MX341106B - Dispositivo alambrico para el cableado de un aparato electronico. - Google Patents
Dispositivo alambrico para el cableado de un aparato electronico.Info
- Publication number
- MX341106B MX341106B MX2015001290A MX2015001290A MX341106B MX 341106 B MX341106 B MX 341106B MX 2015001290 A MX2015001290 A MX 2015001290A MX 2015001290 A MX2015001290 A MX 2015001290A MX 341106 B MX341106 B MX 341106B
- Authority
- MX
- Mexico
- Prior art keywords
- wiring
- island
- electronic apparatus
- interface
- conductor track
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Abstract
La invención se refiere a un dispositivo alámbrico (34) para conectar un aparato electrónico (14) que comprende una interfaz (42), un carril conductor eléctrico (40) y una isla de colocación de componentes (38) que está conectada a una interfaz (42) a través de un carril conductor (40) y que se configura para llevar un componente electrónico (26, 28) y para hacer contacto eléctrico con la interfaz (42) a través del carril conductor eléctrico (40), en donde la isla de colocación de componentes (38) está libre de un elemento de la red (58) que se configura para soportar la isla de colocación de componentes (38) sobre un elemento de soporte (56) durante un proceso de alojamiento para alojar la isla de colocación de los componentes (38).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012213353 | 2012-07-30 | ||
PCT/EP2013/066024 WO2014020034A1 (de) | 2012-07-30 | 2013-07-30 | Verdrahtungseinrichtung zum verdrahten einer elektronischen vorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
MX2015001290A MX2015001290A (es) | 2015-04-08 |
MX341106B true MX341106B (es) | 2016-08-08 |
Family
ID=48918386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2015001290A MX341106B (es) | 2012-07-30 | 2013-07-30 | Dispositivo alambrico para el cableado de un aparato electronico. |
Country Status (8)
Country | Link |
---|---|
US (1) | US9661775B2 (es) |
EP (1) | EP2880682A1 (es) |
KR (1) | KR102107262B1 (es) |
CN (1) | CN104508816B (es) |
BR (1) | BR112015002057A2 (es) |
DE (1) | DE102013214915A1 (es) |
MX (1) | MX341106B (es) |
WO (1) | WO2014020034A1 (es) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014210523A1 (de) * | 2014-06-03 | 2015-12-03 | Continental Teves Ag & Co. Ohg | Spannungsarmes Verkleben von Sensorchips |
DE102014213231A1 (de) * | 2014-07-08 | 2016-01-14 | Continental Automotive Gmbh | Sensorunterseitig verschaltete passive Bauelemente |
DE102014213590A1 (de) | 2014-07-11 | 2016-01-14 | Continental Teves Ag & Co. Ohg | Kundenspezifischer Adapter für Standardsensor |
DE102016201096A1 (de) | 2015-01-28 | 2016-07-28 | Continental Teves Ag & Co. Ohg | Adapter mit eingebetteten Filterbauelementen für Sensoren |
DE102016201097A1 (de) | 2015-01-28 | 2016-07-28 | Continental Teves Ag & Co. Ohg | Sensor mit symmetrisch eingebetteten Sensorelementen |
DE102015224257A1 (de) * | 2015-12-03 | 2017-06-08 | Continental Teves Ag & Co. Ohg | Elektrische Leiterbahn, Verfahren und Verwendung |
DE102015225071B4 (de) * | 2015-12-14 | 2023-02-16 | Continental Automotive Technologies GmbH | Verfahren zur Fertigung eines Raddrehzahlsensors und Raddrehzahlsensor |
DE102016207664A1 (de) | 2016-05-03 | 2017-11-09 | Continental Teves Ag & Co. Ohg | Sensorelement für ein kraftfahrzeug |
JP7342761B2 (ja) * | 2020-03-27 | 2023-09-12 | 住友電装株式会社 | センサ装置 |
JP7415731B2 (ja) * | 2020-03-27 | 2024-01-17 | 住友電装株式会社 | センサ装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5910244A (ja) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | 樹脂封止半導体装置 |
JPS6433955A (en) * | 1987-07-30 | 1989-02-03 | Matsushita Electronics Corp | Lead frame |
JPH025450A (ja) * | 1988-06-24 | 1990-01-10 | Hitachi Ltd | 半導体装置 |
US5925927A (en) * | 1996-12-18 | 1999-07-20 | Texas Instruments Incoporated | Reinforced thin lead frames and leads |
JP2004198240A (ja) * | 2002-12-18 | 2004-07-15 | Denso Corp | センサ装置 |
US7012324B2 (en) * | 2003-09-12 | 2006-03-14 | Freescale Semiconductor, Inc. | Lead frame with flag support structure |
BRPI0506469A (pt) * | 2004-01-13 | 2007-02-21 | Mitsui Mining & Smelting Co | método para produção de molde para embalagem de resina sintética, sensor de concentração de álcool e aparelho para a medição da concentração de álcool |
DE502004001665D1 (de) * | 2004-04-19 | 2006-11-16 | Delphi Tech Inc | Beleuchtungseinrichtung |
US20080013298A1 (en) * | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
DE102008064046A1 (de) | 2008-10-02 | 2010-04-08 | Continental Teves Ag & Co. Ohg | Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes |
DE102010005771B4 (de) * | 2010-01-25 | 2012-12-13 | Heraeus Materials Technology Gmbh & Co. Kg | Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit |
KR101977997B1 (ko) | 2010-08-10 | 2019-05-13 | 콘티넨탈 테베스 아게 운트 코. 오하게 | 운전 안전성을 조절하는 방법 및 시스템 |
JP5910244B2 (ja) | 2012-03-29 | 2016-04-27 | ブラザー工業株式会社 | 工作機械用制御装置 |
-
2013
- 2013-07-30 CN CN201380040283.6A patent/CN104508816B/zh active Active
- 2013-07-30 MX MX2015001290A patent/MX341106B/es active IP Right Grant
- 2013-07-30 WO PCT/EP2013/066024 patent/WO2014020034A1/de active Application Filing
- 2013-07-30 US US14/416,815 patent/US9661775B2/en active Active
- 2013-07-30 KR KR1020157002467A patent/KR102107262B1/ko active IP Right Grant
- 2013-07-30 EP EP13745626.5A patent/EP2880682A1/de not_active Ceased
- 2013-07-30 DE DE201310214915 patent/DE102013214915A1/de active Pending
- 2013-07-30 BR BR112015002057A patent/BR112015002057A2/pt not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2014020034A1 (de) | 2014-02-06 |
CN104508816A (zh) | 2015-04-08 |
CN104508816B (zh) | 2017-08-01 |
MX2015001290A (es) | 2015-04-08 |
DE102013214915A1 (de) | 2014-01-30 |
BR112015002057A2 (pt) | 2017-07-04 |
US20150189783A1 (en) | 2015-07-02 |
KR20150037930A (ko) | 2015-04-08 |
US9661775B2 (en) | 2017-05-23 |
KR102107262B1 (ko) | 2020-05-06 |
EP2880682A1 (de) | 2015-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |