JP6639283B2 - Failure detection method - Google Patents

Failure detection method Download PDF

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JP6639283B2
JP6639283B2 JP2016049644A JP2016049644A JP6639283B2 JP 6639283 B2 JP6639283 B2 JP 6639283B2 JP 2016049644 A JP2016049644 A JP 2016049644A JP 2016049644 A JP2016049644 A JP 2016049644A JP 6639283 B2 JP6639283 B2 JP 6639283B2
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additive
transfer pump
injection
liquid
addition amount
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JP2017164826A (en
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新井 賢
賢 新井
吉田 幹
幹 吉田
正喜 内田
正喜 内田
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Disco Corp
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Disco Corp
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Priority to TW106104797A priority patent/TWI712464B/en
Priority to CN201710134157.7A priority patent/CN107186900B/en
Priority to KR1020170030405A priority patent/KR102251264B1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20Investigating the presence of flaws
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/06Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a liquid
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/22Measuring resistance of fluids

Description

本発明は、加工液への添加剤の注入不良を検出する不良検出方法に関する。   The present invention relates to a defect detection method for detecting a defect in injection of an additive into a working fluid.

半導体ウェーハに代表される被加工物の静電破壊や、加工時に発生する屑(加工屑)等の被加工物への付着を防ぐために、帯電防止用の添加剤が注入、混合された加工液を用いて被加工物を加工することがある。加工液への添加剤の注入は、例えば、加工液供給装置で行われる(例えば、特許文献1参照)。   Processing fluid into which antistatic additives are injected and mixed in order to prevent electrostatic breakdown of workpieces represented by semiconductor wafers and adhesion of workpieces such as debris (working debris) generated during processing. In some cases, the workpiece is processed by using the. The injection of the additive into the working fluid is performed, for example, by a working fluid supply device (for example, see Patent Document 1).

ところが、この加工液供給装置では、添加剤の流路となる配管(チューブ)が折れ曲がったり、流路内にエアーや粉塵等の異物が侵入したりして、必要な分量の添加剤を加工液に注入できないことがあった。そこで、加工液の導電率や比抵抗率等を計測し、その値に基づいて適切な分量の添加剤が注入されたか否かを判定する方法等も検討されている。   However, in this processing liquid supply device, a pipe (tube) serving as a flow path of the additive is bent or a foreign substance such as air or dust enters the flow path, so that a necessary amount of the processing liquid is supplied to the processing liquid. Could not be injected. Therefore, a method of measuring the conductivity, specific resistivity, and the like of the working fluid, and determining whether or not an appropriate amount of the additive is injected based on the values has been studied.

特開2007−222963号公報JP 2007-222963 A

しかしながら、上述した方法では、導電率や比抵抗率等を計測する計測器に異常があると、例えば、適切な分量の添加剤が注入されていないにも関わらず、注入されたと誤判定する可能性がある。本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、添加剤の注入不良を適切に判定できる不良検出方法を提供することである。   However, in the above-described method, if there is an abnormality in the measuring device that measures the conductivity, the specific resistivity, and the like, for example, it is possible to erroneously determine that the additive is injected even though the appropriate amount of the additive is not injected. There is. The present invention has been made in view of such a problem, and an object of the present invention is to provide a failure detection method capable of appropriately determining an injection failure of an additive.

本発明の一態様によれば、一端が液体供給源に接続され他端が加工装置に接続された流路に配設され該流路を流れる液体の流量を計測する流量計と、該液体に添加される添加剤を収容する添加剤容器と、該添加剤容器から供給される添加剤を貯留する貯留容器と、所定量の該添加剤が該貯留容器に常に貯留された状態となるように該添加剤を該添加剤容器から該貯留容器へと移送する移送ポンプと、該流路の該流量計より下流側に該貯留容器の該添加剤を注入する注入ポンプと、該液体に該添加剤を添加して生成される加工液の導電率または電気抵抗率を計測する計測器と、を備える加工液供給装置において添加剤の注入不良を検出する不良検出方法であって、該加工液中の該添加剤の濃度を設定する濃度設定ステップと、該濃度設定ステップで設定された該添加剤の濃度と、該流量計で計測された該液体の流量と、をもとに該添加剤の添加量を算出する添加量算出ステップと、該添加量算出ステップで算出された添加量で該添加剤を該流路注入する際に、移送ポンプの作動時間が適切か否かを判別する移送ポンプ作動判別ステップと、該移送ポンプ作動判別ステップで該移送ポンプの作動時間が適切ではないと判別された場合に、該添加剤の注入不良と判定する判定ステップと、を備えることを特徴とする不良検出方法が提供される。 According to one aspect of the present invention, a flowmeter is provided, one end of which is connected to a liquid supply source and the other end of which is disposed in a flow path connected to a processing device and measures the flow rate of liquid flowing through the flow path. An additive container that stores the additive to be added, a storage container that stores the additive supplied from the additive container, and a predetermined amount of the additive that is always stored in the storage container. A transfer pump for transferring the additive from the additive container to the storage container, an injection pump for injecting the additive in the storage container downstream of the flow meter in the flow path, and adding the additive to the liquid. a defect detection method for detecting the additive injection failure in the processing fluid supply apparatus and a measuring device for measuring the conductivity or electrical resistivity of the machining fluid that is generated by the addition of agents, the working fluid A concentration setting step of setting the concentration of the additive, An addition amount calculation step of calculating an addition amount of the additive based on the concentration of the additive set in the above and the flow rate of the liquid measured by the flow meter, and an addition amount calculation step. when injecting the additive into the flow path in the amount that is, with the transfer pump operation determining step operating time of the transfer pump is to determine whether it is appropriate, the operation of said transfer pump at said transfer pump operation determination step A determining step of determining that the injection of the additive is defective when the time is determined to be inappropriate is provided.

本発明の一態様において、該判定ステップで該添加剤の注入不良と判定された場合に、警告を発する警告ステップを更に備えることが好ましい。   In one embodiment of the present invention, it is preferable that the method further includes a warning step of issuing a warning when it is determined in the determination step that the injection of the additive is defective.

また、本発明の一態様において、該判定ステップで該添加剤の注入不良と判定された場合に、該加工装置の稼働を停止させる停止信号を発して該加工装置の稼働を停止させる加工装置停止ステップを更に備えることが好ましい。   Further, in one embodiment of the present invention, when it is determined in the determination step that the injection of the additive is defective, a processing device stop that issues a stop signal to stop the operation of the processing device and stops the operation of the processing device. Preferably, the method further comprises a step.

本発明の一態様に係る不良検出方法では、添加剤を所定の添加量で添加する際に、移送ポンプの作動時間が適切か否かを判別し、その結果に基づいて添加剤が適切に注入されているか否かを判定するので、加工液の導電率や比抵抗率等を計測する計測器に異常がある場合等でも、添加剤の注入不良を適切に判定できる。   In the defect detection method according to one aspect of the present invention, when the additive is added in a predetermined addition amount, it is determined whether or not the operation time of the transfer pump is appropriate, and the additive is appropriately injected based on the result. Since it is determined whether or not the injection has been performed, it is possible to appropriately determine the injection failure of the additive even when there is an abnormality in the measuring device that measures the conductivity, the specific resistivity, and the like of the working fluid.

加工液供給装置が併設された切削装置の構成例を模式的に示す斜視図である。It is a perspective view which shows typically the example of a structure of the cutting device with which the working fluid supply device was installed. 加工液供給装置等の構成例を模式的に示す図である。It is a figure which shows the example of a structure of a working-fluid supply apparatus typically.

添付図面を参照して、本発明の一態様に係る実施形態について説明する。本実施形態に係る不良検出方法は、濃度設定ステップ、添加量算出ステップ、移送ポンプ作動判別ステップ、判定ステップ、警告ステップ及び装置停止ステップ(加工装置停止ステップ)を含む。   An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. The defect detection method according to the present embodiment includes a concentration setting step, an addition amount calculation step, a transfer pump operation determination step, a determination step, a warning step, and an apparatus stop step (processing apparatus stop step).

濃度設定ステップでは、加工液中の添加剤の濃度を所望の値に設定する。添加量算出ステップでは、濃度設定ステップで設定された添加剤の濃度と、流量計で計測された液体の流量と、をもとに添加剤の添加量を算出する。移送ポンプ作動判別ステップでは、添加量算出ステップで算出された添加量で添加剤を添加する際に、移送ポンプの作動時間が適切か否かを判別する。   In the concentration setting step, the concentration of the additive in the working fluid is set to a desired value. In the addition amount calculation step, the addition amount of the additive is calculated based on the concentration of the additive set in the concentration setting step and the flow rate of the liquid measured by the flow meter. In the transfer pump operation determination step, it is determined whether or not the operation time of the transfer pump is appropriate when the additive is added at the addition amount calculated in the addition amount calculation step.

判定ステップでは、移送ポンプ作動判別ステップで移送ポンプの作動時間が適切ではないと判別された場合に、添加剤の注入不良と判定する。警告ステップでは、判定ステップで添加剤の注入不良と判定された場合に、警告を発する。装置停止ステップでは、判定ステップで添加剤の注入不良と判定された場合に、切削装置(加工装置)の稼働を停止させる。以下、本実施形態に係る不良検出方法について詳述する。   In the determination step, when it is determined in the transfer pump operation determination step that the operation time of the transfer pump is not appropriate, it is determined that the injection of the additive is defective. In the warning step, a warning is issued when it is determined in the determination step that the injection of the additive is defective. In the device stopping step, the operation of the cutting device (processing device) is stopped when it is determined in the determining step that the injection of the additive is defective. Hereinafter, the failure detection method according to the present embodiment will be described in detail.

はじめに、本実施形態の不良検出方法を用いる加工液供給装置等について説明する。図1は、加工液供給装置が併設された切削装置(加工装置)の構成例を模式的に示す斜視図である。なお、本実施形態では、ウェーハを切削するための切削装置について説明するが、本発明に係る加工装置は、研削装置、研磨装置等でも良い。   First, a working fluid supply device and the like using the defect detection method of the present embodiment will be described. FIG. 1 is a perspective view schematically illustrating a configuration example of a cutting device (processing device) provided with a processing liquid supply device. In this embodiment, a cutting device for cutting a wafer will be described. However, a processing device according to the present invention may be a grinding device, a polishing device, or the like.

図1に示すように、切削装置(加工装置)2は、各構造を支持する基台4を備えている。基台4の前方の角部には、昇降可能なカセットエレベータ6が設置されている。カセットエレベータ6の上面には、複数の被加工物11を収容可能なカセット8が載せられる。なお、図1では、説明の便宜上、カセット8の輪郭のみを示している。   As shown in FIG. 1, the cutting device (processing device) 2 includes a base 4 that supports each structure. At the front corner of the base 4, a cassette elevator 6 that can be moved up and down is installed. On the upper surface of the cassette elevator 6, a cassette 8 that can accommodate a plurality of workpieces 11 is placed. FIG. 1 shows only the outline of the cassette 8 for convenience of explanation.

被加工物11は、例えば、シリコン等の半導体材料でなる円盤状のウェーハであり、その表面側は、中央のデバイス領域と、デバイス領域を囲む外周余剰領域とに分けられている。   The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon, and its surface side is divided into a central device region and an extra peripheral region surrounding the device region.

デバイス領域は、格子状に配列された分割予定ライン(ストリート)で更に複数の領域に区画されており、各領域には、IC、LSI等のデバイスが形成されている。ただし、被加工物11の材質や形状、デバイスの種類等に制限はない。例えば、パッケージ基板、セラミックス基板、樹脂基板、金属基板等を被加工物11として用いることもできる。   The device area is further divided into a plurality of areas by lines to be divided (streets) arranged in a lattice shape, and devices such as ICs and LSIs are formed in each area. However, there is no limitation on the material and shape of the workpiece 11 and the type of device. For example, a package substrate, a ceramic substrate, a resin substrate, a metal substrate, or the like can be used as the workpiece 11.

被加工物11の裏面側には、被加工物11よりも径の大きいダイシングテープ13が貼り付けられている。このダイシングテープ13の外周部分には、アルミニウム、ステンレス等の金属材料でなる環状のフレーム15が固定されている。すなわち、被加工物11は、ダイシングテープ13を介してフレーム15に支持されている。   A dicing tape 13 having a diameter larger than that of the workpiece 11 is attached to the back side of the workpiece 11. An annular frame 15 made of a metal material such as aluminum or stainless steel is fixed to an outer peripheral portion of the dicing tape 13. That is, the workpiece 11 is supported by the frame 15 via the dicing tape 13.

Y軸方向(割り出し送り方向)においてカセットエレベータ6に隣接する位置には、仮置き機構10が設けられている。仮置き機構10は、例えば、Y軸方向に移動可能なプッシュプル機構12と、互いに平行な状態を維持しながら接近、離隔される一対のガイドレール14とを含む。   A temporary placement mechanism 10 is provided at a position adjacent to the cassette elevator 6 in the Y-axis direction (index feed direction). The temporary placing mechanism 10 includes, for example, a push-pull mechanism 12 movable in the Y-axis direction, and a pair of guide rails 14 approached and separated from each other while maintaining a state parallel to each other.

プッシュプル機構12は、カセット8内の被加工物11をガイドレール14に引き出し、又は、ガイドレール14に載せられた被加工物11をカセット8に挿入する。ガイドレール14は、フレーム15をX軸方向(加工送り方向)において挟み込むことで被加工物11を所定の位置に合わせる。   The push-pull mechanism 12 pulls out the workpiece 11 in the cassette 8 onto the guide rail 14 or inserts the workpiece 11 placed on the guide rail 14 into the cassette 8. The guide rail 14 adjusts the workpiece 11 to a predetermined position by sandwiching the frame 15 in the X-axis direction (processing feed direction).

X軸方向においてカセットエレベータ6に隣接する位置には、矩形状の開口4aが形成されている。開口4a内には、X軸移動テーブル16、X軸移動テーブル16をX軸方向に移動させるX軸移動機構(不図示)及びX軸移動機構を覆う防塵防滴カバー18が設けられている。   A rectangular opening 4a is formed at a position adjacent to the cassette elevator 6 in the X-axis direction. In the opening 4a, an X-axis moving table 16, an X-axis moving mechanism (not shown) for moving the X-axis moving table 16 in the X-axis direction, and a dustproof and drip-proof cover 18 covering the X-axis moving mechanism are provided.

X軸移動機構は、X軸方向に概ね平行な一対のX軸ガイドレール(不図示)を備えており、X軸ガイドレールには、X軸移動テーブル16がスライド可能に取り付けられている。X軸移動テーブル16の下面側には、ナット部(不図示)が固定されており、このナット部には、X軸ガイドレールに平行なX軸ボールネジ(不図示)が螺合されている。   The X-axis moving mechanism includes a pair of X-axis guide rails (not shown) that are substantially parallel to the X-axis direction, and the X-axis guide rail has an X-axis moving table 16 slidably mounted thereon. A nut (not shown) is fixed to the lower surface of the X-axis moving table 16, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed to the nut.

X軸ボールネジの一端部には、X軸パルスモータ(不図示)が連結されている。X軸パルスモータでX軸ボールネジを回転させることで、X軸移動テーブル16はX軸ガイドレールに沿ってX軸方向に移動する。   An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table 16 moves in the X-axis direction along the X-axis guide rail.

X軸移動テーブル16の上方には、被加工物11を吸引、保持するためのチャックテーブル(保持手段)20が設けられている。チャックテーブル20の周囲には、被加工物11を支持する環状のフレーム15を四方から挟持、固定するためのクランプ22が設置されている。   Above the X-axis moving table 16, a chuck table (holding means) 20 for sucking and holding the workpiece 11 is provided. Around the chuck table 20, clamps 22 for clamping and fixing the annular frame 15 supporting the workpiece 11 from all sides are provided.

チャックテーブル20は、モータ等の回転駆動源(不図示)に連結されており、Z軸方向(鉛直方向)に概ね平行な回転軸の周りに回転する。また、チャックテーブル20は、上述のX軸移動機構でX軸方向に移動する。チャックテーブル20の上面は、被加工物11を吸引、保持する保持面20aとなっている。この保持面20aは、チャックテーブル20の内部に形成された流路等を通じて吸引源(不図示)に接続されている。   The chuck table 20 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis substantially parallel to the Z-axis direction (vertical direction). The chuck table 20 is moved in the X-axis direction by the X-axis moving mechanism described above. The upper surface of the chuck table 20 is a holding surface 20a for sucking and holding the workpiece 11. The holding surface 20a is connected to a suction source (not shown) through a flow path or the like formed inside the chuck table 20.

開口4aと仮置き機構10との間の位置には、被加工物11を搬送する第1搬送機構24が配置されている。第1搬送機構24によって仮置き機構10からチャックテーブル20へと搬送された被加工物11は、保持面20aに作用する吸引源の負圧でチャックテーブル20に吸引、保持される。   At a position between the opening 4a and the temporary placing mechanism 10, a first transport mechanism 24 for transporting the workpiece 11 is arranged. The workpiece 11 transported from the temporary placement mechanism 10 to the chuck table 20 by the first transport mechanism 24 is sucked and held on the chuck table 20 by the negative pressure of the suction source acting on the holding surface 20a.

基台4の後方には、支持台4bが配置されている。この支持台4bの開口4a側には、被加工物11を切削する切削ユニット26が支持されている。切削ユニット26は、Y軸移動機構(不図示)によってY軸方向に移動すると共に、Z軸移動機構(不図示)によってZ軸方向に移動する。切削ユニット26に隣接する位置には、被加工物11を撮像する撮像ユニット28が設けられている。   Behind the base 4, a support 4b is arranged. A cutting unit 26 that cuts the workpiece 11 is supported on the opening 4a side of the support 4b. The cutting unit 26 is moved in the Y-axis direction by a Y-axis moving mechanism (not shown), and is moved in the Z-axis direction by a Z-axis moving mechanism (not shown). At a position adjacent to the cutting unit 26, an imaging unit 28 for imaging the workpiece 11 is provided.

切削ユニット26は、円環状の切削ブレード30を備えている。この切削ブレード30は、Y軸の周りに回転するスピンドル(不図示)の一端側に装着されている。スピンドルの他端側にはモータ(不図示)が連結されており、スピンドルに装着された切削ブレード30を回転させる。   The cutting unit 26 includes an annular cutting blade 30. The cutting blade 30 is mounted on one end of a spindle (not shown) that rotates around the Y axis. A motor (not shown) is connected to the other end of the spindle, and rotates a cutting blade 30 mounted on the spindle.

開口4a及び支持台4bの近傍には、円形の開口4cが形成されており、この開口4c内には洗浄機構32が設けられている。また、支持台4bの開口4c側の側面には、被加工物11をチャックテーブル20から洗浄機構32へと搬送する第2搬送機構34が設けられている。支持台4bの上面には、加工状況等を表示するためのモニタ36が設置されている。   A circular opening 4c is formed near the opening 4a and the support 4b, and a cleaning mechanism 32 is provided in the opening 4c. A second transport mechanism 34 that transports the workpiece 11 from the chuck table 20 to the cleaning mechanism 32 is provided on a side surface of the support 4b on the opening 4c side. A monitor 36 for displaying the processing status and the like is provided on the upper surface of the support 4b.

切削ブレード30の近傍には、被加工物11や切削ブレード30に加工液を供給するためのノズル38が設けられている。このノズル38は、例えば、切削装置2の外部に設けられた加工液供給装置40に接続されており、加工液供給装置40から供給される加工液(切削液)を被加工物11や切削ブレード30に吹き付ける。   In the vicinity of the cutting blade 30, a nozzle 38 for supplying a processing liquid to the workpiece 11 and the cutting blade 30 is provided. The nozzle 38 is connected to, for example, a machining fluid supply device 40 provided outside the cutting device 2, and applies a machining fluid (cutting fluid) supplied from the machining fluid supply device 40 to the workpiece 11 or the cutting blade. Spray 30.

図2は、加工液供給装置40等の構成例を模式的に示す図である。加工液供給装置40は、液体供給源42から供給される純水等の液体に、液状の添加剤を注入、混合して、切削装置2で使用される加工液(切削液)を生成できるように構成されている。添加剤としては、例えば、ポリエチレンイミン、ジシアンジアミド等でなる高分子量の水溶性カチオンポリマーが使用される。   FIG. 2 is a diagram schematically illustrating a configuration example of the working fluid supply device 40 and the like. The working fluid supply device 40 can inject and mix a liquid additive into a liquid such as pure water supplied from a liquid supply source 42 to generate a working fluid (cutting fluid) used in the cutting device 2. Is configured. As the additive, for example, a high molecular weight water-soluble cationic polymer made of polyethyleneimine, dicyandiamide, or the like is used.

加工液供給装置40は、例えば、液体供給源42から供給される液体の流量を計測するための流量計44を備えている。この流量計44は、上流端(一端)が液体供給源42に接続され、下流端(他端)が切削装置2(ノズル38)に接続された流路46の上流側に設けられている。   The processing liquid supply device 40 includes, for example, a flow meter 44 for measuring the flow rate of the liquid supplied from the liquid supply source 42. The flow meter 44 is provided on the upstream side of a flow path 46 having an upstream end (one end) connected to the liquid supply source 42 and a downstream end (other end) connected to the cutting device 2 (nozzle 38).

流量計44で計測される計測値は、加工液供給装置40が備える制御ユニット(制御手段)48内の添加量算出部48aへと送られる。添加量算出部48aは、設定部48bに設定されている加工液中の添加剤の濃度と、流量計44の計測値(すなわち、流路46を流れる液体の流量)とに基づいて、流路46を流れる液体に添加すべき添加剤の添加量(例えば、流量)を算出する。   The measurement value measured by the flow meter 44 is sent to an addition amount calculation unit 48a in a control unit (control means) 48 provided in the processing liquid supply device 40. The addition amount calculation unit 48a determines the flow path based on the concentration of the additive in the working fluid set in the setting unit 48b and the measurement value of the flow meter 44 (that is, the flow rate of the liquid flowing through the flow path 46). The amount (for example, the flow rate) of the additive to be added to the liquid flowing through 46 is calculated.

添加量算出部48aで算出された添加剤の添加量は、注入ポンプ制御部48cへと通知される。注入ポンプ制御部48cは、添加量算出部48aから通知される添加剤の添加量に基づいて、流路46に添加剤を注入するための注入ポンプ50の動作を制御する。   The addition amount of the additive calculated by the addition amount calculation unit 48a is notified to the infusion pump control unit 48c. The infusion pump control unit 48c controls the operation of the infusion pump 50 for injecting the additive into the flow channel 46 based on the additive amount of the additive notified from the additive amount calculation unit 48a.

注入ポンプ50は、流量計44より下流側で流路46に接続されており、添加量算出部48aから通知される添加剤の添加量に応じて、貯留容器54に貯留されている添加剤を流路46に注入する。これにより、流路46を流れる液体に添加剤を添加して、所望の濃度の添加剤を含む加工液を生成できる。   The infusion pump 50 is connected to the flow channel 46 on the downstream side of the flow meter 44, and according to the additive amount of the additive notified from the additive amount calculation unit 48a, the additive pump 50 controls the additive stored in the storage container 54. Inject into channel 46. Thereby, the additive can be added to the liquid flowing through the flow path 46 to generate a working fluid containing the additive at a desired concentration.

流路46の更に下流側には、生成された加工液の導電率や比抵抗率等を計測するための計測器52が設けられている。計測器52で計測される計測値は、制御ユニット48内の第1判定部48dへと送られる。   On the further downstream side of the flow path 46, a measuring device 52 for measuring the conductivity, the specific resistivity, and the like of the generated machining fluid is provided. The measurement value measured by the measuring device 52 is sent to the first determination unit 48d in the control unit 48.

例えば、計測器52の計測値が設定部48bに設定されている添加剤の濃度に対応した値ではない場合、すなわち、添加剤が適切な添加量で添加されていない場合、第1判定部48dは、警告発信部48eにその旨を通知する。なお、添加剤が適切な添加量で添加されない原因としては、例えば、流路46を構成する配管の折れ曲がりや流路46内への異物の侵入等に起因する注入ポンプ50の空回りが挙げられる。   For example, when the measured value of the measuring device 52 is not a value corresponding to the concentration of the additive set in the setting unit 48b, that is, when the additive is not added in an appropriate addition amount, the first determination unit 48d Notifies the warning transmission unit 48e of that fact. The reason why the additive is not added in an appropriate addition amount is, for example, a bend of a pipe constituting the flow path 46 or an idling of the injection pump 50 caused by intrusion of foreign matter into the flow path 46.

警告発信部48eは、第1判定部48dからの通知に基づき、オペレータ等に対して添加剤が適切な添加量で添加されていない旨の警告を発する。具体的には、例えば、警告灯(不図示)の発光、スピーカー(不図示)からの通知音の発生、切削装置2が備えるモニタ38への表示等の方法で警告を発する。   The warning transmitting unit 48e issues a warning to the operator or the like based on the notification from the first determining unit 48d that the additive is not added in an appropriate amount. Specifically, for example, a warning is issued by a method such as emission of a warning light (not shown), generation of a notification sound from a speaker (not shown), and display on a monitor 38 provided in the cutting device 2.

貯留容器54内には、添加剤の液面の高さを検出するための液面検出センサ56が配置されている。この液面検出センサ56は、上限検出用電極58、下限検出用電極60及び共通電極62を含む。   A liquid level detection sensor 56 for detecting the level of the liquid level of the additive is disposed in the storage container 54. The liquid level detection sensor 56 includes an upper limit detection electrode 58, a lower limit detection electrode 60, and a common electrode 62.

上限検出用電極58は、+電極であり、その下端の位置は、上限となる液面の高さに対応している。また、下限検出用電極60は、+電極であり、その下端の位置は、下限となる液面の高さに対応している。一方、共通電極62は、例えば、−電極であり、電源(不図示)等を介して上限検出用電極58及び下限検出用電極60に接続される。   The upper limit detection electrode 58 is a + electrode, and the position of the lower end corresponds to the liquid level height serving as the upper limit. Further, the lower limit detection electrode 60 is a + electrode, and the position of the lower end corresponds to the lower limit of the liquid level. On the other hand, the common electrode 62 is, for example, a negative electrode, and is connected to the upper limit detection electrode 58 and the lower limit detection electrode 60 via a power supply (not shown).

そのため、例えば、貯留容器54内の添加剤の液面が上限検出用電極58の下端に接すると、上限検出用電極58と共通電極62との間に電流が流れる。よって、この電流を移送ポンプ制御部48f等によってモニタすることで、貯留容器54内の添加剤の液面の高さが上限に達しているか否か(上限より低いか否か)を確認できる。   Therefore, for example, when the liquid level of the additive in the storage container 54 contacts the lower end of the upper-limit detection electrode 58, a current flows between the upper-limit detection electrode 58 and the common electrode 62. Therefore, by monitoring this current by the transfer pump control unit 48f or the like, it is possible to confirm whether the liquid level of the additive in the storage container 54 has reached the upper limit (whether or not it is lower than the upper limit).

また、例えば、貯留容器54内の添加剤の液面が下限検出用電極60の下端に接すると、下限検出用電極60と共通電極62との間に電流が流れる。よって、この電流を移送ポンプ制御部48f等によってモニタすることで、貯留容器54内の添加剤の液面の高さが下限に達しているか否か(下限より低いか否か)を確認できる。   Further, for example, when the liquid level of the additive in the storage container 54 contacts the lower end of the lower-limit detection electrode 60, a current flows between the lower-limit detection electrode 60 and the common electrode 62. Therefore, by monitoring this current by the transfer pump control unit 48f or the like, it is possible to confirm whether or not the height of the liquid level of the additive in the storage container 54 has reached the lower limit (whether or not it is lower than the lower limit).

移送ポンプ制御部48fは、貯留容器54内の添加剤の液面の高さが上限に達していないと判定した場合、第1移送ポンプ64a又は第2移送ポンプ64bを作動させて、第1添加剤容器66a又は第2添加剤容器66bの添加剤を貯留容器54へと移送する。一方で、移送ポンプ制御部48fは、貯留容器54内の添加剤の液面の高さが上限に達していると判定した場合、第1移送ポンプ64a及び第2移送ポンプ64bを停止させる。   When determining that the height of the liquid level of the additive in the storage container 54 has not reached the upper limit, the transfer pump control unit 48f operates the first transfer pump 64a or the second transfer pump 64b to perform the first addition. The additive in the agent container 66a or the second additive container 66b is transferred to the storage container 54. On the other hand, when determining that the level of the liquid level of the additive in the storage container 54 has reached the upper limit, the transfer pump control unit 48f stops the first transfer pump 64a and the second transfer pump 64b.

なお、第1添加剤容器66a又は第2添加剤容器66bが空になると、添加剤の液面の高さが下限を下回ることがある。この場合、移送ポンプ制御部48fは、使用する移送ポンプを切り替えて、添加剤が残っている添加剤容器から貯留容器54へと添加剤を移送させる。   When the first additive container 66a or the second additive container 66b becomes empty, the height of the liquid level of the additive may fall below the lower limit. In this case, the transfer pump control unit 48f switches the transfer pump to be used, and transfers the additive from the additive container in which the additive remains to the storage container 54.

また、移送ポンプ制御部48fは、例えば、第1移送ポンプ64a及び第2移送ポンプ64bの作動時間(作動タイミングや累積作動時間等)に関する情報を、第2判定部48gへと通知する。同様に、注入ポンプ制御部48cは、例えば、注入ポンプ50の作動時間(作動タイミングや累積作動時間等)に関する情報を第2判定部48gへと通知する。   In addition, the transfer pump control unit 48f notifies the second determination unit 48g of information on the operation time (operation timing, accumulated operation time, and the like) of the first transfer pump 64a and the second transfer pump 64b, for example. Similarly, the infusion pump control unit 48c notifies the second determination unit 48g of information on the operation time (operation timing, accumulated operation time, and the like) of the infusion pump 50, for example.

第2判定部48gは、添加量算出部48aで算出された添加剤の添加量、第1移送ポンプ64a及び第2移送ポンプ64bの作動時間、注入ポンプ50の作動時間等の情報に基づいて、第1移送ポンプ64a及び第2移送ポンプ64bが適切に作動しているか否かを判別する。   The second determination unit 48g is based on information such as the addition amount of the additive calculated by the addition amount calculation unit 48a, the operation time of the first transfer pump 64a and the second transfer pump 64b, and the operation time of the infusion pump 50. It is determined whether the first transfer pump 64a and the second transfer pump 64b are operating properly.

第1移送ポンプ64a及び第2移送ポンプ64bが適切に作動していないと判別された場合、第2判定部48gは、添加剤の注入不良が発生していると判定した上で、その判定結果を警告発信部48e及び停止信号送信部48hに通知する。警告発信部48eは、第2判定部48gからの通知に基づき、オペレータ等に対して添加剤が適切な添加量で添加されていない旨の警告を発する。   When it is determined that the first transfer pump 64a and the second transfer pump 64b are not operating properly, the second determination unit 48g determines that an injection failure of the additive has occurred, and determines the result. To the warning transmission unit 48e and the stop signal transmission unit 48h. The warning transmission unit 48e issues a warning to an operator or the like based on the notification from the second determination unit 48g that the additive is not added in an appropriate amount.

一方、停止信号送信部48hは、第2判定部48gからの通知に基づいて、切削装置2を停止させるための停止信号を送信する。停止信号送信部48hから送信された停止信号は、切削装置2が備える制御ユニット(制御手段)68の停止信号受信部68aで受信され、停止部68bへと送られる。停止部68bは、停止信号受信部68aから送られる停止信号に基づいて切削装置2を停止させる。   On the other hand, the stop signal transmission unit 48h transmits a stop signal for stopping the cutting device 2 based on the notification from the second determination unit 48g. The stop signal transmitted from the stop signal transmitting unit 48h is received by the stop signal receiving unit 68a of the control unit (control means) 68 included in the cutting device 2, and is sent to the stopping unit 68b. The stop unit 68b stops the cutting device 2 based on a stop signal sent from the stop signal receiving unit 68a.

次に、上述した加工液供給装置40で実施される不良検出方法について説明する。本実施形態に係る不良検出方法では、まず、加工液中の添加剤の濃度を所望の値に設定する濃度設定ステップを実施する。具体的には、例えば、オペレータ等によって、被加工物11の加工に適した添加剤の濃度が制御ユニット48内の設定部48bに設定される。   Next, a description will be given of a defect detection method performed by the above-described machining fluid supply device 40. In the defect detection method according to the present embodiment, first, a concentration setting step of setting the concentration of the additive in the working fluid to a desired value is performed. Specifically, for example, the concentration of the additive suitable for processing the workpiece 11 is set in the setting unit 48b in the control unit 48 by an operator or the like.

濃度設定ステップの後には、濃度設定ステップで設定された添加剤の濃度と、流量計44で計測された液体の流量と、をもとに添加剤の添加量を算出する添加量算出ステップを実施する。なお、この添加量算出ステップを実施する前には、あらかじめ、液体供給源42から流路46への液体の供給を開始しておく。   After the concentration setting step, an addition amount calculation step of calculating the addition amount of the additive based on the concentration of the additive set in the concentration setting step and the flow rate of the liquid measured by the flow meter 44 is performed. I do. Before the addition amount calculation step is performed, the supply of the liquid from the liquid supply source 42 to the flow path 46 is started in advance.

添加量算出ステップでは、まず、流量計44で計測された計測値(すなわち、流路46を流れる液体の流量)が添加量算出部48aへと送られる。また、設定部48bに設定されている添加剤の濃度が添加量算出部48aへと通知される。添加量算出部48aは、これらの情報に基づいて、流路46を流れる液体に添加すべき添加剤の添加量(例えば、流量)を算出する。   In the addition amount calculation step, first, the measurement value measured by the flow meter 44 (that is, the flow rate of the liquid flowing through the flow path 46) is sent to the addition amount calculation unit 48a. Further, the concentration of the additive set in the setting unit 48b is notified to the addition amount calculating unit 48a. The addition amount calculation unit 48a calculates an addition amount (for example, a flow rate) of the additive to be added to the liquid flowing through the flow path 46 based on the information.

例えば、流量計44で計測された計測値が10L/minであり、設定部48bに設定されている添加剤の濃度が100ppmであるとする。この場合、流路46を流れる液体に添加すべき添加剤の添加量は、例えば、1mL/min程度となる。   For example, it is assumed that the measurement value measured by the flow meter 44 is 10 L / min, and the concentration of the additive set in the setting unit 48b is 100 ppm. In this case, the amount of the additive to be added to the liquid flowing through the flow channel 46 is, for example, about 1 mL / min.

添加量算出ステップの後には、添加量算出ステップで算出された添加量で添加剤を添加する際に、第1移送ポンプ64a及び第2移送ポンプ64bの作動時間が適切か否かを判別する移送ポンプ作動判別ステップを実施する。すなわち、この移送ポンプ作動判別ステップは、注入ポンプ50で流路46に添加剤を注入する際に遂行される。   After the addition amount calculation step, when adding the additive with the addition amount calculated in the addition amount calculation step, the transfer that determines whether the operation time of the first transfer pump 64a and the second transfer pump 64b is appropriate or not. A pump operation determination step is performed. That is, this transfer pump operation determination step is performed when the injection pump 50 injects the additive into the flow path 46.

注入ポンプ50による添加剤の注入は、例えば、次のような手順で行われる。まず、添加量算出部48aで算出された添加剤の添加量が注入ポンプ制御部48cに通知される。注入ポンプ制御部48cは、通知された添加剤の添加量に基づいて注入ポンプ50を作動させ、貯留容器54に貯留されている添加剤を流路46に注入する。   The injection of the additive by the injection pump 50 is performed, for example, in the following procedure. First, the addition amount of the additive calculated by the addition amount calculation unit 48a is notified to the infusion pump control unit 48c. The injection pump control unit 48c operates the injection pump 50 based on the notified addition amount of the additive, and injects the additive stored in the storage container 54 into the flow path 46.

これにより、流路46を流れる液体に添加剤を添加して、所望の濃度の添加剤を含む加工液を生成できる。なお、生成された加工液は、流路46を通じて切削装置2(ノズル38)へと供給される。   Thereby, the additive can be added to the liquid flowing through the flow path 46 to generate a working fluid containing the additive at a desired concentration. The generated working fluid is supplied to the cutting device 2 (nozzle 38) through the flow path 46.

加工液の生成に伴い、貯留容器54に貯留されている添加剤は減少する。移送ポンプ制御部48fは、この添加剤の減少を液面検出センサ56で検出する。添加剤の減少が検出されると、移送ポンプ制御部48fは、第1移送ポンプ64a又は第2移送ポンプ64bを作動させて、第1添加剤容器66a又は第2添加剤容器66bの添加剤を貯留容器54へと移送する。   With the generation of the working fluid, the amount of the additive stored in the storage container 54 decreases. The transfer pump control unit 48f detects the decrease in the additive by the liquid level detection sensor 56. When the decrease in the additive is detected, the transfer pump control unit 48f operates the first transfer pump 64a or the second transfer pump 64b to remove the additive in the first additive container 66a or the second additive container 66b. It is transferred to the storage container 54.

ここで、貯留容器54に貯留されている添加剤の減少量は、流路46に注入されるべき添加剤の添加量、すなわち、添加量算出部48aで算出された添加剤の添加量や、注入ポンプ50の累積作動時間等に応じて決まる。例えば、添加量が1mL/minであり、注入ポンプ50の累積作動時間が100分である場合、貯留容器54の添加剤の減少量は100mLとなる。   Here, the decrease amount of the additive stored in the storage container 54 is the addition amount of the additive to be injected into the flow channel 46, that is, the addition amount of the additive calculated by the addition amount calculating unit 48a, It is determined according to the accumulated operation time of the infusion pump 50 and the like. For example, when the addition amount is 1 mL / min and the cumulative operation time of the infusion pump 50 is 100 minutes, the decrease amount of the additive in the storage container 54 is 100 mL.

よって、第2判定部48gは、想定される添加剤の減少量等を基準に、第1移送ポンプ64a及び第2移送ポンプ64bの作動タイミング等が適切か否かを判別できる。例えば、想定される添加剤の減少量が所定の閾値(例えば、100mL)に達したタイミングで第1移送ポンプ64a又は第2移送ポンプ64bが作動していない場合に、第2判定部48gは、第1移送ポンプ64a及び第2移送ポンプ64bの作動時間が適切ではないと判別する。なお、この閾値は、任意に設定できる。   Therefore, the second determination unit 48g can determine whether the operation timing and the like of the first transfer pump 64a and the second transfer pump 64b are appropriate based on the assumed amount of decrease in the additive and the like. For example, when the first transfer pump 64a or the second transfer pump 64b is not operating at the timing when the assumed amount of decrease in the additive reaches a predetermined threshold (for example, 100 mL), the second determination unit 48g sets It is determined that the operation times of the first transfer pump 64a and the second transfer pump 64b are not appropriate. This threshold can be set arbitrarily.

移送ポンプ作動判別ステップの後には、移送ポンプ作動判別ステップで移送ポンプの作動時間が適切ではないと判別された場合に、添加剤の注入不良と判定する判定ステップを実施する。具体的には、第1移送ポンプ64a及び第2移送ポンプ64bが適切に作動していないと判別された場合、第2判定部48gは、添加剤の注入不良が発生していると判定した上で、その判定結果を警告発信部48e及び停止信号送信部48hに通知する。   After the transfer pump operation determination step, when it is determined in the transfer pump operation determination step that the operation time of the transfer pump is not appropriate, a determination step of determining that the injection of the additive is defective is performed. Specifically, when it is determined that the first transfer pump 64a and the second transfer pump 64b are not operating properly, the second determination unit 48g determines that the injection failure of the additive has occurred. Then, the determination result is notified to the warning transmission unit 48e and the stop signal transmission unit 48h.

判定ステップの後には、判定ステップで添加剤の注入不良と判定された場合に、警告を発する警告ステップを実施する。具体的には、例えば、警告発信部48eは、オペレータ等に対して、警告灯(不図示)の発光、スピーカー(不図示)からの通知音の発生、切削装置2が備えるモニタ38への表示等の方法で警告を発する。   After the determination step, a warning step for issuing a warning is performed when it is determined in the determination step that the injection of the additive is defective. Specifically, for example, the warning transmission unit 48e provides the operator or the like with emission of a warning light (not shown), generation of a notification sound from a speaker (not shown), and display on a monitor 38 provided in the cutting device 2. A warning is issued in such a manner.

また、判定ステップの後には、判定ステップで添加剤の注入不良と判定された場合に、切削装置2の稼働を停止させる装置停止ステップを実施する。具体的には、例えば、停止信号送信部48hは、第2判定部48gからの通知に基づいて、切削装置2を停止させるための停止信号を送信する。   After the determining step, a device stopping step of stopping the operation of the cutting device 2 is performed when it is determined in the determining step that the injection of the additive is defective. Specifically, for example, the stop signal transmission unit 48h transmits a stop signal for stopping the cutting device 2 based on the notification from the second determination unit 48g.

停止信号送信部48hから送信された停止信号は、制御ユニット68の停止信号受信部68aで受信され、停止部68bへと送られる。停止部68bは、停止信号受信部68aから送られる停止信号に基づいて切削装置2を停止させる。   The stop signal transmitted from the stop signal transmission unit 48h is received by the stop signal reception unit 68a of the control unit 68, and is sent to the stop unit 68b. The stop unit 68b stops the cutting device 2 based on a stop signal sent from the stop signal receiving unit 68a.

以上のように、本実施形態に係る不良検出方法では、添加剤を所定の添加量で添加する際に、第1移送ポンプ64a及び第2移送ポンプ64bの作動時間が適切か否かを判別し、その結果に基づいて添加剤が適切に注入されているか否かを判定するので、例えば、加工液の導電率や比抵抗率等を計測する計測器52に異常があり、添加剤が適切に注入されていないにも関わらず計測器52の計測値が正常値(適正値)を示す場合等でも、添加剤の注入不良を適切に判定できる。   As described above, in the defect detection method according to the present embodiment, it is determined whether or not the operation time of the first transfer pump 64a and the second transfer pump 64b is appropriate when the additive is added in a predetermined amount. Since it is determined whether or not the additive is properly injected based on the result, for example, there is an abnormality in the measuring device 52 that measures the conductivity, the specific resistivity, and the like of the working fluid, and the additive is appropriately Even when the measured value of the measuring device 52 shows a normal value (appropriate value) even though it has not been injected, the injection failure of the additive can be appropriately determined.

また、本実施形態に係る不良検出方法では、添加剤の注入不良と判定された場合に、警告を発する警告ステップや、切削装置(加工装置)2の稼働を停止させる装置停止ステップ(加工装置停止ステップ)を実施するので、切削装置2での加工不良によって多くの被加工物11を無駄にしてしまうこともない。   In the defect detection method according to the present embodiment, when it is determined that the injection of the additive is defective, a warning step for issuing a warning and a device stop step for stopping the operation of the cutting device (processing device) 2 (processing device stop). Step) is performed, so that a large amount of the workpiece 11 is not wasted due to processing defects in the cutting device 2.

なお、本発明は上記実施形態の記載に限定されず、種々変更して実施可能である。例えば、上記実施形態に係る不良検出方法と、加工液の導電率や比抵抗率等に基づいて添加剤の注入不良を判定する不良検出方法とを併用しても良い。   The present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, the failure detection method according to the above-described embodiment may be used in combination with the failure detection method for determining an injection failure of the additive based on the conductivity or specific resistivity of the working fluid.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。   In addition, the structure, method, and the like according to the above-described embodiment can be appropriately changed and implemented without departing from the scope of the object of the present invention.

2 切削装置(加工装置)
4 基台
4a 開口
4b 支持台
4c 開口
6 カセットエレベータ
8 カセット
10 仮置き機構
12 プッシュプル機構
14 ガイドレール
16 X軸移動テーブル
18 防塵防滴カバー
20 チャックテーブル(保持手段)
20a 保持面
22 クランプ
24 第1搬送機構
26 切削ユニット
28 撮像ユニット
30 切削ブレード
32 洗浄機構
34 第2搬送機構
36 モニタ
38 ノズル
40 加工液供給装置
42 液体供給源
44 流量計
46 流路
48 制御ユニット(制御手段)
48a 添加量算出部
48b 設定部
48c 注入ポンプ制御部
48d 第1判定部
48e 警告発信部
48f 移送ポンプ制御部
48g 第2判定部
48h 停止信号送信部
50 注入ポンプ
52 計測器
54 貯留容器
56 液面検出センサ
58 上限検出用電極
60 下限検出用電極
62 共通電極
64a 第1移送ポンプ
64b 第2移送ポンプ
66a 第1添加剤容器
66b 第2添加剤容器
68 制御ユニット(制御手段)
68a 停止信号受信部
68b 停止部
11 被加工物
13 ダイシングテープ
15 フレーム
2 Cutting equipment (processing equipment)
Reference Signs List 4 base 4a opening 4b support 4c opening 6 cassette elevator 8 cassette 10 temporary placing mechanism 12 push-pull mechanism 14 guide rail 16 X-axis moving table 18 dustproof drip-proof cover 20 chuck table (holding means)
Reference Signs List 20a Holding surface 22 Clamp 24 First transport mechanism 26 Cutting unit 28 Imaging unit 30 Cutting blade 32 Cleaning mechanism 34 Second transport mechanism 36 Monitor 38 Nozzle 40 Processing liquid supply device 42 Liquid supply source 44 Flow meter 46 Flow path 48 Control unit ( Control means)
48a addition amount calculation unit 48b setting unit 48c infusion pump control unit 48d first determination unit 48e warning transmission unit 48f transfer pump control unit 48g second determination unit 48h stop signal transmission unit 50 infusion pump 52 measuring instrument 54 storage container 56 liquid level detection Sensor 58 Upper detection electrode 60 Lower detection electrode 62 Common electrode 64a First transfer pump 64b Second transfer pump 66a First additive container 66b Second additive container 68 Control unit (control means)
68a Stop signal receiving unit 68b Stop unit 11 Workpiece 13 Dicing tape 15 Frame

Claims (3)

一端が液体供給源に接続され他端が加工装置に接続された流路に配設され該流路を流れる液体の流量を計測する流量計と、該液体に添加される添加剤を収容する添加剤容器と、該添加剤容器から供給される添加剤を貯留する貯留容器と、所定量の該添加剤が該貯留容器に常に貯留された状態となるように該添加剤を該添加剤容器から該貯留容器へと移送する移送ポンプと、該流路の該流量計より下流側に該貯留容器の該添加剤を注入する注入ポンプと、該液体に該添加剤を添加して生成される加工液の導電率または電気抵抗率を計測する計測器と、を備える加工液供給装置において添加剤の注入不良を検出する不良検出方法であって、
該加工液中の該添加剤の濃度を設定する濃度設定ステップと、
該濃度設定ステップで設定された該添加剤の濃度と、該流量計で計測された該液体の流量と、をもとに該添加剤の添加量を算出する添加量算出ステップと、
該添加量算出ステップで算出された添加量で該添加剤を該流路注入する際に、移送ポンプの作動時間が適切か否かを判別する移送ポンプ作動判別ステップと、
該移送ポンプ作動判別ステップで該移送ポンプの作動時間が適切ではないと判別された場合に、該添加剤の注入不良と判定する判定ステップと、を備えることを特徴とする不良検出方法。
A flow meter having one end connected to the liquid supply source and the other end connected to a flow path connected to the processing device, for measuring a flow rate of the liquid flowing through the flow path; and an addition for containing an additive to be added to the liquid. Agent container, a storage container for storing the additive supplied from the additive container, and the additive from the additive container so that a predetermined amount of the additive is always stored in the storage container. A transfer pump for transferring to the storage container, an injection pump for injecting the additive in the storage container downstream of the flow meter in the flow path, and a process generated by adding the additive to the liquid A measuring instrument for measuring the electrical conductivity or electrical resistivity of the liquid, and a defect detection method for detecting a defective injection of the additive in a processing liquid supply device including the
A concentration setting step of setting the concentration of the additive in the working fluid,
An addition amount calculation step of calculating an addition amount of the additive based on the concentration of the additive set in the concentration setting step and a flow rate of the liquid measured by the flow meter,
When injecting the additive into the flow path in the amount calculated by said addition amount calculating step, the transfer pump operation determining step operating time of the transfer pump is to determine whether it is appropriate,
A determining step of determining that the injection of the additive is defective if the operation time of the transfer pump is determined to be inappropriate in the transfer pump operation determining step.
該判定ステップで該添加剤の注入不良と判定された場合に、警告を発する警告ステップを更に備えることを特徴とする請求項1に記載の不良検出方法。   2. The failure detection method according to claim 1, further comprising a warning step of issuing a warning when it is determined in the determination step that the injection of the additive is defective. 該判定ステップで該添加剤の注入不良と判定された場合に、該加工装置の稼働を停止させる停止信号を発して該加工装置の稼働を停止させる加工装置停止ステップを更に備えることを特徴とする請求項1又は請求項2に記載の不良検出方法。   The method further comprises a processing device stop step of issuing a stop signal for stopping the operation of the processing device and stopping the operation of the processing device when the injection of the additive is determined to be defective in the determination step. The defect detection method according to claim 1.
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