MX360786B - Sistema y método electroquímicos para electropulir las cavidades superconductoras de radio frecuencia. - Google Patents
Sistema y método electroquímicos para electropulir las cavidades superconductoras de radio frecuencia.Info
- Publication number
- MX360786B MX360786B MX2015000412A MX2015000412A MX360786B MX 360786 B MX360786 B MX 360786B MX 2015000412 A MX2015000412 A MX 2015000412A MX 2015000412 A MX2015000412 A MX 2015000412A MX 360786 B MX360786 B MX 360786B
- Authority
- MX
- Mexico
- Prior art keywords
- electrode
- electrolyte solution
- radio frequency
- pulses
- scrf
- Prior art date
Links
- 239000008151 electrolyte solution Substances 0.000 abstract 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 2
- 238000007730 finishing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
- C25F3/22—Polishing of heavy metals
- C25F3/26—Polishing of heavy metals of refractory metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H7/00—Details of devices of the types covered by groups H05H9/00, H05H11/00, H05H13/00
- H05H7/14—Vacuum chambers
- H05H7/18—Cavities; Resonators
- H05H7/20—Cavities; Resonators with superconductive walls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0156—Manufacture or treatment of devices comprising Nb or an alloy of Nb with one or more of the elements of group IVB, e.g. titanium, zirconium or hafnium
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Un sistema de pulido electroquímico para las cavidades superconductoras de radio frecuencia (SCRF, por sus siglas en inglés) que incluye una solución de electrolitos de baja viscosidad que está libre de ácido fluorhídrico, un electrodo en contacto con la solución de electrolitos, la cavidad SCRF que se separa del electrodo y en contacto con la solución de electrolitos y una fuente de energía que incluye un primer cable eléctrico que se acopla eléctricamente al electrodo y un segundo cable eléctrico que se acopla eléctricamente a la cavidad, la fuente de energía que se configura para pasar una corriente eléctrica entre el electrodo y la pieza de trabajo, en donde la corriente eléctrica incluye pulsos anódicos y pulsos catódicos, y en donde los pulsos catódicos se interponen entre al menos algunos de los pulsos anódicos. La cavidad SCRF puede orientarse verticalmente durante el proceso de pulido.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/546,072 US9006147B2 (en) | 2012-07-11 | 2012-07-11 | Electrochemical system and method for electropolishing superconductive radio frequency cavities |
PCT/US2013/045056 WO2014018171A1 (en) | 2012-07-11 | 2013-06-11 | Electropolishing of superconductive radio frequency cavities |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015000412A MX2015000412A (es) | 2015-03-12 |
MX360786B true MX360786B (es) | 2018-11-16 |
Family
ID=49914471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015000412A MX360786B (es) | 2012-07-11 | 2013-06-11 | Sistema y método electroquímicos para electropulir las cavidades superconductoras de radio frecuencia. |
Country Status (5)
Country | Link |
---|---|
US (3) | US9006147B2 (es) |
EP (1) | EP2849908B8 (es) |
JP (1) | JP6023323B2 (es) |
MX (1) | MX360786B (es) |
WO (1) | WO2014018171A1 (es) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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US9343649B1 (en) * | 2012-01-23 | 2016-05-17 | U.S. Department Of Energy | Method for producing smooth inner surfaces |
US9006147B2 (en) * | 2012-07-11 | 2015-04-14 | Faraday Technology, Inc. | Electrochemical system and method for electropolishing superconductive radio frequency cavities |
US9782829B2 (en) * | 2013-11-26 | 2017-10-10 | Honeywell International Inc. | Methods and systems for manufacturing components from articles formed by additive-manufacturing processes |
JP6049601B2 (ja) * | 2013-12-05 | 2016-12-21 | 三菱重工メカトロシステムズ株式会社 | 超伝導加速空洞、および超伝導加速空洞の電解研磨方法 |
US10357839B1 (en) | 2015-10-08 | 2019-07-23 | The United States Of America As Represented By The Secretary Of The Army | Method for electrochemical machining using sympathetic waveform interactions |
US10485090B2 (en) | 2016-01-22 | 2019-11-19 | Jefferson Science Associates, Llc | High performance SRF accelerator structure and method |
ES2604830B1 (es) | 2016-04-28 | 2017-12-18 | Drylyte, S.L. | Proceso para alisado y pulido de metales por transporte iónico mediante cuerpos sólidos libres, y cuerpos sólidos para llevar a cabo dicho proceso. |
JP6752626B2 (ja) * | 2016-05-31 | 2020-09-09 | 株式会社カネカ | 電解研磨液および電解研磨された金属成形体の製造方法 |
AT519430A1 (de) | 2016-12-09 | 2018-06-15 | Hirtenberger Eng Surfaces Gmbh | Elektrochemisches pulspolieren |
JP6804086B2 (ja) * | 2017-03-21 | 2020-12-23 | マルイ鍍金工業株式会社 | 電解処理装置および方法 |
US10684522B2 (en) | 2017-12-07 | 2020-06-16 | Faraday Technology, Inc. | Electrochemical mirror system and method |
ES2721170B2 (es) * | 2018-01-26 | 2019-12-11 | Drylyte Sl | Uso de so4h2 como electrolito para procesos de alisado y pulido de metales por transporte ionico mediante cuerpos solidos libres. |
WO2019151102A1 (ja) * | 2018-02-02 | 2019-08-08 | マルイ鍍金工業株式会社 | 電解研磨方法および装置 |
JP7071866B2 (ja) * | 2018-04-26 | 2022-05-19 | 三菱重工機械システム株式会社 | 超伝導加速空洞の加工装置及び方法 |
US11411258B2 (en) | 2018-09-05 | 2022-08-09 | Faraday Technology, Inc. | Pulse reverse current high rate electrodeposition and charging while mitigating the adverse effects of dendrite formation |
US10787892B2 (en) * | 2018-09-19 | 2020-09-29 | Jefferson Science Associates, Llc | In situ SRF cavity processing using optical ionization of gases |
US11075435B2 (en) | 2018-10-25 | 2021-07-27 | International Business Machines Corporation | Electroplating of niobium titanium |
ES2734499B2 (es) | 2018-11-12 | 2020-06-03 | Drylyte Sl | Uso de ácidos sulfónicos en electrolitos secos para pulir superficies metálicas a través del transporte de iones |
US11118283B2 (en) | 2019-04-04 | 2021-09-14 | Faraday Technology, Inc. | Sequenced pulse reverse waveform surface finishing of additively manufactured parts |
KR20210151157A (ko) * | 2019-04-09 | 2021-12-13 | 쓰리디엠 바이오메디컬 피티와이 엘티디 | 전해 연마 방법 |
US11492723B2 (en) * | 2019-11-05 | 2022-11-08 | Cilag Gmbh International | Electrolyte solutions for electropolishing of nitinol needles |
US11280016B2 (en) | 2020-03-19 | 2022-03-22 | Integran Technologies Inc. | Apparatus and method for in-situ electrosleeving and in-situ electropolishing internal walls of metallic conduits |
US11735802B2 (en) | 2020-04-27 | 2023-08-22 | International Business Machines Corporation | Electroplated metal layer on a niobium-titanium substrate |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
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US2475586A (en) | 1943-04-09 | 1949-07-12 | Thompson Prod Inc | Method of electropolishing the internal surface of a hollow valve |
US2861930A (en) * | 1956-09-13 | 1958-11-25 | Smith Corp A O | Method of electropolishing and electrolytic solution therefor |
DE2027156C3 (de) * | 1970-06-03 | 1975-05-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum anodischen Polieren von Niobteilen |
CH570468A5 (es) * | 1971-09-18 | 1975-12-15 | Siemens Ag | |
NL7401984A (es) | 1973-03-15 | 1974-09-17 | ||
DE3032666C2 (de) * | 1980-08-29 | 1982-08-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum chemischen Polieren von Niob-Teilen, insbesondere eines Hohlraumresonators |
JPS6123799A (ja) * | 1984-07-10 | 1986-02-01 | Mitsubishi Heavy Ind Ltd | ニオブ中空体の電解研摩方法 |
JPH0762280B2 (ja) * | 1990-07-11 | 1995-07-05 | 山口県 | チタン又はチタン合金の電解研磨法 |
JPH04131400A (ja) * | 1990-09-21 | 1992-05-06 | Furukawa Electric Co Ltd:The | 超伝導空洞の電解研磨方法 |
US5171408A (en) * | 1991-11-01 | 1992-12-15 | General Electric Company | Electrochemical machining of a titanium article |
US6217726B1 (en) * | 1997-05-22 | 2001-04-17 | Therma Corporation, Inc. | Tube inner surface electropolishing device with electrolyte dam |
US6402931B1 (en) | 1998-05-18 | 2002-06-11 | Faraday Technology Marketing Group, Llc | Electrochemical machining using modulated reverse electric fields |
US6409852B1 (en) | 1999-01-07 | 2002-06-25 | Jiin-Huey Chern | Biocompatible low modulus titanium alloy for medical implant |
US6375826B1 (en) * | 2000-02-14 | 2002-04-23 | Advanced Cardiovascular Systems, Inc. | Electro-polishing fixture and electrolyte solution for polishing stents and method |
US6558231B1 (en) | 2000-10-17 | 2003-05-06 | Faraday Technology Marketing Goup, Llc | Sequential electromachining and electropolishing of metals and the like using modulated electric fields |
US6428681B1 (en) | 2000-12-06 | 2002-08-06 | Therma Corporation, Inc. | System and method for reversing electrolyte flow during an electropolishing operation |
JP2004060004A (ja) * | 2002-07-29 | 2004-02-26 | Sanwa Sangyo Kk | チタン又はチタン合金の電解研磨法及びそれに用いる電解研磨処理液の振動攪拌装置 |
JP2004216542A (ja) * | 2002-11-20 | 2004-08-05 | Ebara Corp | 電解加工装置及び電解加工方法 |
US20050070990A1 (en) * | 2003-09-26 | 2005-03-31 | Stinson Jonathan S. | Medical devices and methods of making same |
US7153411B2 (en) * | 2003-12-30 | 2006-12-26 | Boston Scientific Scimed, Inc. | Method for cleaning and polishing metallic alloys and articles cleaned or polished thereby |
US7553401B2 (en) | 2004-03-19 | 2009-06-30 | Faraday Technology, Inc. | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
EP1717351A1 (de) * | 2005-04-27 | 2006-11-02 | Enthone Inc. | Galvanikbad |
JP4747920B2 (ja) | 2006-04-07 | 2011-08-17 | 株式会社デンソー | 電解加工方法および電解加工装置 |
JP2008098449A (ja) * | 2006-10-12 | 2008-04-24 | Ebara Corp | 基板処理装置及び基板処理方法 |
US8463342B2 (en) * | 2007-10-12 | 2013-06-11 | Uchicago Argonne, Llc | Nano-fabricated superconducting radio-frequency composites, method for producing nano-fabricated superconducting rf composites |
US20110017608A1 (en) | 2009-07-27 | 2011-01-27 | Faraday Technology, Inc. | Electrochemical etching and polishing of conductive substrates |
JP5535572B2 (ja) * | 2009-10-14 | 2014-07-02 | 三菱重工業株式会社 | 超伝導加速空洞の表面処理方法 |
US20110303553A1 (en) | 2010-06-11 | 2011-12-15 | Inman Maria E | Electrochemical system and method for machining strongly passivating metals |
US9006147B2 (en) * | 2012-07-11 | 2015-04-14 | Faraday Technology, Inc. | Electrochemical system and method for electropolishing superconductive radio frequency cavities |
US9689086B2 (en) * | 2012-07-11 | 2017-06-27 | Marui Galvanizing Co., Ltd. | Electrode for polishing hollow tube, and electrolytic polishing method using same |
-
2012
- 2012-07-11 US US13/546,072 patent/US9006147B2/en active Active
-
2013
- 2013-06-11 WO PCT/US2013/045056 patent/WO2014018171A1/en active Application Filing
- 2013-06-11 EP EP13823112.1A patent/EP2849908B8/en active Active
- 2013-06-11 MX MX2015000412A patent/MX360786B/es active IP Right Grant
- 2013-06-11 JP JP2015521621A patent/JP6023323B2/ja active Active
-
2014
- 2014-12-30 US US14/585,897 patent/US9987699B2/en active Active
-
2018
- 2018-02-21 US US15/901,426 patent/US20180178302A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20150114847A1 (en) | 2015-04-30 |
US9987699B2 (en) | 2018-06-05 |
JP6023323B2 (ja) | 2016-11-09 |
WO2014018171A1 (en) | 2014-01-30 |
EP2849908B8 (en) | 2017-04-19 |
US20140018244A1 (en) | 2014-01-16 |
EP2849908A4 (en) | 2015-11-25 |
EP2849908B1 (en) | 2017-02-15 |
EP2849908A1 (en) | 2015-03-25 |
MX2015000412A (es) | 2015-03-12 |
JP2015528059A (ja) | 2015-09-24 |
US20180178302A1 (en) | 2018-06-28 |
US9006147B2 (en) | 2015-04-14 |
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Legal Events
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FG | Grant or registration |