an average particle size of 1.5 μm and stirring is less than 30 mPa · s at 25 ° C.,
Water-soluble machining fluid for fixed abrasive wire saws. ２５℃における表面張力が２０ｍＮ／ｍ以上５０ｍＮ／ｍ以下である、請求項１〜３のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 The water-soluble processing liquid for fixed-abrasive wire saws according to any one of claims 1 to 3 , wherein the surface tension at 25 ° C is 20 mN / m or more and 50 mN / m or less. さらに、水溶性高分子及び／または消泡剤を含む、請求項１〜４のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 Furthermore, the water-soluble processing liquid for fixed abrasive wire saws in any one of Claims 1-4 containing a water-soluble polymer and / or an antifoamer. 固定砥粒ワイヤソー用水溶性加工液全体の質量を１００質量％として、前記（Ｅ）水を１０質量％以上９９．７質量％以下含む、請求項１〜５のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 The fixed abrasive wire saw according to any one of claims 1 to 5 , comprising (E) 10 mass% or more and 99.7 mass% or less of the water based on the total mass of the water-soluble processing liquid for fixed abrasive wire saw as 100 mass%. Water-soluble processing fluid.
JP2011037634A 2011-02-23 2011-02-23 Water-soluble working fluid for fixed abrasive grain wire saw Pending JP2012172117A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011037634A JP2012172117A (en) 2011-02-23 2011-02-23 Water-soluble working fluid for fixed abrasive grain wire saw
KR1020137024673A KR20140018265A (en) 2011-02-23 2012-02-21 Water-soluble working fluid for fixed abrasive grain wire saw
PCT/JP2012/054115 WO2012115099A1 (en) 2011-02-23 2012-02-21 Water-soluble working fluid for fixed abrasive grain wire saw
EP12749002.7A EP2679661A4 (en) 2011-02-23 2012-02-21 Water-soluble working fluid for fixed abrasive grain wire saw
SG2013047295A SG191245A1 (en) 2011-02-23 2012-02-21 Water-soluble working fluid for fixed- abrasive wire saw
CN201280008985.1A CN103391992B (en) 2011-02-23 2012-02-21 Water-soluble working fluid for fixed-abrasive wire saw
TW101105989A TWI521057B (en) 2011-02-23 2012-02-23 Water-soluble working fluid for fixed abrasive grain wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011037634A JP2012172117A (en) 2011-02-23 2011-02-23 Water-soluble working fluid for fixed abrasive grain wire saw

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014046547A Division JP5750525B2 (en) 2014-03-10 2014-03-10 Water-soluble machining fluid for fixed abrasive wire saws

Publications (2)

Publication Number Publication Date
JP2012172117A JP2012172117A (en) 2012-09-10
JP2012172117A5 true JP2012172117A5 (en) 2013-11-14

Family

ID=46720876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011037634A Pending JP2012172117A (en) 2011-02-23 2011-02-23 Water-soluble working fluid for fixed abrasive grain wire saw

Country Status (7)

Country Link
EP (1) EP2679661A4 (en)
JP (1) JP2012172117A (en)
KR (1) KR20140018265A (en)
CN (1) CN103391992B (en)
SG (1) SG191245A1 (en)
TW (1) TWI521057B (en)
WO (1) WO2012115099A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112012003393A5 (en) * 2011-08-15 2014-07-10 Borer Chemie Ag Cutting solution for cooling and lubricating a cutting wire with fixed cutting means
JP5988995B2 (en) * 2011-11-15 2016-09-07 花王株式会社 Processing method of cutting oil composition for used fixed abrasive wire saw
JP6039935B2 (en) * 2012-06-29 2016-12-07 出光興産株式会社 Aqueous processing fluid
EP2900797B1 (en) 2012-12-06 2018-05-23 Dow Global Technologies LLC Process of cutting a hard, brittle material
JP6204029B2 (en) * 2013-03-06 2017-09-27 出光興産株式会社 Aqueous processing fluid
EP3333245B1 (en) * 2015-08-06 2019-09-18 Mitsubishi Gas Chemical Company, Inc. Cutting auxiliary lubricant and cutting method
JP6639283B2 (en) * 2016-03-14 2020-02-05 株式会社ディスコ Failure detection method
CN106118838A (en) * 2016-06-22 2016-11-16 上海尤希路化学工业有限公司 Circulation and stress can be diluted and use photovoltaic silicon wafer wire cutting liquid
CN106675751B (en) * 2016-12-20 2020-04-10 广东山之风环保科技有限公司 Glass cutting fluid
JP7021998B2 (en) * 2018-04-02 2022-02-17 ユシロ化学工業株式会社 Water-soluble processing oil for fixed-abrasive wire saws, processing liquid for fixed-abrasive wire saws, cutting processing methods and used processing liquid processing methods
CN111267256A (en) * 2020-02-20 2020-06-12 天津中环领先材料技术有限公司 Cutting process for improving surface nanotopography of large-diameter silicon wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001054850A (en) 1999-08-11 2001-02-27 Osaka Diamond Ind Co Ltd Hard brittle material cutting method by means of fixed abrasive grain wire saw
JP4497767B2 (en) * 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
JP4497768B2 (en) * 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
TW575660B (en) * 2001-09-07 2004-02-11 Dai Ichi Kogyo Seiyaku Co Ltd Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid
JP4481898B2 (en) * 2005-07-25 2010-06-16 ユシロ化学工業株式会社 Water-based abrasive dispersion medium composition
US20120058924A1 (en) * 2009-03-31 2012-03-08 Idemitsu Kosan Co., Ltd. Working fluid for brittle material and working fluid for hard material
JP5679642B2 (en) * 2009-07-15 2015-03-04 ユシロ化学工業株式会社 Water-soluble machining fluid for fixed abrasive wire saws
JP5420498B2 (en) * 2010-08-03 2014-02-19 ユシロ化学工業株式会社 Water-soluble machining fluid for fixed abrasive wire saws

Similar Documents

Publication Publication Date Title
JP2012172117A5 (en)
TWI413681B (en) Slurry composition containing non-ionic polymer and method for use
JP2014505358A5 (en)
JP2017186574A5 (en)
WO2012142374A3 (en) Compositions and methods for selective polishing of silicon nitride materials
JP6039935B2 (en) Aqueous processing fluid
JP2013540849A5 (en)
JP2010537404A5 (en)
JP5679642B2 (en) Water-soluble machining fluid for fixed abrasive wire saws
MY157114A (en) Silicon polishing compositions with high rate and low defectivity
TWI618793B (en) Water-based processing fluid
TW201241171A (en) Water-soluble working fluid for fixed abrasive grain wire saw
JP2016532549A5 (en)
JP2014527298A5 (en)
JP2015521147A5 (en)
JP2019117904A (en) Polishing composition
RU2015103813A (en) COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING (СМР), CONTAINING A NON-ION SURFACE-ACTIVE SUBSTANCE AND CARBONATE SALT
WO2014006546A3 (en) Chemical mechanical polishing composition comprising non-ionic surfactant and aromatic compound comprising at least one acid group
JP2013527985A5 (en)
JP2012035336A5 (en)
CN101935596A (en) Polishing post-cleaning solution of sulfur series compound phase-change material
TWI604025B (en) Polishing composition
KR101788901B1 (en) Aqueous processing solution for fixed abrasive grain wire saw
JP2012512757A5 (en)
RU2010107314A (en) COPPER BOND FOR PRODUCING DIAMOND TOOLS