JP2012035336A5 - - Google Patents

Download PDF

Info

Publication number
JP2012035336A5
JP2012035336A5 JP2010174673A JP2010174673A JP2012035336A5 JP 2012035336 A5 JP2012035336 A5 JP 2012035336A5 JP 2010174673 A JP2010174673 A JP 2010174673A JP 2010174673 A JP2010174673 A JP 2010174673A JP 2012035336 A5 JP2012035336 A5 JP 2012035336A5
Authority
JP
Japan
Prior art keywords
water
fixed abrasive
mass
processing liquid
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010174673A
Other languages
Japanese (ja)
Other versions
JP5420498B2 (en
JP2012035336A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010174673A external-priority patent/JP5420498B2/en
Priority to JP2010174673A priority Critical patent/JP5420498B2/en
Priority to KR1020137001523A priority patent/KR101788901B1/en
Priority to EP11814573.9A priority patent/EP2602058A4/en
Priority to SG2012096475A priority patent/SG186486A1/en
Priority to CN201180036629.6A priority patent/CN103025486B/en
Priority to PCT/JP2011/067457 priority patent/WO2012017947A1/en
Priority to TW100127516A priority patent/TWI522457B/en
Publication of JP2012035336A publication Critical patent/JP2012035336A/en
Publication of JP2012035336A5 publication Critical patent/JP2012035336A5/ja
Publication of JP5420498B2 publication Critical patent/JP5420498B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (9)

（Ａ）ポリビニルピロリドン、および、ビニルピロリドンを含む共重合物から選ばれる少なくとも一種類以上の水溶性高分子、ならびに、（Ｂ）水を含有するとともに、遊離砥粒を含まない固定砥粒ワイヤソー用水溶性加工液。 (A) At least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer containing vinylpyrrolidone, and (B) water for fixed abrasive wire saws that contains water and does not contain free abrasive grains Soluble processing fluid. 前記（Ａ）成分の重量平均分子量が、２，０００〜１，０００，０００である、請求項１に記載の固定砥粒ワイヤソー用水溶性加工液。 The water-soluble processing liquid for fixed abrasive wire saws according to claim 1, wherein the component (A) has a weight average molecular weight of 2,000 to 1,000,000. 前記（Ａ）成分の含有量が、固定砥粒ワイヤソー用水溶性加工液全体の質量を１００質量％として、０．０２質量％以上７質量％以下である、請求項１または２に記載の固定砥粒ワイヤソー用水溶性加工液。 The fixed abrasive according to claim 1 or 2, wherein the content of the component (A) is 0.02% by mass or more and 7% by mass or less, based on 100% by mass of the entire water-soluble processing liquid for a fixed abrasive wire saw. Water-soluble machining fluid for grain wire saws. さらに、（Ｃ）多価カルボン酸のアルカリ塩を含有する、請求項１〜３のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 Furthermore, the water-soluble processing liquid for fixed abrasive wire saws in any one of Claims 1-3 containing the alkali salt of (C) polyhydric carboxylic acid. 前記（Ｃ）成分の含有量が、固定砥粒ワイヤソー用水溶性加工液全体の質量を１００質量％として、０．０１質量％以上１０質量％以下である、請求項１〜４のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 The content of the component (C) is 0.01% by mass or more and 10% by mass or less, based on 100% by mass of the entire water-soluble processing liquid for a fixed abrasive wire saw. Water-soluble machining fluid for fixed abrasive wire saws. さらに、（Ｄ）グリコール類、グリコールエーテル類、および、ポリオキシアルキレングリコール類からなる群から選ばれる一種以上を含有する、請求項１〜５のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 Furthermore, the water-soluble processing liquid for fixed abrasive wire saws in any one of Claims 1-5 containing 1 or more types chosen from the group which consists of (D) glycols, glycol ethers, and polyoxyalkylene glycols. . 前記（Ｄ）成分の含有量が、固定砥粒ワイヤソー用水溶性加工液全体の質量を１００質量％として、０．１質量％以上９５質量％以下である、請求項１〜６のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 The content of the component (D) is 0.1% by mass or more and 95% by mass or less, based on 100% by mass of the entire water-soluble processing liquid for a fixed abrasive wire saw. Water-soluble machining fluid for fixed abrasive wire saws. 加工液の粘度が２５℃で５０ｍＰａ・ｓ以下である、請求項１〜７のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。 The water-soluble processing liquid for fixed abrasive wire saws according to any one of claims 1 to 7, wherein the viscosity of the processing liquid is 50 mPa · s or less at 25 ° C. シリコンウエハの切断加工に用いられる、請求項１〜８のいずれかに記載の固定砥粒ワイヤソー用水溶性加工液。The water-soluble processing liquid for fixed abrasive wire saws according to any one of claims 1 to 8, which is used for cutting a silicon wafer.
JP2010174673A 2010-08-03 2010-08-03 Water-soluble machining fluid for fixed abrasive wire saws Active JP5420498B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2010174673A JP5420498B2 (en) 2010-08-03 2010-08-03 Water-soluble machining fluid for fixed abrasive wire saws
CN201180036629.6A CN103025486B (en) 2010-08-03 2011-07-29 Water-soluble working fluid for fixed-abrasive wire saw
EP11814573.9A EP2602058A4 (en) 2010-08-03 2011-07-29 Aqueous processing solution for fixed abresive grain wire saw
SG2012096475A SG186486A1 (en) 2010-08-03 2011-07-29 Aqueous processing solution for fixed abrasive grain wire saw
KR1020137001523A KR101788901B1 (en) 2010-08-03 2011-07-29 Aqueous processing solution for fixed abrasive grain wire saw
PCT/JP2011/067457 WO2012017947A1 (en) 2010-08-03 2011-07-29 Aqueous processing solution for fixed abresive grain wire saw
TW100127516A TWI522457B (en) 2010-08-03 2011-08-03 Water-soluble working fluid for fixed-abrasive wire saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010174673A JP5420498B2 (en) 2010-08-03 2010-08-03 Water-soluble machining fluid for fixed abrasive wire saws

Publications (3)

Publication Number Publication Date
JP2012035336A JP2012035336A (en) 2012-02-23
JP2012035336A5 true JP2012035336A5 (en) 2013-07-25
JP5420498B2 JP5420498B2 (en) 2014-02-19

Family

ID=45559447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010174673A Active JP5420498B2 (en) 2010-08-03 2010-08-03 Water-soluble machining fluid for fixed abrasive wire saws

Country Status (7)

Country Link
EP (1) EP2602058A4 (en)
JP (1) JP5420498B2 (en)
KR (1) KR101788901B1 (en)
CN (1) CN103025486B (en)
SG (1) SG186486A1 (en)
TW (1) TWI522457B (en)
WO (1) WO2012017947A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012172117A (en) * 2011-02-23 2012-09-10 Yushiro Chemical Industry Co Ltd Water-soluble working fluid for fixed abrasive grain wire saw
JP6039935B2 (en) * 2012-06-29 2016-12-07 出光興産株式会社 Aqueous processing fluid
JP6819619B2 (en) * 2018-01-22 2021-01-27 信越半導体株式会社 Work cutting method and wire saw
CN110497546A (en) * 2019-08-26 2019-11-26 哈尔滨商业大学 The method and apparatus of free-consolidation abrasive compound multiline cut silicon chips

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6243482A (en) * 1985-08-21 1987-02-25 Sanyo Chem Ind Ltd Abrasion working fluid
CN1057478A (en) * 1990-06-22 1992-01-01 薛志纯 Metal working fluid
US5401428A (en) * 1993-10-08 1995-03-28 Monsanto Company Water soluble metal working fluids
JP3869520B2 (en) * 1997-03-21 2007-01-17 株式会社ネオス Water-soluble cutting fluid for wire saw
JP2000296455A (en) * 1999-04-09 2000-10-24 Tokyo Seimitsu Co Ltd Fixed abrasive grain multi-wire saw
JP2001054850A (en) 1999-08-11 2001-02-27 Osaka Diamond Ind Co Ltd Hard brittle material cutting method by means of fixed abrasive grain wire saw
JP2002096251A (en) * 1999-09-17 2002-04-02 Sumitomo Special Metals Co Ltd Cutting method and cutting apparatus for rare earth alloys
JP2001138205A (en) * 1999-11-08 2001-05-22 Sumitomo Special Metals Co Ltd Method and apparatus for cutting rare earth alloy
JP2002167589A (en) * 2000-11-30 2002-06-11 Nippon Shokubai Co Ltd Metal working oil
JP4497767B2 (en) 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
TW575660B (en) * 2001-09-07 2004-02-11 Dai Ichi Kogyo Seiyaku Co Ltd Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid
JP2008161992A (en) * 2006-12-28 2008-07-17 Asahi Diamond Industrial Co Ltd Cutting method for processed member and manufacturing method for wafer
JP4874853B2 (en) * 2007-04-09 2012-02-15 Ｄｏｗａホールディングス株式会社 Cutting method of sintered rare earth magnet alloy
JP5253765B2 (en) * 2007-07-05 2013-07-31 株式会社Ａｄｅｋａ Additive for dicing cutting water and cutting method using the same
US8157876B2 (en) * 2007-07-31 2012-04-17 Cabot Microelectronics Corporation Slurry composition containing non-ionic polymer and method for use
US20090149359A1 (en) * 2007-12-10 2009-06-11 Hundley Lloyd E Formulation of a metal working fluid

Similar Documents

Publication Publication Date Title
JP2012172117A5 (en)
TWI413681B (en) Slurry composition containing non-ionic polymer and method for use
JP2010034509A5 (en)
JP2012035336A5 (en)
JP2014505358A5 (en)
JP2007088424A5 (en)
WO2011049318A3 (en) Slurry composition for cmp, and polishing method
JP2009024168A5 (en)
JP2009510797A5 (en)
JP2018513229A5 (en)
TW200714697A (en) Aqueous dispersion for chemical mechanical polish, kit for formulating the aqueous dispersion, chemical mechanical polishing method and method for producing semiconductor device
JP2010045351A5 (en)
RU2012108942A (en) ABRASIVE PRODUCT (OPTIONS) AND METHOD FOR CUTTING SAPPHIRE WITH ITS USE
JP5679642B2 (en) Water-soluble machining fluid for fixed abrasive wire saws
JP2013540849A5 (en)
JP2012031240A5 (en)
JP2014532796A5 (en)
EP2868741A1 (en) Aqueous processing liquid
JP2016056220A5 (en)
JP2018524329A5 (en)
TWI615463B (en) Slurry composition and method of use
JP5420498B2 (en) Water-soluble machining fluid for fixed abrasive wire saws
WO2009041443A1 (en) Water-soluble processing oil for free-abrasive-grain wire saw
TWI456048B (en) Working fluid for brittle materials
JP2016171332A5 (en)