BRPI1011865A2 - folha de entrada para a perfuração - Google Patents

folha de entrada para a perfuração

Info

Publication number
BRPI1011865A2
BRPI1011865A2 BRPI1011865A BRPI1011865A BRPI1011865A2 BR PI1011865 A2 BRPI1011865 A2 BR PI1011865A2 BR PI1011865 A BRPI1011865 A BR PI1011865A BR PI1011865 A BRPI1011865 A BR PI1011865A BR PI1011865 A2 BRPI1011865 A2 BR PI1011865A2
Authority
BR
Brazil
Prior art keywords
drilling
entry sheet
entry
sheet
Prior art date
Application number
BRPI1011865A
Other languages
English (en)
Inventor
Ihara Katsutoshi
Shimizu Ken-Ichi
Matsuyama Yousuke
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of BRPI1011865A2 publication Critical patent/BRPI1011865A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/088—Means for treating work or cutting member to facilitate cutting by cleaning or lubricating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Lubricants (AREA)
  • Laminated Bodies (AREA)
  • Drilling And Boring (AREA)
BRPI1011865A 2009-06-01 2010-05-28 folha de entrada para a perfuração BRPI1011865A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009132367 2009-06-01
PCT/JP2010/003621 WO2010140333A1 (ja) 2009-06-01 2010-05-28 ドリル孔明け用エントリーシート

Publications (1)

Publication Number Publication Date
BRPI1011865A2 true BRPI1011865A2 (pt) 2019-05-14

Family

ID=43297476

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1011865A BRPI1011865A2 (pt) 2009-06-01 2010-05-28 folha de entrada para a perfuração

Country Status (8)

Country Link
JP (1) JP4798308B2 (pt)
KR (1) KR101153259B1 (pt)
CN (1) CN102458783B (pt)
BR (1) BRPI1011865A2 (pt)
MY (1) MY153546A (pt)
RU (1) RU2534178C2 (pt)
TW (1) TWI503191B (pt)
WO (1) WO2010140333A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY163108A (en) * 2010-12-28 2017-08-15 Mitsubishi Gas Chemical Co Drill entry sheet
KR101859699B1 (ko) 2011-01-07 2018-05-18 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴 엔트리 시트
RU2603400C2 (ru) * 2012-03-21 2016-11-27 Мицубиси Гэс Кемикал Компани, Инк. Прокладочный лист для сверления и способ сверления
IN2014DN07967A (pt) 2012-03-27 2015-05-01 Mitsubishi Gas Chemical Co
WO2015152162A1 (ja) 2014-03-31 2015-10-08 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
CN103937387B (zh) * 2014-04-22 2016-06-29 深圳市柳鑫实业股份有限公司 一种pcb钻孔用覆膜铝基盖板及其制备方法
CN105583889A (zh) * 2014-10-22 2016-05-18 合正科技股份有限公司 钻孔用盖板
MY185904A (en) * 2015-03-19 2021-06-14 Mitsubishi Gas Chemical Co Entry sheet for drilling and method for drilling processing using same
WO2016147818A1 (ja) * 2015-03-19 2016-09-22 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
KR101918438B1 (ko) 2016-03-11 2018-11-13 미츠비시 가스 가가쿠 가부시키가이샤 드릴 천공용 엔트리 시트 및 그것을 사용한 드릴 천공 가공 방법
JP7157931B2 (ja) * 2017-06-01 2022-10-21 三菱瓦斯化学株式会社 微細径用ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN109913105A (zh) * 2019-01-14 2019-06-21 广东中晨电子科技有限公司 一种具有水溶性涂层的铝盖板
CN110281308A (zh) * 2019-06-28 2019-09-27 烟台柳鑫新材料科技有限公司 一种pcb钻孔用涂胶铝基盖板及其制备方法
CN112662314B (zh) * 2020-12-10 2022-08-23 深圳市柳鑫实业股份有限公司 一种环保型pcb钻孔用盖板及其制备方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988003743A1 (en) * 1986-11-13 1988-05-19 Johnston James A Method and apparatus for manufacturing printed circuit boards
JP2855824B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP4543243B2 (ja) * 1999-06-01 2010-09-15 昭和電工パッケージング株式会社 小径孔あけ加工用あて板および小径孔あけ加工方法
JP4201462B2 (ja) * 2000-06-05 2008-12-24 利昌工業株式会社 ドリル加工用エントリーボード
JP4968652B2 (ja) * 2001-07-17 2012-07-04 日本合成化学工業株式会社 プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法
JP2003225892A (ja) * 2002-02-05 2003-08-12 Mitsubishi Gas Chem Co Inc ドリル孔明け方法
JP2004017190A (ja) * 2002-06-13 2004-01-22 Kobe Steel Ltd プリント配線基板の穴あけ加工に使用する樹脂被覆金属板
US20050003169A1 (en) * 2003-01-28 2005-01-06 Nobuyuki Ikeguchi Lubricant sheet for drilling and method of drilling
TWI306369B (en) * 2003-01-28 2009-02-11 Mitsubishi Gas Chemical Co Lubricant sheet for drilling and method of drilling
JP4541132B2 (ja) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 小口径孔あけ加工用エントリーボードと小口径孔あけ加工方法
CN100531517C (zh) * 2005-07-25 2009-08-19 合正科技股份有限公司 一种钻孔用高散热润滑铝质盖板
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
KR20080055264A (ko) * 2006-12-15 2008-06-19 홍부진 천공 가공용 쉬트
JP5198809B2 (ja) * 2007-07-12 2013-05-15 三菱瓦斯化学株式会社 ドリル穴明け用エントリーシート
KR100879284B1 (ko) * 2008-02-12 2009-01-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
MY152828A (en) * 2008-06-10 2014-11-28 Mitsubishi Gas Chemical Co Entry sheet for drilling

Also Published As

Publication number Publication date
KR101153259B1 (ko) 2012-06-07
KR20120008533A (ko) 2012-01-30
RU2011148789A (ru) 2013-07-20
CN102458783A (zh) 2012-05-16
MY153546A (en) 2015-02-27
TWI503191B (zh) 2015-10-11
WO2010140333A1 (ja) 2010-12-09
JP4798308B2 (ja) 2011-10-19
JPWO2010140333A1 (ja) 2012-11-15
RU2534178C2 (ru) 2014-11-27
TW201043362A (en) 2010-12-16
CN102458783B (zh) 2013-07-24

Similar Documents

Publication Publication Date Title
BRPI1011865A2 (pt) folha de entrada para a perfuração
BRPI0813284A2 (pt) Processos para a preparação de pirazóis
BRPI1014267A2 (pt) processo para a carbonitrificação
IT1401535B1 (it) Portautensili
DE112009003885A5 (de) Kupplungsaggregat
BRPI1012624A2 (pt) estrutura de superfície para um dispositivo de funcionamento
HK1183644A1 (en) Entry sheet for drilling
GB0818639D0 (en) Trancoding a web page
FI20105240A0 (fi) Valssauskone levyjen taivuttamiseksi
FI20105245A0 (fi) Valssauskone levyjen taivuttamiseksi
IT1396671B1 (it) Scambiatore a microcanali
FI9115U1 (fi) Työväline
FI20095607A0 (fi) Työkoneohjaamo
FI20105244A0 (fi) Valssauskone levyjen taivuttamiseksi
ES1071093Y (es) Papelera de seccion trapecial
IT1397375B1 (it) Cassero a disarmo rapido
IT1392679B1 (it) Rullo per un laminatoio
FR2953424B1 (fr) Broyeur a percussion
FR2947315B1 (fr) Palier a roulement
FI20105241A (fi) Valssauskone levyjen taivuttamiseksi
IT1395048B1 (it) Un predellino per veicoli
ES1069698Y (es) Dispositivo para union a escuadra de perfiles
TH105127B (th) ลูกกลิ้งสำหรับเครื่องพิมพ์
TH112953B (th) แผ่นวัสดุป้อนสำหรับเจาะ
FI8516U1 (fi) Asennustyökalu

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements
B350 Update of information on the portal [chapter 15.35 patent gazette]