MY159558A - Wafer container with recessed latch - Google Patents

Wafer container with recessed latch

Info

Publication number
MY159558A
MY159558A MYPI2012001358A MYPI2012001358A MY159558A MY 159558 A MY159558 A MY 159558A MY PI2012001358 A MYPI2012001358 A MY PI2012001358A MY PI2012001358 A MYPI2012001358 A MY PI2012001358A MY 159558 A MY159558 A MY 159558A
Authority
MY
Malaysia
Prior art keywords
housings
improved
wafers
automation
assembled
Prior art date
Application number
MYPI2012001358A
Other languages
English (en)
Inventor
James D Pylant
Alan L Waber
Original Assignee
Texchem Advanced Products Incorporated Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texchem Advanced Products Incorporated Sdn Bhd filed Critical Texchem Advanced Products Incorporated Sdn Bhd
Publication of MY159558A publication Critical patent/MY159558A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D53/00—Sealing or packing elements; Sealings formed by liquid or plastics material
    • B65D53/04—Discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D77/00—Packages formed by enclosing articles or materials in preformed containers, e.g. boxes, cartons, sacks or bags
    • B65D77/10—Container closures formed after filling
    • B65D77/16—Container closures formed after filling by collapsing and twisting mouth portion
    • B65D77/18—Container closures formed after filling by collapsing and twisting mouth portion and securing by a deformable clip or binder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI2012001358A 2009-10-27 2010-06-28 Wafer container with recessed latch MY159558A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/606,921 US8813964B2 (en) 2009-08-26 2009-10-27 Wafer container with recessed latch

Publications (1)

Publication Number Publication Date
MY159558A true MY159558A (en) 2017-01-13

Family

ID=43922293

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012001358A MY159558A (en) 2009-10-27 2010-06-28 Wafer container with recessed latch

Country Status (9)

Country Link
US (2) US8813964B2 (enExample)
EP (1) EP2470455A4 (enExample)
JP (2) JP5727495B2 (enExample)
KR (1) KR20120115207A (enExample)
CN (1) CN102666314B (enExample)
MY (1) MY159558A (enExample)
SG (1) SG10201500640YA (enExample)
TW (1) TWI402205B (enExample)
WO (1) WO2011053109A1 (enExample)

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TWI515160B (zh) 2010-10-19 2016-01-01 安堤格里斯公司 具自動凸緣之前開式晶圓容器
CN103303587B (zh) * 2013-06-20 2014-12-17 芜湖美的厨卫电器制造有限公司 下包装结构
US10153187B2 (en) * 2014-11-11 2018-12-11 Applied Materials, Inc. Methods and apparatus for transferring a substrate
TWI671248B (zh) * 2014-12-08 2019-09-11 Entegris, Inc. 用於基板之容器
KR101547177B1 (ko) * 2015-04-03 2015-08-27 (주)상아프론테크 웨이퍼 보관 용기
DE102015105330A1 (de) * 2015-04-08 2016-10-13 Ujet Vehicles S.À.R.L. Batteriebaugruppe und Motorroller mit einer Batteriebaugruppe
US10020213B1 (en) * 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
TWI697979B (zh) * 2017-02-07 2020-07-01 日商阿基里斯股份有限公司 基板收容容器
US11658059B2 (en) 2018-02-28 2023-05-23 Ii-Vi Delaware, Inc. Thin material handling carrier
JP6952627B2 (ja) * 2018-03-09 2021-10-20 株式会社ジェーイーエル 基板収納容器のロック解除機構
KR102595526B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR102595523B1 (ko) * 2021-09-07 2023-10-30 주식회사 삼에스코리아 웨이퍼 이송 박스
KR20240055818A (ko) * 2021-09-09 2024-04-29 엔테그리스, 아이엔씨. 경사면을 포함하는 래치를 갖는 레티클 포드
WO2023168663A1 (en) 2022-03-10 2023-09-14 Innoscience (suzhou) Semiconductor Co., Ltd. Wafer holder and operating method thereof
JP7788905B2 (ja) * 2022-03-25 2025-12-19 アキレス株式会社 半導体ウェーハ搬送容器
EP4503107A1 (en) * 2022-03-30 2025-02-05 Achilles Corporation Semiconductor wafer transfer container
WO2024216456A1 (en) * 2023-04-17 2024-10-24 Viavi Solutions Suzhou Co., Ltd. Cover for a wafer

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US4333580A (en) * 1980-09-29 1982-06-08 Associated Plastics, Inc. Mechanism for locking two halves of an underground vault
US5452795A (en) * 1994-11-07 1995-09-26 Gallagher; Gary M. Actuated rotary retainer for silicone wafer box
FR2735754B1 (fr) 1995-06-20 1998-07-17 Astra Plastique Pot, notamment pour le conditionnement de produits alimentaires
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
JPH09129719A (ja) * 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
JPH0986588A (ja) * 1995-09-21 1997-03-31 Komatsu Kasei Kk 積層型包装容器
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US7131248B2 (en) * 2003-07-14 2006-11-07 Peak Plastic & Metal Products (Int'l) Limited Wafer shipper with orientation control
US6915906B2 (en) * 2003-07-14 2005-07-12 Peak Plastic & Metal Products (International) Limited Wafer storage container with wafer positioning posts
CA2548731A1 (en) 2003-08-26 2005-03-03 Trade Guys International Pty Ltd A hub locking device for a disc-shaped recording media
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JP3888991B2 (ja) * 2003-10-23 2007-03-07 Ｔｄｋ株式会社 ポッドオープナにおけるポッドクランプユニット、ポッドクランプユニットに対応するポッドおよびポッドクランプユニットを用いたクランプ機構およびクランプ方法
KR20050113889A (ko) 2004-05-31 2005-12-05 삼성전자주식회사 웨이퍼 포장 용기
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WO2009048456A1 (en) * 2007-10-12 2009-04-16 Peak Plastic & Metal Products (International) Limited Wafer container with staggered wall structure

Also Published As

Publication number Publication date
TWI402205B (zh) 2013-07-21
JP2015149498A (ja) 2015-08-20
JP2013508997A (ja) 2013-03-07
WO2011053109A1 (en) 2011-05-05
JP5727495B2 (ja) 2015-06-03
US20110049006A1 (en) 2011-03-03
CN102666314B (zh) 2015-01-28
KR20120115207A (ko) 2012-10-17
US20140360915A1 (en) 2014-12-11
SG10201500640YA (en) 2015-03-30
TW201114663A (en) 2011-05-01
EP2470455A1 (en) 2012-07-04
CN102666314A (zh) 2012-09-12
EP2470455A4 (en) 2014-01-22
US8813964B2 (en) 2014-08-26

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