MY174169A - Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil - Google Patents

Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil

Info

Publication number
MY174169A
MY174169A MYPI2019003304A MYPI2019003304A MY174169A MY 174169 A MY174169 A MY 174169A MY PI2019003304 A MYPI2019003304 A MY PI2019003304A MY PI2019003304 A MYPI2019003304 A MY PI2019003304A MY 174169 A MY174169 A MY 174169A
Authority
MY
Malaysia
Prior art keywords
copper foil
electro
deposited copper
deposited
mpa
Prior art date
Application number
MYPI2019003304A
Inventor
Sakiko Tomonaga
Koichi Miyake
Kazutaka Hozumi
Hiroaki Nakahara
Yasuhiro Shibata
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY174169A publication Critical patent/MY174169A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Abstract

An object of the present invention is to provide an electro-deposited copper foil far excellent in physical properties after heating at high-temperature than the conventional electro-deposited copper foils and is suitable for usage as a negative electrode current collector of a lithium ion secondary battery. An electro-deposited copper foil having tensile strength as received of 600 MPa or more and tensile strength after heating at 350 deg.-C for 1 hour of 470 MPa or more is employed to achieve the object. Moreover, a sulfuric acid based copper electrolytic solution containing polyethyleneimine having a molecular weight of 10000 to 70000 in concentration of 20 mg/L to 100 mg/Land a chloride ion in concentration of 0.5 mg/L to 2.5 mg/Lis used in a method of manufacturing the electro- deposited copper foil.
MYPI2019003304A 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil MY174169A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013017620 2013-01-31

Publications (1)

Publication Number Publication Date
MY174169A true MY174169A (en) 2020-03-12

Family

ID=51262367

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2019003304A MY174169A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil and surface-treated copper foil manufactured by using the electro-deposited copper foil
MYPI2015702490A MY173524A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2015702490A MY173524A (en) 2013-01-31 2014-01-30 Electro-deposited copper foil, method of manufacturing electro-deposited copper foil, and surface-treated copper foil manufactured by using electro-deposited copper foil

Country Status (7)

Country Link
JP (2) JP6373764B2 (en)
KR (2) KR102227681B1 (en)
CN (1) CN104955988B (en)
MY (2) MY174169A (en)
PH (1) PH12015501706A1 (en)
TW (1) TWI518210B (en)
WO (1) WO2014119656A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102122425B1 (en) * 2015-06-18 2020-06-12 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
KR101897474B1 (en) 2015-06-26 2018-09-12 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
JP6067910B1 (en) * 2015-11-04 2017-01-25 古河電気工業株式会社 Electrolytic copper foil and lithium ion secondary battery using the electrolytic copper foil
JP6440656B2 (en) * 2016-07-12 2018-12-19 古河電気工業株式会社 Electrolytic copper foil
KR102646185B1 (en) * 2017-02-27 2024-03-08 에스케이넥실리스 주식회사 Copper foil having improved adhesion, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
JP6757773B2 (en) * 2018-09-26 2020-09-23 古河電気工業株式会社 Electrolytic copper foil
JP6827022B2 (en) * 2018-10-03 2021-02-10 Ｊｘ金属株式会社 Copper foil for flexible printed circuit boards, copper-clad laminates using it, flexible printed circuit boards, and electronic devices
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111455414A (en) * 2020-03-09 2020-07-28 深圳市惟华电子科技有限公司 Additive for producing gradual change type electrolytic copper foil
KR20220043617A (en) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 Electrolytic Copper Foil of High Strength, Electrode Comprising The Same, Secondary Battery Comprising The Same, and Method for Manufacturing The Same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001011685A (en) * 1999-06-30 2001-01-16 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil and its production
KR100454270B1 (en) * 2002-11-29 2004-10-26 엘지전선 주식회사 Low Roughness Electrodeposited Copper Foil Manufacturing Method And Electrodeposited Copper Foil Thereby
CN100554527C (en) * 2003-04-03 2009-10-28 福田金属箔粉工业株式会社 Low uneven surface electrolytic copper foil and manufacture method thereof
JP4273309B2 (en) 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 Low rough surface electrolytic copper foil and method for producing the same
JP5255229B2 (en) 2006-04-28 2013-08-07 三井金属鉱業株式会社 Electrolytic copper foil, surface-treated copper foil using the electrolytic copper foil, copper-clad laminate using the surface-treated copper foil, and method for producing the electrolytic copper foil
KR101154203B1 (en) * 2006-04-28 2012-06-18 미쓰이 긴조꾸 고교 가부시키가이샤 Electrolytic copper foil, surface treated copper foil using the electrolytic copper foil, copper-clad laminated plate using the surface treated copper foil, and method for manufacturing the electrolytic copper foil
JP2008285727A (en) 2007-05-18 2008-11-27 Furukawa Circuit Foil Kk Electrolytic copper foil with high tensile-strength, and manufacturing method therefor
JP5588607B2 (en) 2007-10-31 2014-09-10 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil
EP2312020A4 (en) * 2008-07-07 2014-05-28 Furukawa Electric Co Ltd Electrolytic copper foil and copper-clad laminate
JP5598700B2 (en) 2010-02-25 2014-10-01 福田金属箔粉工業株式会社 Electrolytic copper foil and method for producing the same
WO2012002526A1 (en) 2010-07-01 2012-01-05 三井金属鉱業株式会社 Electrodeposited copper foil and process for production thereof
MY162358A (en) * 2010-11-22 2017-06-15 Mitsui Mining & Smelting Co Surface-treated copper foil
JP5276158B2 (en) 2010-12-27 2013-08-28 古河電気工業株式会社 Lithium ion secondary battery, negative electrode for battery, and electrolytic copper foil for battery negative electrode current collector
JP5771392B2 (en) 2010-12-28 2015-08-26 日本電解株式会社 Electrolytic copper foil and method for producing the same
KR20160138321A (en) * 2011-06-30 2016-12-02 후루카와 덴키 고교 가부시키가이샤 Electrolytic copper foil, method for producing electrolytic copper foil, and lithium ion secondary cell using electrolytic copper foil as collector
US10396363B2 (en) * 2012-05-22 2019-08-27 Mitsui Mining & Smelting Co., Ltd. Copper foil, negative electrode current collector and negative electrode material for non-aqueous secondary battery

Also Published As

Publication number Publication date
CN104955988A (en) 2015-09-30
PH12015501706A1 (en) 2015-10-12
JPWO2014119656A1 (en) 2017-01-26
WO2014119656A1 (en) 2014-08-07
TWI518210B (en) 2016-01-21
KR20190006075A (en) 2019-01-16
JP6373764B2 (en) 2018-08-15
JP6529646B2 (en) 2019-06-12
KR102272695B1 (en) 2021-07-05
MY173524A (en) 2020-01-31
TW201437435A (en) 2014-10-01
KR102227681B1 (en) 2021-03-15
CN104955988B (en) 2018-01-30
KR20150114484A (en) 2015-10-12
JP2018165411A (en) 2018-10-25

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