SG186486A1 - Aqueous processing solution for fixed abrasive grain wire saw - Google Patents
Aqueous processing solution for fixed abrasive grain wire saw Download PDFInfo
- Publication number
- SG186486A1 SG186486A1 SG2012096475A SG2012096475A SG186486A1 SG 186486 A1 SG186486 A1 SG 186486A1 SG 2012096475 A SG2012096475 A SG 2012096475A SG 2012096475 A SG2012096475 A SG 2012096475A SG 186486 A1 SG186486 A1 SG 186486A1
- Authority
- SG
- Singapore
- Prior art keywords
- working fluid
- water
- mass
- wire saw
- fixed
- Prior art date
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- 239000006061 abrasive grain Substances 0.000 title description 4
- 239000012530 fluid Substances 0.000 claims abstract description 144
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims abstract description 20
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims abstract description 20
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229920003169 water-soluble polymer Polymers 0.000 claims abstract description 14
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920001577 copolymer Polymers 0.000 claims abstract description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 36
- 239000011863 silicon-based powder Substances 0.000 claims description 28
- 150000002334 glycols Chemical class 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- -1 glycol ethers Chemical class 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 5
- 150000001447 alkali salts Chemical class 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 17
- 239000001257 hydrogen Substances 0.000 abstract description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 14
- 238000001879 gelation Methods 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000005215 alkyl ethers Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- 235000009581 Balanites aegyptiaca Nutrition 0.000 description 1
- 101100505076 Caenorhabditis elegans gly-2 gene Proteins 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 241000596871 Ixia Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 240000004350 Prunus spinosa Species 0.000 description 1
- 235000010829 Prunus spinosa Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 235000015107 ale Nutrition 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000569 multi-angle light scattering Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
- C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/10—Carboxylix acids; Neutral salts thereof
- C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/121—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of seven or less carbon atoms
- C10M2207/124—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of seven or less carbon atoms containing hydroxy groups; Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/10—Carboxylix acids; Neutral salts thereof
- C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/125—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
- C10M2207/127—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids polycarboxylic
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/02—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/06—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to an acyloxy radical of saturated carboxylic or carbonic acid
- C10M2209/062—Vinyl esters of saturated carboxylic or carbonic acids, e.g. vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
- C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2215/042—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms containing hydroxy groups; Alkoxylated derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2217/00—Organic macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2217/02—Macromolecular compounds obtained from nitrogen containing monomers by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2217/028—Macromolecular compounds obtained from nitrogen containing monomers by reactions only involving carbon-to-carbon unsaturated bonds containing monomers having an unsaturated radical bound to a nitrogen-containing hetero ring
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/04—Molecular weight; Molecular weight distribution
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/055—Particles related characteristics
- C10N2020/06—Particles of special shape or size
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/02—Pour-point; Viscosity index
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/04—Detergent property or dispersant property
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
- C10N2040/20—Metal working
- C10N2040/22—Metal working with essential removal of material, e.g. cutting, grinding or drilling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Lubricants (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Provided is a water-soluble working fluid for a fixed-abrasive wire saw, the water-soluble working fluid comprising (A) at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone and (B) water, and being able to inhibit: its viscosity increase when mixed with cut debris; reaction between the working fluid and the cut debris and generation of hydrogen; and viscosity increase or gelation of the working fluid mixed with the cut debris.
Description
[0047756
PCT/JP2011/067457 (100477) Pt~p22
WATER-SOLUBLE WORKING FLUID FOR FIXED-ABRASIVE WIRE SAW
[0001] The present invention relates to a water-soluble working fluid for a fixed-abrasive wire saw. In specific, it relates to a water-soluble working fluid for a fixed-abrasive wire saw, for use in cutting a silicon wafer with a fixed-abrasive wire saw.
[0002] Nowadays, the importance of improving cutting techniques of a silicon wafer is increasing in order to reduce manufacturing costs thereof. Cutting by a wire saw in a loose-abrasive form is a mainly adopted method in processing a silicon wafer, but the loose-abrasive-type processing entails various problems as will be described below.
[0003] (1) Because a slurry made by dispersing abrasive grains in fluid is used as a working fluid, it is difficult to separate the loose abrasive grains and cut debris. (2) There is a limitation to the running speed of the wire, resulting in a limitation to improving the processing efficiency. (3) When the wire 1s made thin in order to reduce the kerf loss, it breaks during the processing, leading to decrease in the yield. (4) When the abrasive grains are refined in order to reduce the kerf loss, there will be an adverse result such as viscosity increase of the slurry, leading to increase in the kerf loss.
PCT/JP2011/067457 (100477)
[06004] In order to solve these problems, a fixed-abrasive wire saw is being developed nowadays which has diamond abrasive fixed onto a surface of a piano wire or the like by electrodeposition, a resin bond, or some cther means (Patent
Document 1). When processing a brittle material by using the fixed-abrasive wire saw, a working fluid is used for the purposes of lubrication, cocling, and dispersion of cut debris generated.
In consideration of the problem of flammability and some other factors as well, it is preferable to use a water-soluble working fluid. However, when a material to be cut is silicon, there will be high reactivity between the cut debris and the working fluid compared to general materials, resulting in reaction of the silicon debris (cut debris) with water or an alkali in the working fluid to generate hydrogen, and leading to likelihood of ignition.
For these reasons, a working fluid which is inhibited from reacting with silicon is preferred. From such a viewpoint, there is suggested a working fluid described in Patent Document 2,
Patent Literature
[0005]
Patent Document 1: Japanese Patent Application Laid-Open (JP-A)
No. 2001-054850
Patent Document 2: JP-A No. 2003-082334
Problems to be Solved by the Invention
[0006] However, it is found that the cut debris has become
PCT/JP2011/067457 (100477) thin nowadays as the processing precision is improved; and therefore, the working fluid described in Patent Document 2 cannot exhibit enough stability. Particularly, it is found that the viscosity of the working fluid with the cut debris mixed therein increases, causing various problems. Further, when a working fluid contains a large amount of water and has a pH showing alkalinity, there occurs not only the problem of hydrogen generation but also the problem of viscosity increase or gelation. {00071 The viscosity increase or gelation of the working fluid causes below problems. (1} The amount cof fluid brought by a wire varies, causing large nonuniformity in thickness of a cut material (deterioration of the product quality). (2) Slipping of the wire occurs, causing the wire to break (decrease in the yield) (3) It is difficult to perform washing in the subsequent step (it is difficult to remove the cut debris or the fluid between wafers). (4) The life of the fluid becomes short, causing increase in the amount of fluid to be changed (increase in costs).
[0008] Accordingly, an object of the present invention is to provide a water-soluble working fluid for a fixed-abrasive wire saw which can inhibit: increase in its viscosity when mixed with cut debris; reaction between the working fluid and the cut debris, and thereby generation of hydrogen; and also viscosity increase or gelation of the working fluid.
Means for Solving the Problems
PCT/JP2011/067457 (100477) 10009] The inventors conducted an intensive study to solve the above problems, and obtained the following findings. (1) The viscosity increase caused by Si cut debris mixed in occurs because the Si cut debris mixed in is in fine powder form and because dispersibility of the Si cut debris is poor. (2) The above viscosity increase can be prevented by including a predetermined water-soluble polymer in the working fluid to increase dispersibility of the Si cut debris. (3) When the Si cut debris is contained in the working fluid, the Si cut debris and the working fluid may react with each other, causing generation of hydrogen. (4) When the working fluid contains a large amount of water, it may increase its viscosity or be gelated by having Si cut debris in it. (5) The above problems (3) and (4) can be solved by including a predetermined water-soluble polymer in the working fluid.
[0010] The inventors examined the above problems intensively, and has completed the invention described below.
A first aspect of the present invention is a water-soluble working fluid for a fixed-abrasive wire saw (hereinafter sometimes referred to as a “working fluid of the present invention”), comprising: (A) at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone; and (B) water.
[0011] The working fluid of the present invention comprises a predetermined water-soluble polymer as (A) component. Thereby when it contains silicon powder, dispersibility of the silicon powder can be improved and viscosity increase of the working fluid
PCT/JP2011/067457 (100477) containing the silicon powder can be inhibited. Further, it is possible to inhibit the working fluid and the silicon powder from reacting with each other to generate hydrogen, and also possible to inhibit viscosity increase or gelation of the working fluid containing the silicon powder.
[0012] In the first aspect of the present invention, a weight-average molecular weight of the (A) component is preferably 2,000 to 1,000,000.
[0013] In the first aspect of the present invention, the content of the (A) component is preferably 0.02 mass? or more and 7 mass% or less, based on the total mass of the water-soluble working fluid for a fixed-abrasive wire saw as 100 mass%.
[0014] The water-soluble working fluid for a fixed-abrasive wire saw of the first aspect of the present invention preferably further comprises (C) an alkali salt of a polycarboxylic acid.
The content of the (C) component is preferably 0.01 mass% or more and 10 mass% or less, based on the total mass of the water-soluble working fluid for a fixed-abrasive wire saw as 100 mass%. The working fluid of the present invention can be easily given dispersibility, washing property, and corrosion resistance by containing an alkali salt of a polycarboxylic acid in the working fluid as (C) component.
[0015] The water-soluble working fluid for a fixed-abrasive wire saw of the first aspect of the present invention preferably further comprises (D) one or more selected from the group consisting of glycols, glycol ethers, and pelyoxyalkylene glycols.
The content of the (D) component is preferably 0.1 mass% or more and 95 mass% or less, based on the total mass of the water-soluble
PCT/JP2011/067457 (100477) working fluid for a fixed-abrasive wire saw as 100 mass%.
[0016] The viscosity of the water-soluble working fluid for a fixed-abrasive wire saw is preferably 50 mPa s or less at 25°C.
If the viscosity of the working fluid itself is high, it becomes much higher when the working fluid contains silicon powder.
Therefore, the viscosity of the working fluid itself is preferably not more than a predetermined value.
[0017] The viscosity of a working fluid (simulated fluid) formed by adding 10 mass% of silicon powder having an average particle size of 1.5 um to the water-soluble working fluid for a fixed-abrasive wire saw of the first aspect of the present invention and stirring, is preferably 100 mPa-'s or less at 25°C.
If the viscosity of the simulated fluid containing predetermined silicon powder is high, the problems listed in the above section “Problems to be Solved by the Invention” are likely to occur.
[0018] The water-soluble working fluid for a fixed-abrasive wire saw of the present invention comprises a predetermined water-soluble polymer. Therefore when the working fluid contains silicon powder, which is silicon cut debris, the silicon powder can be dispersed in the working fluid. Accordingly, viscosity increase of the working fluid containing silicon powder can be inhibited. Further, since the working fluid of the present invention comprises a predetermined water-soluble polymer, it is possible to inhibit the silicon powder and the working fluid from reacting with each other to generate hydrogen, and also possible to inhibit viscosity increase or gelation of the working
PCT/JP2011/067457 (100477) fluid containing the silicon powder.
Modes for Carrying Out the Invention
[0019] <Water-Soluble Working Fluid for a Fixed-Abrasive
Wire Saw>
The water-soluble working fluid for a fixed-abrasive wire saw of the present invention comprises: (A) at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone; and (B) water.
[0020] ((A} Component)
The working fluid of the present invention comprises: at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone as (A) component. With the water-soluble polymer contained in the working fluid, it is possible to improve dispersibility of the silicon powder in the working fluid containing the silicon powder. As a result, viscosity increase of the working fluid containing silicon powder can be inhibited. It is also possible to inhibit reaction of the silicon powder and the working fluid to prevent generation of hydrogen in the working fluid containing silicon powder. Furthermore, viscosity increase or gelation of the working fluid containing silicon powder can be inhibited.
[0021] As to the weight-average molecular weight of the water-soluble polymer as the (A) component determined by the gel permeation chromatography/multi-angle laser light scattering detection method, the lower limit thereof is preferably 2,000 or more, and more preferably 8,000 or more; and the upper limit thereof is preferably 1,000,000 or less, more preferably 700,000
PCT/JP2011/067457 (100477) or less, and further more preferably 500,000 or less. If the molecular weight is too small being outside the above range, the advantageous effect of adding the (A) component may not be exerted.
On the other hand, if the molecular weight is too large, agglomeration or large viscosity increase in the working fluid is likely to occur.
[0022] Based on the total mass (100 mass%) of the water-soluble working fluid for a fixed-abrasive wire saw, the lower limit of the content of the (A} component is preferably 0.02 mass% or more, more preferably 0.05 mass% or more, and further more preferably 0.2 mass% or more; and the upper limit thereof is preferably 7 mass% or less, more preferably 5 mass% or less, and more preferably 3 mass% or less. If the content of the (A) component is too small being outside the above range, the advantageous effects of inhibiting viscosity increase and of preventing generation of hydrogen may be poorly exerted. On the other hand, if the content of the (A) component is too large, the viscosity of the working fluid is likely to increase.
[0023] The water-soluble polymer as the (A) component is polyvinylpyrrolidone or a copolymer including vinylpyrrolidone; and two ox more kinds thereof may be used in mixture. As to the copolymer including vinylpyrrolidone, the proportion of the vinylpyrrolidone unit based on the entire copolymer is preferably 60 mols or more. A monomer to be copolymerized with vinylpyrrolidone may be vinyl acetate.
[0024] ((C) Component)
The working fluid of the present invention may further comprise an alkali salt of a polycarboxylic acid as (C) component.
PCT/JP2011/067457 (100477)
By adding the (C) component and adjusting the amount of addition thereof, it is possible to attain advantageous effects of giving the working fluid dispersibility, washing property, and corrosion resistance.
[0025] Examples of the polycarboxylic acid include adipic acid, oxalic acid, dodecanedioic acid, citric acid, and malic acid. Examples of the alkali include: hydroxides of alkali metal such as potassium hydroxide, sodium hydroxide; and amines such as triethanolamine, triisopropanolamine, ethylenediamine, and
N- (2-aminoethyl)-2-aminocethanol.
[0026] Based on the total mass (100 mass%) of the working fluid of the present invention, the lower limit of the content of the (C) component is preferably 0.01 mass® or more, and more preferably 0.1 mass% or more; the upper limit thereof is preferably 10 mass% or less, more preferably 2 mass% or less, and further more preferably 1 mass% or less. If the content of the (C) component is too small being outside the above range, it is difficult to realize the advantageous effect of adding the (C) component. On the other hand, if the content of the (C) component is too large, there may occur viscosity increase or gelation of the working fluid, or precipitation from the original fluid.
[0027] ((D) Component)
The working fluid of the present inventionmay still further comprise, as (D} component, one or more selected from the group consisting of glycols, glycol ethers, and polyoxyalkylene glycols.
Including the (D) component produces an advantageous effect of giving the working fluid lubricity and wettability.
PCT/JP2011/067457 (100477)
[0028] Examples of the glycels include propylene glycol, diethylene glycol, ethylene glycol, and butylene glycol.
Examples of the glycol ethers include alkyl ethers of the above glycols. Examples of the alkyl group include a methyl group, an ethyl group, and a butyl group. A part of the hydroxyl group of the glycols may be an alkyl ether, or all thereof may be an alkyl ether. Specific examples of the glycol ethers include diethylene glycol monoethyl ether, diethylene glycol diethyl ether, and propylene glycol monoethyl ether.
[0029] Examples of the polyoxyalkylene glycols include polyethyleneglycol, polypropylene glycol, and a copolymer of polyoxyethylene and polyoxypropylene; and the weilght-average molecular weight thereof (in terms of polystyrene using the gel permeation chromatography) is preferably 10,000 or less, more preferably 5,000 or less, and further more preferably 400 or less.
[0030] Based on the total mass (100 mass%} of the working fluid of the present invention, the lower limit of the content of the (D) component, is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, further more preferably 1 mass% or more, still further more preferably 3 mass% or more, and in especial preferably 10 mass% or more; and the upper limit thereof is preferably 95 mass% or less, more preferably 90 mass% or less, and further more preferably 80 mass$% or less. If the content of the (D) component is too small being outside the above range, the advantageous effect of adding the (D) component cannot be exerted. On the other hand, if the content of the (D) component is too large, the cooing property of the working fluid may degrade. f0031] The working fluid of the present invention contains
PCT/JP2011/067457 (100477) the (A) component, and in some cases further contains the (C) component and the (D) component, the rest being (B) water. The water may be of any kind without particular limitations, and thus it may be distilled water, tap water, etc. A working fluid that contains a large amount of (B) water tends to increase its viscosity or be gelated when silicon powder is contained therein.
By contrast, the working fiuid of the present invention can inhibit viscosity increase or gelation of the working fluid when containing silicon powder, even with a composition in which a large amount of water is contained, for example a composition in which water accounts for 90 mass% or more based on the total mass of the working fluid.
[0032] <Characteristics of the Working Fluid>
The viscosity of the working fluid of the present invention is preferably 50 mPa -s or less, more preferably 25 mPa -s or less, and further more preferably 20 mPa's or less, at 25°C. The viscosity of a working fluid (simulated fluid) formed by dispersing predetermined silicon powder in the working fluid of the present invention, is 100 mPa ‘s, preferably 55 mPa 's or less, more preferably 50 mPa-s or less, and further more preferably 45 mPa 's or less, at 25°C. The measurement of the viscosity is based on a simulated fluid obtained by: adding 10 mass% of silicon powder (particle size: 1.5 pum) to the working fluid of the present invention; stirring and mixing them; thereafter putting a stainless steel ball (2 mm in diameter) into the mixture; stirring the mixture at 1000 rpm for 10 hours; and removing the stainless steel ball by filtration. If the viscosity of the above described working fluid itself is too high, the viscosity of the simulated
PCT/JP2011/067457 (100477) fiuid containing the silicon powder will also be inevitably high.
Further, if the viscosity of the simulated fluid is too high, the problems described in the above section “Problems to be Solved by the Invention” are likely to occur. The viscosity of the working fluid and the simulated fluid can be measured by a
Brookfield type viscometer.
[0033] The pH of the working fluid is preferably 5.0 or more and 9.0 or less. If the pH of the working fluid is too low, an iron material or a wire brought into contact with the working fluid is likely to corrode. On the other hand, if the pH of the working fluid is too high, it is likely that the working fluid and the silicon powder react with each other to generate hydrogen.
The working fluid of the present invention may be used in the form of being diluted with water, but even in that case, the pH of the working fluid after diluted is preferably within the above range.
[0034] <Examples 1 to 13 and Comparative Examples 1 to 5>
The water-soluble working fluids for a fixed-abrasive wire saw of the present invention (Examples 1 to 13) and water-soluble working fluids for a fixed-abrasive wire saw not being the present invention (Comparative Examples 1 to 5) were prepared such that the compositions thereof are respectively as shown in Tables 1 to 3. The pH of each working fluid prepared was measured, and the viscosity thereof at 25°C was measured by a Brookfield type viscometer.
Additionally, simulated fluids were formed by: adding 10
PCT/JP2011/067457 (100477) mass% of silicon powder (average particle size: 1.5 pm) to each of the working fluids; stirring and mixing them; thereafter putting a stainless steel ball (2mm in diameter) inteo the mixture; and stirring the mixture at 1000 rpm for 10 hours. After removing the stainless steel ball from each of the simulated fluids by filtration using a metal mesh (50 mesh), the viscosity (mPa 's, 25°C) of each simulated fluid was measured by a Brookfield type viscometer. Further, heating 10 ml of the simulated fluids up to 50°C, the amount of hydrogen generated within thirty minutes was measured.
[0035] With regard to the weight-average molecular weight of polyvinylpyrrolidone (PVP), PVP K-15 had 9,700; PVP K-30 had 70,000; and PVP K-60 had 400,000. In addition, PVP/VA was a copolymer of vinylpyrrolidone and vinyl acetate; the welght-average molecular weight thereof was 32,000; and the proportion of vinylpyrrolidone in the copolymer was 70 mol%.
[0036] [Table 1]
PCT/JP2011/067457 (100477) © ao - ad | lo | lg 1212 12 sl 27 a g ™N Ze oO — wo] W — % : ; = ji [i us i o x al J. © RS “a {2 NE - g ~ 12] o — ol o~ wi i 1 =r
Q - 2 o | ™ {of « |~Nt o r~
Q, — . . Oo . . = .
E ™N Ze o A ~~ [we o~ © 3 oN ou §
Qf — — ™M Md ™N = ~ xD «i 0 ol ' 3) | oe lo . . ~ CE g o | ol|lalo o [=] = |o|l = <n r 2 ji] SA o of o g af i H ~ 8 = ™ | © on om gl «| ~ eo ; © ole al — [= < |1 8 x — 3
I I
— i a i o 0 — ~ 9 — ™ - of HH [«~ wm SD o . + .
E o x al et fe = [2 = & = — —_ wn 8 ¢ = Slo |~ | o dela § oe 0 ui aldl ef © moe
I ol Ola a & | 0 a] al ®l 8] = —~ wy A w Ble 3 _ 21 = do Bgl |e Sia = a 5 OE 6 =|2 2
SEER EEE EX RB ER EEE: 5 5
Sloe o Tew 2D ¢ ofa gS © > = TE
EH OL RS do He gpa gl eA Y og DO sag gl oe 9 alee <ot 8 = Ola def 1.14288 S8la d=] o 2 | +
Lisi Ela gl 2 = Holle =efolg gle olel® 213] @ 2 ju 8] © i= Sla|8xc 20 Sleld|al 885 olde a co Ho wl & — ~ — pf Eu Ld B= “ fu Mu Aa] Ae fl — oO { ol. a 0 Oo 15) ol sss Zs S 8 gl Of LEHR 8 a © mn Blo a
HEE alSl>m Tals Sl [(dlolalgl® a 2 a4 32 e & allo sds gl Io Salad v BY IE = gol5 8
Solel iL x Xe c Sl gH] - gl3 wd © = Ej HH] ~ Ad — 2, > 5 0 ola 2 o gle 1 H 4 a a, = 0 & i A, = — ®
[0037] [Table 2]
PCT/JP2011/067457 (100477) ™ —i
Eo) ol —~ © o o [=f o ge [Tr oe © er o 0 aN No o aff 2 el ™ —
Md x o™~ —
Ty) @ 0 o a 118] | |e “tel | sl 2 | © £ o 2 o Hf oS Iw o™ © * ja] — — o fo) o —~ eo . N S . o on
E ol 5 o =f o Mm -—
T ba
A oo — =) oN s oi fo « sl o ~~ oo g o oN <= fl = a % 5] =) @ ~ TS o ol ofl 77 lol » ™ 0 : ~ w : rl oo : © o ~ oO = 3 |w»n — © » =] «© 0 —~ 0 i. o ~ of * 0 © 0, " © : ed om . 8 Co = ~ Oo — - — x [=] r~ o a ™ of © I od 2 . S un .
Ele ~~ a o | 2 “a ~
Td * rl ~ _ © 0 : o 1 0 82. |= <8 ld ol ales eo low gla] ei o 25
Ol oa § 8 & ots 5185 ~ wr uw Elo slzlslsl 121= >a QAP Al ol 8 El > 8 oz © HE > of & EB oo ol Bol d|la F oy =O ol|=|mlo| zl o ooE a ull gd 5-0 — © A cl Ell L> ¢ @ oe Oo = = gle»
Dells Sl el 8a 2 ol ENS old BE 5] = @ dielelelSel sls oo 8 Re He|olg glo pl2l® 38 8 2 lw 2 o Soles 22 Slefdlel ESS oll eo 0 Hlo wm lala dld~lT 5 SS oD Bl BH al BSE ef) o 0 4
Bu > v > 0 + SLE, > oO o I Ia 0 0 Hoo >a oo al Gf>o Bas 8 alo 218 e = 2 = 3le a
EY D A Do O wl] -A| 1 £ 2 otal 1 % %% & ol gt ola ® > 5 PRS 0
Hla 2 8 Ola 8 Tl pl pl — A —|c ol Gl > = ‘5 Slo 4 5 | E a lal |= o B® a, = ga
PCT/JP2011/067457 (100477)
[0038] [Table 31 @
Bon
Doo ¥ oO oO “Men ™~ 2 N= — mM
HB 0 N oka o al 2 |e © mM
Q, © g x
QO Mj : @
Bo -A
Ba o = o~ sl =
Eg r~ a s 2 o o of 2 x
OQ oO
Q
5m 7 © a len ™ gl = ~ S i:
Og £1 ™ Me o — o~N wo [32] no oe, of g x
OQ oO a a o &
FE on ~ |= A © Jeo =~ ~ fo] ~~ |® o len
Hal uy oe] « o . . — w | 5 = JMolo|o o |= = [eo = ) 8 a a — | A
EH = [oN 1] o i = a7 © £
Uo ~ w |g A o en oo ol «+ |= © les
NO of eo] o . . ~ wo | 5
SB pa |= o|o et = |= 0 - jd A gx 9
O Mm 0 i a —_
Sw og ! w 2a => € o 0 wu A Slo © a |g ; loa 2 cc lc a G15] al ~ 0 EIT : ol Gg 2 gl sl 58S wu uw Eo 4 =| ~~ =| —~ > 5 =4 oad = al Els © o 8B oc 4 FE
S dB EE >Yio 0 o|8le| sl = § og n |= m|wl gd] o g Hoa ul gS ais Sl 2 o >= a= wre 0l@ © gly lo ol 23 we Sle] 2 gla gl oe
Ixia eo of of a2le Selol2 ele Hlels 215 @ = ol £
Zt 12lgl eles 29o sl =fjn|T elas Sols =| ™ 88 Kl & = >lo|l8lo Zils SEEldl el 58S elaje & 0 o w| & alata gle © g 915% 3 ol elals| Eg & Q S- H
S227 Hse gg BEG al 8 elo) d 2 9 om “alg g
HEINE aig zo gly 2 ot ol ali T & SR] a 508 8 oly % ug X48 § ol ll, « > 8 5H|l3 e
BlA1S 2 © 9a & Bl of S| = te =|g ® a a od Ql a 1 H S| EB ~~ Ti A, = o = oC 2 ras i ao 0
[0039] In the cases of the working fluids of Comparative
Examples, there was viscosity increase in all of the simulated fluids to over 55 mPa-s. By contrast, as for the working fluids of the present invention (Examples 1 to 13), viscosity changes
PCT/JP2011/067457 (100477) were small in the simulated fluids, and none of these simulated fluids had a viscosity of over 45 mPa -s.
[0040] The working fluids of Examples 1 to 3 and Comparative
Examples 1 and 2 were those obtained by diluting their original fluids by 10 times. Therefore, a composition of the original fluids was such that the amount of each compound therein was 10 times the amount in their diluted ones.
[0041] (Group I)
Group I consisted of Examples 1 to 6 and Comparative
Examples 1 to 3, being examples of working fluids containing large amount of water. The working fluids of Comparative Examples which had large amount of water (Comparative Examples 1 to 3) all showed viscosity increase and were gelated. However, the working fluids of the present invention added with PVP (Examples 1 to 6) were not gelated and showed little viscosity increase.
In addition, the amount of hydrogen generated in Examples 1 to 6 did not exceed 5 ml, whereas the amount of hydrogen generated in Comparative Examples 1 to 3 was more than 15 ml, which was a significant amount.
[0042] (Group II)
Group II consisted of Examples 7 to 12 and Comparative
Example 4, wherein the kind and the amount of (C) component and of (D) component were the same and the (A) component was different.
From this, the advantageous effect of inhibiting viscosity increase by each kind of polyvinylpyrrolidone (PVP) and a vinylpyrrolidone/vinyl acetate copolymer (PVP/VA) was shown.
In addition, comparing the amount of hydrogen generated in
Examples 7 to 12 with that in Comparative Example 4, the amount
PCT/JP2011/067457 (100477) of hydrogen generated was small in the working fluids of the present invention containing polyvinylpyrrolidone etc.
[0043] (Group III)
Group III consisted of Example 13 and Comparative Example 5, containing (D) component different from that in Groups I and
II. From this, the advantageous effect of inhibiting viscosity increase by pelyvinylpyrrolidone (PVP) was shown regardless of the kind of (D) component.
In addition, comparing Example 13 and Comparative Example 5, the amount of hydrogen generated was small in Example 13 which included polyvinylpyrrolidone.
From above, it is shown that the working fluid of the present invention comprising at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone has advantageous effects of inhibiting viscosity increase and hydrogen generation in the simulated fluid having silicon powder dispersed therein.
[0044] The present invention has been described above as to the embodiment which is supposed to be practical as well as preferable at present. However, it should be understood that the present invention is not limited to the embodiment disclosed in the specification and can be appropriately modified within the range that does not depart from the gist or spirit of the invention, which can be read from the appended claims and the overall specification, and that a water-soluble working fluid for a fixed-abrasive wire saw with such modifications are also encompassed within the technical range of the present invention.
PCT/JP2011/067457 (100477)
[0045] The water-soluble working fluid for a fixed-abrasive wire saw of the present invention can be especially suitably used in cutting a silicon wafer with using a fixed-abrasive wire saw.
Claims (9)
1. A water-soluble working fluid for a fixed-abrasive wire saw, the water-soluble working fluid comprising: (A) at least one water-soluble polymer selected from polyvinylpyrrolidone and a copolymer including vinylpyrrolidone; and (B) water.
2. The water-soluble working fluid for a fixed-abrasive wire saw according to claim 1, wherein a weight-average molecular weight of said (A) component is 2,000 to 1,000,000.
3. The water-soluble working fluid for a fixed-abrasive wire saw according to claim 1 or 2, wherein a content of said (A) component is 0.02 mass% or more and 7 mass% or less, based on the total mass of the water-soluble working fluid for a fixed-abrasive wire saw as 100 mass%.
4, The water-soluble working fluid for a fixed-abrasive wire saw according to any one of claims 1 to 3, the water-soluble working fluid further comprising (C) an alkali salt of a polycarboxylic acid.
5. The water-soluble working fluid for a fixed-abrasive wire saw according to claim 4, wherein a content of said (C) component is 0.01 mass% or more and 10 mass$% or less, based on the total mass of the water-soluble working fluid for a fixed-abrasive wire
PCT/JP2011/067457 (100477) saw as 100 mass%.
6. The water-soluble working fluid for a fixed-abrasive wire saw according to any one of claims 1 to 5, the water-soluble working fluid further comprising (D) one or more selected from the group consisting of glycols, glycol ethers, and polyoxyalkylene glycols.
7. The water-soluble working fluid for a fixed-abrasive wire saw according to claim 6, wherein a content of said (D} component is 0.1 mass% or more and 95 mass% or less, based on the total mass of the water-soluble working fluid for a fixed-abrasive wire saw as 100 mass%.
8. The water-soluble working fluid for a fixed-abrasive wire saw according to any one of claims 1 to 7, wherein a viscosity of the working fluid is 50 mPa's or less at 25°C.
9. The water-soluble working fluid for a fixed-abrasive wire saw according to any one of claims 1 to 8, wherein a viscosity of a simulated fluid formed by adding 10 mass% of silicon powder having an average particle size of 1.5 um to said working fluid and stirring is 100 mPa-s or less at 25°C.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010174673A JP5420498B2 (en) | 2010-08-03 | 2010-08-03 | Water-soluble machining fluid for fixed abrasive wire saws |
| PCT/JP2011/067457 WO2012017947A1 (en) | 2010-08-03 | 2011-07-29 | Aqueous processing solution for fixed abresive grain wire saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG186486A1 true SG186486A1 (en) | 2013-02-28 |
Family
ID=45559447
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| Application Number | Title | Priority Date | Filing Date |
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| SG2012096475A SG186486A1 (en) | 2010-08-03 | 2011-07-29 | Aqueous processing solution for fixed abrasive grain wire saw |
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|---|---|
| EP (1) | EP2602058A4 (en) |
| JP (1) | JP5420498B2 (en) |
| KR (1) | KR101788901B1 (en) |
| CN (1) | CN103025486B (en) |
| SG (1) | SG186486A1 (en) |
| TW (1) | TWI522457B (en) |
| WO (1) | WO2012017947A1 (en) |
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| JP2012172117A (en) * | 2011-02-23 | 2012-09-10 | Yushiro Chemical Industry Co Ltd | Water-soluble working fluid for fixed abrasive grain wire saw |
| JP6039935B2 (en) * | 2012-06-29 | 2016-12-07 | 出光興産株式会社 | Aqueous processing fluid |
| JP6819619B2 (en) * | 2018-01-22 | 2021-01-27 | 信越半導体株式会社 | Work cutting method and wire saw |
| CN110497546A (en) * | 2019-08-26 | 2019-11-26 | 哈尔滨商业大学 | The method and apparatus of free-consolidation abrasive compound multiline cut silicon chips |
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| JPS6243482A (en) * | 1985-08-21 | 1987-02-25 | Sanyo Chem Ind Ltd | Abrasion working fluid |
| CN1057478A (en) * | 1990-06-22 | 1992-01-01 | 薛志纯 | Metal working fluid |
| US5401428A (en) * | 1993-10-08 | 1995-03-28 | Monsanto Company | Water soluble metal working fluids |
| JP3869520B2 (en) * | 1997-03-21 | 2007-01-17 | 株式会社ネオス | Water-soluble cutting fluid for wire saw |
| JP2000296455A (en) * | 1999-04-09 | 2000-10-24 | Tokyo Seimitsu Co Ltd | Fixed abrasive grain multi-wire saw |
| JP2001054850A (en) | 1999-08-11 | 2001-02-27 | Osaka Diamond Ind Co Ltd | Hard brittle material cutting method by means of fixed abrasive grain wire saw |
| JP2002096251A (en) * | 1999-09-17 | 2002-04-02 | Sumitomo Special Metals Co Ltd | Cutting method and cutting apparatus for rare earth alloys |
| JP2001138205A (en) * | 1999-11-08 | 2001-05-22 | Sumitomo Special Metals Co Ltd | Method and apparatus for cutting rare earth alloy |
| JP2002167589A (en) * | 2000-11-30 | 2002-06-11 | Nippon Shokubai Co Ltd | Metal working oil |
| JP4497767B2 (en) | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
| TW575660B (en) * | 2001-09-07 | 2004-02-11 | Dai Ichi Kogyo Seiyaku Co Ltd | Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
| JP2008161992A (en) * | 2006-12-28 | 2008-07-17 | Asahi Diamond Industrial Co Ltd | Cutting method for processed member and manufacturing method for wafer |
| JP4874853B2 (en) * | 2007-04-09 | 2012-02-15 | Ｄｏｗａホールディングス株式会社 | Cutting method of sintered rare earth magnet alloy |
| JP5253765B2 (en) * | 2007-07-05 | 2013-07-31 | 株式会社Ａｄｅｋａ | Additive for dicing cutting water and cutting method using the same |
| US8157876B2 (en) * | 2007-07-31 | 2012-04-17 | Cabot Microelectronics Corporation | Slurry composition containing non-ionic polymer and method for use |
| US20090149359A1 (en) * | 2007-12-10 | 2009-06-11 | Hundley Lloyd E | Formulation of a metal working fluid |
-
2010
- 2010-08-03 JP JP2010174673A patent/JP5420498B2/en active Active
-
2011
- 2011-07-29 SG SG2012096475A patent/SG186486A1/en unknown
- 2011-07-29 WO PCT/JP2011/067457 patent/WO2012017947A1/en active Application Filing
- 2011-07-29 KR KR1020137001523A patent/KR101788901B1/en active IP Right Grant
- 2011-07-29 CN CN201180036629.6A patent/CN103025486B/en active Active
- 2011-07-29 EP EP11814573.9A patent/EP2602058A4/en not_active Withdrawn
- 2011-08-03 TW TW100127516A patent/TWI522457B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130095724A (en) | 2013-08-28 |
| WO2012017947A1 (en) | 2012-02-09 |
| JP2012035336A (en) | 2012-02-23 |
| EP2602058A1 (en) | 2013-06-12 |
| CN103025486B (en) | 2016-03-30 |
| TW201211235A (en) | 2012-03-16 |
| JP5420498B2 (en) | 2014-02-19 |
| KR101788901B1 (en) | 2017-10-20 |
| CN103025486A (en) | 2013-04-03 |
| TWI522457B (en) | 2016-02-21 |
| EP2602058A4 (en) | 2014-12-24 |
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