JPS6433955A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS6433955A
JPS6433955A JP19073687A JP19073687A JPS6433955A JP S6433955 A JPS6433955 A JP S6433955A JP 19073687 A JP19073687 A JP 19073687A JP 19073687 A JP19073687 A JP 19073687A JP S6433955 A JPS6433955 A JP S6433955A
Authority
JP
Japan
Prior art keywords
chip
die pad
wing
extended
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19073687A
Other languages
Japanese (ja)
Inventor
Yoshio Urasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP19073687A priority Critical patent/JPS6433955A/en
Publication of JPS6433955A publication Critical patent/JPS6433955A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To omit a conventional anchor cutting step, to reduce intruding paths of moisture and to improve moisture resistance, by providing wing parts, which are extended from a chip-device mounting part. CONSTITUTION:Wing parts 2 are extended from a mounting part 1 for a chip device 3 in this structure. For example, said wing part 2 is extended to an inner lead pushing tool 4 in a step for bonding the semiconductor device 3 to the die pad 1. The pushing tool 4 pushes said wing part 2 together with inner leads 5, and the die pad 1 is fixed. Thus, the vibration of the die pad can be suppressed by holding the wing part. Therefore, an anchor is not necessary. The width of a supporting lead, which is connected to the die pad, is not necessary to be made thick. Therefore, problems which are concerned with these matters, can be solved. The wing parts can be utilized for wiring connection for grounding arbitrary electrode terminals on the chip and for the interconnection of parts at the same potential as the chip.
JP19073687A 1987-07-30 1987-07-30 Lead frame Pending JPS6433955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19073687A JPS6433955A (en) 1987-07-30 1987-07-30 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19073687A JPS6433955A (en) 1987-07-30 1987-07-30 Lead frame

Publications (1)

Publication Number Publication Date
JPS6433955A true JPS6433955A (en) 1989-02-03

Family

ID=16262920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19073687A Pending JPS6433955A (en) 1987-07-30 1987-07-30 Lead frame

Country Status (1)

Country Link
JP (1) JPS6433955A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455245A2 (en) * 1990-05-02 1991-11-06 Kabushiki Kaisha Toshiba IC lead frame appropriate for multi-chip package
WO2014020034A1 (en) * 2012-07-30 2014-02-06 Continental Teves Ag & Co. Ohg Wiring device for wiring an electronic apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455245A2 (en) * 1990-05-02 1991-11-06 Kabushiki Kaisha Toshiba IC lead frame appropriate for multi-chip package
WO2014020034A1 (en) * 2012-07-30 2014-02-06 Continental Teves Ag & Co. Ohg Wiring device for wiring an electronic apparatus
US9661775B2 (en) 2012-07-30 2017-05-23 Continental Teves Ag & Co. Ohg Wiring device for wiring an electronic apparatus

Similar Documents

Publication Publication Date Title
JPS6428930A (en) Semiconductor device
JPS57207356A (en) Semiconductor device
KR850700086A (en) Integrated circuit
EP0977251A4 (en) Resin sealed semiconductor device and method for manufacturing the same
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
EP0354696A3 (en) Semiconductor device assembly comprising a lead frame structure
KR890007410A (en) Semiconductor devices
EP0346061A3 (en) Integrated circuit device having an improved package structure
EP0269336A3 (en) Semiconductor integrated circuit packages
MY123034A (en) Semiconductor device and method of fabricating the same
KR850002173A (en) Method for Grounding Chip Support Pads in Integrated Circuit Devices
KR910001956A (en) Semiconductor device
KR950012694A (en) Semiconductor devices
JPS5571030A (en) Mounting system for semiconductor device
JPS6433955A (en) Lead frame
JPS5721847A (en) Semiconductor device
KR970024110A (en) Semiconductor device and method of manufacturing same (SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME)
JPS5449066A (en) Semiconductor device
KR910003797A (en) Semiconductor device
DE3583970D1 (en) RESISTANCE FOR AN INTEGRATED SEMICONDUCTOR CIRCUIT ARRANGEMENT FROM INTERMETALLIC III-V CONNECTIONS.
JPS5618469A (en) Semiconductor device
JPS6464347A (en) Semiconductor integrated circuit
JPS6450450A (en) Package for semiconductor integrated circuit
SE9904622L (en) Module comprising one or more chips
JPS63104363A (en) Semiconductor integrated circuit device