MY113986A - Method for recovering bare semiconductor chips from plastic packaged modules - Google Patents

Method for recovering bare semiconductor chips from plastic packaged modules

Info

Publication number
MY113986A
MY113986A MYPI94003386A MYPI19943386A MY113986A MY 113986 A MY113986 A MY 113986A MY PI94003386 A MYPI94003386 A MY PI94003386A MY PI19943386 A MYPI19943386 A MY PI19943386A MY 113986 A MY113986 A MY 113986A
Authority
MY
Malaysia
Prior art keywords
plastic
module
semiconductor chips
encapsulating resin
chip
Prior art date
Application number
MYPI94003386A
Other languages
English (en)
Inventor
Damiot Pascale
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of MY113986A publication Critical patent/MY113986A/en

Links

Classifications

    • H10P72/0441—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/865—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
MYPI94003386A 1994-02-22 1994-12-16 Method for recovering bare semiconductor chips from plastic packaged modules MY113986A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94480015A EP0668611A1 (en) 1994-02-22 1994-02-22 Method for recovering bare semiconductor chips from plastic packaged modules

Publications (1)

Publication Number Publication Date
MY113986A true MY113986A (en) 2002-07-31

Family

ID=8218113

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI94003386A MY113986A (en) 1994-02-22 1994-12-16 Method for recovering bare semiconductor chips from plastic packaged modules

Country Status (7)

Country Link
US (1) US5424254A (index.php)
EP (1) EP0668611A1 (index.php)
JP (1) JP2688178B2 (index.php)
KR (1) KR0143951B1 (index.php)
CN (1) CN1039756C (index.php)
MY (1) MY113986A (index.php)
TW (1) TW282568B (index.php)

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US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5591649A (en) * 1995-01-19 1997-01-07 Texas Instruments Incorporated Process of removing a tape automated bonded semiconductor from bonded leads
US6551845B1 (en) * 1996-01-02 2003-04-22 Micron Technology, Inc. Method of temporarily securing a die to a burn-in carrier
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5698474A (en) * 1996-02-26 1997-12-16 Hypervision, Inc. High speed diamond-based machining of silicon semiconductor die in wafer and packaged form for backside emission microscope detection
US6043100A (en) * 1996-04-19 2000-03-28 Weaver; Kevin Chip on tape die reframe process
JP3417247B2 (ja) * 1996-05-28 2003-06-16 株式会社デンソー 樹脂封止型電子装置の製造方法
US5923946A (en) * 1997-04-17 1999-07-13 Cree Research, Inc. Recovery of surface-ready silicon carbide substrates
US5976897A (en) * 1997-10-10 1999-11-02 Advanced Micro Devices, Inc. Method of protecting device leads of a packaged integrated circuit
US6342398B1 (en) 1998-12-17 2002-01-29 Taiwan Semiconductor Manufacturing Company Method of backside emission analysis for BGA packaged IC's
US6329212B1 (en) * 1999-01-08 2001-12-11 Advanced Micro Devices, Inc. Process for exposing for analysis the back side of a semiconductor die mounted in a package
US6294028B1 (en) 1999-04-23 2001-09-25 International Business Machines Corporation Mercury process gold ballbond removal apparatus
US6335208B1 (en) 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
US6452176B1 (en) 1999-07-22 2002-09-17 Advanced Micro Devices, Inc. Arrangement and method for using electron channeling patterns to detect substrate damage
US6387206B1 (en) 1999-08-17 2002-05-14 Advanced Micro Devices, Inc. Method and system for plastic package decapsulation of electronic devices
JP4403631B2 (ja) * 2000-04-24 2010-01-27 ソニー株式会社 チップ状電子部品の製造方法、並びにその製造に用いる擬似ウエーハの製造方法
JP2001313350A (ja) * 2000-04-28 2001-11-09 Sony Corp チップ状電子部品及びその製造方法、並びにその製造に用いる疑似ウエーハ及びその製造方法
US6429028B1 (en) 2000-08-29 2002-08-06 Dpa Labs, Incorporated Process to remove semiconductor chips from a plastic package
JP2002184934A (ja) * 2000-12-13 2002-06-28 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US20020100600A1 (en) 2001-01-26 2002-08-01 Albert Douglas M. Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same
JP4611569B2 (ja) * 2001-05-30 2011-01-12 ルネサスエレクトロニクス株式会社 リードフレーム及び半導体装置の製造方法
US6630369B2 (en) * 2001-07-17 2003-10-07 Ultra Tec Manufacturing, Inc. Sample preparation apparatus and method
WO2003039217A1 (de) * 2001-11-02 2003-05-08 Atmel Germany Gmbh Verfahren zum offnen eines kunststoffgehauses einer elektronischen baugruppe
DE10154017A1 (de) * 2001-11-02 2003-05-15 Atmel Germany Gmbh Verfahren zum Schutz einer kunststoffgehäusten elektronischen Baugruppe
US6521479B1 (en) * 2001-12-28 2003-02-18 Texas Instruments Incorporated Repackaging semiconductor IC devices for failure analysis
US7067332B1 (en) * 2004-03-16 2006-06-27 Altera Corporation Method for die removal from plastic packages
US7772038B2 (en) * 2005-09-30 2010-08-10 Retro Reflective Optics, Llc CMOS process for fabrication of ultra small or non standard size or shape semiconductor die
KR100744029B1 (ko) * 2006-04-07 2007-07-30 주식회사 하이닉스반도체 페키지된 반도체 칩의 디캡 방법
KR100806324B1 (ko) * 2007-01-05 2008-02-27 (주)엠아이반도체 반도체 불량분석을 위한 웨이퍼 에칭 시스템 및 방법
US7981698B2 (en) * 2007-03-09 2011-07-19 The Charles Stark Draper Laboratory, Inc. Removal of integrated circuits from packages
CN102023274B (zh) * 2009-09-11 2014-03-19 中芯国际集成电路制造(北京)有限公司 一种去除芯片陶瓷封装体的方法
KR101149865B1 (ko) * 2010-02-04 2012-05-24 한국생산기술연구원 반도체 칩 패키지에서 반도체 칩 분리 방법
CN102163537B (zh) * 2010-02-24 2012-10-17 中芯国际集成电路制造(上海)有限公司 一种废弃芯片单元回收利用方法
CN102468122A (zh) * 2010-11-01 2012-05-23 中芯国际集成电路制造(上海)有限公司 半导体器件失效分析样品制作方法及分析方法
CN102565680B (zh) * 2010-12-27 2016-09-14 无锡华润上华半导体有限公司 半导体器件的失效分析方法
US20120288966A1 (en) * 2011-05-12 2012-11-15 Ming-Teng Hsieh Method for decapsulating integrated circuit package
CN103824756B (zh) * 2012-11-16 2017-12-05 中芯国际集成电路制造(上海)有限公司 去除封装结构的方法
JP5846153B2 (ja) * 2013-04-26 2016-01-20 トヨタ自動車株式会社 半導体装置および半導体装置の研磨方法
CN105070649B (zh) * 2015-08-12 2018-08-14 上海华力微电子有限公司 一种引线键合去除的方法
CN105206546B (zh) * 2015-09-10 2017-11-21 宜特(上海)检测技术有限公司 覆晶芯片失效分析方法及电性定位中检测样品的制备方法
CN105301475A (zh) * 2015-09-22 2016-02-03 上海华虹宏力半导体制造有限公司 封装芯片背面失效定点的方法
CN106920759B (zh) * 2015-12-28 2020-04-24 上海新微技术研发中心有限公司 一种芯片保护壳去除方法及装置
CN109188212B (zh) * 2018-08-09 2020-09-11 安徽干城电子科技有限公司 一种塑封微电子器件绝缘性测试设备
DE102018218673A1 (de) * 2018-10-31 2020-04-30 Zf Friedrichshafen Ag Sensoranordnung
RU199130U1 (ru) * 2020-03-16 2020-08-17 Акционерное общество "ГРУППА КРЕМНИЙ ЭЛ" Маска для декорпусирования устройств микроэлектроники в полимерном корпусе
RU2738466C1 (ru) * 2020-09-25 2020-12-14 Закрытое акционерное общество "СуперОкс" (ЗАО "СуперОкс") Способ изготовления высокотемпературных сверхпроводниковых лент второго поколения
CN117080066B (zh) * 2023-10-13 2024-01-26 深圳基本半导体有限公司 一种碳化硅芯片表层的去层的方法

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JPS5942976B2 (ja) * 1979-06-08 1984-10-18 富士通株式会社 エポキシ樹脂封止電子部品の開封方法
JPS58137736A (ja) * 1982-02-10 1983-08-16 Matsushita Electronics Corp 保護膜評価試験方法
JPS63184347A (ja) * 1987-01-27 1988-07-29 Matsushita Electric Works Ltd 半導体パツケ−ジの開封方法
JPH02301144A (ja) * 1989-05-15 1990-12-13 Nec Corp 外郭体樹脂剥離方法
JPH04184957A (ja) * 1990-11-20 1992-07-01 Nec Corp Ｉｃパッケージの開封方法

Also Published As

Publication number Publication date
CN1108808A (zh) 1995-09-20
TW282568B (index.php) 1996-08-01
CN1039756C (zh) 1998-09-09
JP2688178B2 (ja) 1997-12-08
EP0668611A1 (en) 1995-08-23
US5424254A (en) 1995-06-13
KR0143951B1 (ko) 1998-08-17
JPH07240429A (ja) 1995-09-12

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