MX9206155A - Composicion de capa protectora sensible a la radiacion, tipo positiva. - Google Patents

Composicion de capa protectora sensible a la radiacion, tipo positiva.

Info

Publication number
MX9206155A
MX9206155A MX9206155A MX9206155A MX9206155A MX 9206155 A MX9206155 A MX 9206155A MX 9206155 A MX9206155 A MX 9206155A MX 9206155 A MX9206155 A MX 9206155A MX 9206155 A MX9206155 A MX 9206155A
Authority
MX
Mexico
Prior art keywords
composition
protective layer
radiation sensitive
positive type
sensitive protective
Prior art date
Application number
MX9206155A
Other languages
English (en)
Inventor
Hiroshi Moriuma
Hirotoshi Nakanishi
Yasunori Uetani
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of MX9206155A publication Critical patent/MX9206155A/es

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/04Chromates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • G03F7/0226Quinonediazides characterised by the non-macromolecular additives
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/11Vinyl alcohol polymer or derivative

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
MX9206155A 1991-11-01 1992-10-26 Composicion de capa protectora sensible a la radiacion, tipo positiva. MX9206155A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3287648A JP3039048B2 (ja) 1991-11-01 1991-11-01 ポジ型感放射線性レジスト組成物

Publications (1)

Publication Number Publication Date
MX9206155A true MX9206155A (es) 1993-05-01

Family

ID=17719932

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9206155A MX9206155A (es) 1991-11-01 1992-10-26 Composicion de capa protectora sensible a la radiacion, tipo positiva.

Country Status (8)

Country Link
US (1) US5275910A (es)
EP (1) EP0539778B1 (es)
JP (1) JP3039048B2 (es)
KR (1) KR100192769B1 (es)
CA (1) CA2078830A1 (es)
DE (1) DE69226600T2 (es)
MX (1) MX9206155A (es)
TW (1) TW269019B (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980701463A (ko) * 1995-01-17 1998-05-15 나까노 가쓰히꼬 포지티브형 레지스트 조성물
JP3427562B2 (ja) * 1995-05-09 2003-07-22 住友化学工業株式会社 ポジ型レジスト組成物
JP3433017B2 (ja) * 1995-08-31 2003-08-04 株式会社東芝 感光性組成物
JPH1124271A (ja) * 1997-06-30 1999-01-29 Kurarianto Japan Kk 高耐熱性放射線感応性レジスト組成物
JP4057704B2 (ja) * 1998-07-10 2008-03-05 本州化学工業株式会社 9,9−ビス(アルキル置換−4−ヒドロキシフェニル)フルオレン類とその製造方法
JP4429620B2 (ja) * 2002-10-15 2010-03-10 出光興産株式会社 感放射線性有機化合物
EP2381308B1 (en) * 2003-06-23 2015-07-29 Sumitomo Bakelite Co., Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
US20070059632A1 (en) * 2003-09-18 2007-03-15 Dai Oguro Method of manufacturing a semiconductor device
US7303855B2 (en) 2003-10-03 2007-12-04 Shin-Etsu Chemical Co., Ltd. Photoresist undercoat-forming material and patterning process
JP4575680B2 (ja) * 2004-02-23 2010-11-04 大阪瓦斯株式会社 新規フルオレン化合物
WO2005097725A1 (ja) * 2004-04-05 2005-10-20 Idemitsu Kosan Co., Ltd. カリックスレゾルシナレン化合物、フォトレジスト基材及びその組成物
JP4678195B2 (ja) * 2005-02-03 2011-04-27 三菱瓦斯化学株式会社 フェナントレンキノン誘導体及びその製造方法
DE102008017591A1 (de) * 2008-04-07 2009-10-08 Merck Patent Gmbh Neue Materialien für organische Elektrolumineszenzvorrichtungen
KR100913058B1 (ko) * 2008-08-25 2009-08-20 금호석유화학 주식회사 포지티브형 감광성 수지 조성물, 패턴 형성 방법 및 반도체소자
JPWO2016148176A1 (ja) * 2015-03-19 2017-12-28 東レ株式会社 ポジ型感光性樹脂組成物、硬化膜、tft基板、層間絶縁膜、表示装置、およびその製造方法
CN112745201A (zh) * 2020-12-25 2021-05-04 长春长光宇航复合材料有限公司 含芴环结构生物基双酚单体、生物基环氧树脂单体、生物基环氧树脂材料及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0358871B1 (en) * 1988-07-07 1998-09-30 Sumitomo Chemical Company, Limited Radiation-sensitive positive resist composition
AT393502B (de) * 1989-04-17 1991-11-11 Isovolta Verfahren zur synthese von 9,9-bis(4-hydroxyphenyl)fluoren
JP2629990B2 (ja) * 1989-12-20 1997-07-16 住友化学工業株式会社 ポジ型レジスト用組成物
JPH061377B2 (ja) * 1989-12-28 1994-01-05 日本ゼオン株式会社 ポジ型レジスト組成物
JPH087435B2 (ja) * 1989-12-28 1996-01-29 日本ゼオン株式会社 ポジ型レジスト組成物
JP2629403B2 (ja) * 1990-04-28 1997-07-09 東レ株式会社 ポジ型フォトレジスト組成物
JPH0413146A (ja) * 1990-05-02 1992-01-17 Sumitomo Chem Co Ltd 新規レジスト組成物
EP0461388B1 (en) * 1990-05-24 1996-09-04 Sumitomo Chemical Company, Limited Positive resist composition

Also Published As

Publication number Publication date
CA2078830A1 (en) 1993-05-02
DE69226600D1 (de) 1998-09-17
JPH05127374A (ja) 1993-05-25
KR930010615A (ko) 1993-06-22
JP3039048B2 (ja) 2000-05-08
DE69226600T2 (de) 1999-02-04
KR100192769B1 (ko) 1999-06-15
EP0539778B1 (en) 1998-08-12
TW269019B (es) 1996-01-21
US5275910A (en) 1994-01-04
EP0539778A1 (en) 1993-05-05

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Legal Events

Date Code Title Description
FG Grant or registration
MM Annulment or lapse due to non-payment of fees