JPS6433955A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6433955A JPS6433955A JP19073687A JP19073687A JPS6433955A JP S6433955 A JPS6433955 A JP S6433955A JP 19073687 A JP19073687 A JP 19073687A JP 19073687 A JP19073687 A JP 19073687A JP S6433955 A JPS6433955 A JP S6433955A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- die pad
- wing
- extended
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To omit a conventional anchor cutting step, to reduce intruding paths of moisture and to improve moisture resistance, by providing wing parts, which are extended from a chip-device mounting part. CONSTITUTION:Wing parts 2 are extended from a mounting part 1 for a chip device 3 in this structure. For example, said wing part 2 is extended to an inner lead pushing tool 4 in a step for bonding the semiconductor device 3 to the die pad 1. The pushing tool 4 pushes said wing part 2 together with inner leads 5, and the die pad 1 is fixed. Thus, the vibration of the die pad can be suppressed by holding the wing part. Therefore, an anchor is not necessary. The width of a supporting lead, which is connected to the die pad, is not necessary to be made thick. Therefore, problems which are concerned with these matters, can be solved. The wing parts can be utilized for wiring connection for grounding arbitrary electrode terminals on the chip and for the interconnection of parts at the same potential as the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19073687A JPS6433955A (en) | 1987-07-30 | 1987-07-30 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19073687A JPS6433955A (en) | 1987-07-30 | 1987-07-30 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6433955A true JPS6433955A (en) | 1989-02-03 |
Family
ID=16262920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19073687A Pending JPS6433955A (en) | 1987-07-30 | 1987-07-30 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6433955A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455245A2 (en) * | 1990-05-02 | 1991-11-06 | Kabushiki Kaisha Toshiba | IC lead frame appropriate for multi-chip package |
WO2014020034A1 (en) * | 2012-07-30 | 2014-02-06 | Continental Teves Ag & Co. Ohg | Wiring device for wiring an electronic apparatus |
-
1987
- 1987-07-30 JP JP19073687A patent/JPS6433955A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0455245A2 (en) * | 1990-05-02 | 1991-11-06 | Kabushiki Kaisha Toshiba | IC lead frame appropriate for multi-chip package |
WO2014020034A1 (en) * | 2012-07-30 | 2014-02-06 | Continental Teves Ag & Co. Ohg | Wiring device for wiring an electronic apparatus |
US9661775B2 (en) | 2012-07-30 | 2017-05-23 | Continental Teves Ag & Co. Ohg | Wiring device for wiring an electronic apparatus |
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