MY153546A - Entry sheet for drilling - Google Patents

Entry sheet for drilling

Info

Publication number
MY153546A
MY153546A MYPI2011005808A MYPI2011005808A MY153546A MY 153546 A MY153546 A MY 153546A MY PI2011005808 A MYPI2011005808 A MY PI2011005808A MY PI2011005808 A MYPI2011005808 A MY PI2011005808A MY 153546 A MY153546 A MY 153546A
Authority
MY
Malaysia
Prior art keywords
water soluble
weight
parts
resin
drilling
Prior art date
Application number
MYPI2011005808A
Other languages
English (en)
Inventor
Matsuyama Yousuke
Shimizu Ken-Ichi
Ihara Katsutoshi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of MY153546A publication Critical patent/MY153546A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B35/00Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/088Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/127Lubricants, e.g. during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Laminated Bodies (AREA)
MYPI2011005808A 2009-06-01 2010-05-28 Entry sheet for drilling MY153546A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009132367 2009-06-01

Publications (1)

Publication Number Publication Date
MY153546A true MY153546A (en) 2015-02-27

Family

ID=43297476

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011005808A MY153546A (en) 2009-06-01 2010-05-28 Entry sheet for drilling

Country Status (8)

Country Link
JP (1) JP4798308B2 (zh)
KR (1) KR101153259B1 (zh)
CN (1) CN102458783B (zh)
BR (1) BRPI1011865A2 (zh)
MY (1) MY153546A (zh)
RU (1) RU2534178C2 (zh)
TW (1) TWI503191B (zh)
WO (1) WO2010140333A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI547358B (zh) * 2010-12-28 2016-09-01 Mitsubishi Gas Chemical Co Drilling cover
JP5288067B2 (ja) * 2011-01-07 2013-09-11 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
US9826643B2 (en) 2012-03-21 2017-11-21 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and drilling method
KR102066302B1 (ko) 2012-03-27 2020-01-14 미츠비시 가스 가가쿠 가부시키가이샤 드릴 천공용 엔트리 시트
CN106132646B (zh) 2014-03-31 2019-01-22 三菱瓦斯化学株式会社 钻孔用盖板
CN103937387B (zh) * 2014-04-22 2016-06-29 深圳市柳鑫实业股份有限公司 一种pcb钻孔用覆膜铝基盖板及其制备方法
CN109291135A (zh) * 2014-10-22 2019-02-01 合正科技股份有限公司 钻孔用盖板
MY186196A (en) 2015-03-19 2021-06-30 Mitsubishi Gas Chemical Co Entry sheet for drilling and method for drilling processing using same
WO2016147817A1 (ja) * 2015-03-19 2016-09-22 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN107848135B (zh) 2016-03-11 2019-07-16 三菱瓦斯化学株式会社 钻孔用盖板和使用其的钻孔加工方法
JP7157931B2 (ja) * 2017-06-01 2022-10-21 三菱瓦斯化学株式会社 微細径用ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN109913105A (zh) * 2019-01-14 2019-06-21 广东中晨电子科技有限公司 一种具有水溶性涂层的铝盖板
CN110281308A (zh) * 2019-06-28 2019-09-27 烟台柳鑫新材料科技有限公司 一种pcb钻孔用涂胶铝基盖板及其制备方法
CN112662314B (zh) * 2020-12-10 2022-08-23 深圳市柳鑫实业股份有限公司 一种环保型pcb钻孔用盖板及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3751496T2 (de) * 1986-11-13 1996-05-02 James A Johnston Verfahren und vorrichtung zur herstellung von gedruckten leiterplatten.
JP2855824B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP4543243B2 (ja) * 1999-06-01 2010-09-15 昭和電工パッケージング株式会社 小径孔あけ加工用あて板および小径孔あけ加工方法
JP4201462B2 (ja) * 2000-06-05 2008-12-24 利昌工業株式会社 ドリル加工用エントリーボード
JP4968652B2 (ja) * 2001-07-17 2012-07-04 日本合成化学工業株式会社 プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法
JP2003225892A (ja) * 2002-02-05 2003-08-12 Mitsubishi Gas Chem Co Inc ドリル孔明け方法
JP2004017190A (ja) 2002-06-13 2004-01-22 Kobe Steel Ltd プリント配線基板の穴あけ加工に使用する樹脂被覆金属板
TWI306369B (en) * 2003-01-28 2009-02-11 Mitsubishi Gas Chemical Co Lubricant sheet for drilling and method of drilling
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
JP4541132B2 (ja) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 小口径孔あけ加工用エントリーボードと小口径孔あけ加工方法
CN100531517C (zh) * 2005-07-25 2009-08-19 合正科技股份有限公司 一种钻孔用高散热润滑铝质盖板
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
KR20080055264A (ko) * 2006-12-15 2008-06-19 홍부진 천공 가공용 쉬트
JP5198809B2 (ja) * 2007-07-12 2013-05-15 三菱瓦斯化学株式会社 ドリル穴明け用エントリーシート
KR100879284B1 (ko) * 2008-02-12 2009-01-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
KR101346269B1 (ko) * 2008-06-10 2013-12-31 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴링용 엔트리 시트

Also Published As

Publication number Publication date
CN102458783B (zh) 2013-07-24
CN102458783A (zh) 2012-05-16
RU2534178C2 (ru) 2014-11-27
BRPI1011865A2 (pt) 2019-05-14
RU2011148789A (ru) 2013-07-20
WO2010140333A1 (ja) 2010-12-09
TWI503191B (zh) 2015-10-11
KR101153259B1 (ko) 2012-06-07
JPWO2010140333A1 (ja) 2012-11-15
KR20120008533A (ko) 2012-01-30
JP4798308B2 (ja) 2011-10-19
TW201043362A (en) 2010-12-16

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