MX2015001290A - Dispositivo alambrico para el cableado de un aparato electronico. - Google Patents

Dispositivo alambrico para el cableado de un aparato electronico.

Info

Publication number
MX2015001290A
MX2015001290A MX2015001290A MX2015001290A MX2015001290A MX 2015001290 A MX2015001290 A MX 2015001290A MX 2015001290 A MX2015001290 A MX 2015001290A MX 2015001290 A MX2015001290 A MX 2015001290A MX 2015001290 A MX2015001290 A MX 2015001290A
Authority
MX
Mexico
Prior art keywords
wiring
island
electronic apparatus
interface
conductor track
Prior art date
Application number
MX2015001290A
Other languages
English (en)
Other versions
MX341106B (es
Inventor
Jakob Schillinger
Dietmar Huber
Lothar Biebricher
Manfred Goll
Matthias Viering
Original Assignee
Continental Teves Ag & Co Ohg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves Ag & Co Ohg filed Critical Continental Teves Ag & Co Ohg
Publication of MX2015001290A publication Critical patent/MX2015001290A/es
Publication of MX341106B publication Critical patent/MX341106B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0078—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Manufacturing & Machinery (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Air Bags (AREA)
  • Connection Or Junction Boxes (AREA)
  • Casings For Electric Apparatus (AREA)
  • Pressure Sensors (AREA)

Abstract

La invención se refiere a un dispositivo alámbrico (34) para conectar un aparato electrónico (14) que comprende una interfaz (42), un carril conductor eléctrico (40) y una isla de colocación de componentes (38) que está conectada a una interfaz (42) a través de un carril conductor (40) y que se configura para llevar un componente electrónico (26, 28) y para hacer contacto eléctrico con la interfaz (42) a través del carril conductor eléctrico (40), en donde la isla de colocación de componentes (38) está libre de un elemento de la red (58) que se configura para soportar la isla de colocación de componentes (38) sobre un elemento de soporte (56) durante un proceso de alojamiento para alojar la isla de colocación de los componentes (38).
MX2015001290A 2012-07-30 2013-07-30 Dispositivo alambrico para el cableado de un aparato electronico. MX341106B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012213353 2012-07-30
PCT/EP2013/066024 WO2014020034A1 (de) 2012-07-30 2013-07-30 Verdrahtungseinrichtung zum verdrahten einer elektronischen vorrichtung

Publications (2)

Publication Number Publication Date
MX2015001290A true MX2015001290A (es) 2015-04-08
MX341106B MX341106B (es) 2016-08-08

Family

ID=48918386

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015001290A MX341106B (es) 2012-07-30 2013-07-30 Dispositivo alambrico para el cableado de un aparato electronico.

Country Status (8)

Country Link
US (1) US9661775B2 (es)
EP (1) EP2880682A1 (es)
KR (1) KR102107262B1 (es)
CN (1) CN104508816B (es)
BR (1) BR112015002057A2 (es)
DE (1) DE102013214915A1 (es)
MX (1) MX341106B (es)
WO (1) WO2014020034A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013217892A1 (de) 2012-12-20 2014-06-26 Continental Teves Ag & Co. Ohg Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
DE102014210523A1 (de) * 2014-06-03 2015-12-03 Continental Teves Ag & Co. Ohg Spannungsarmes Verkleben von Sensorchips
DE102014213231A1 (de) * 2014-07-08 2016-01-14 Continental Automotive Gmbh Sensorunterseitig verschaltete passive Bauelemente
DE102014213590A1 (de) 2014-07-11 2016-01-14 Continental Teves Ag & Co. Ohg Kundenspezifischer Adapter für Standardsensor
DE102016201097A1 (de) 2015-01-28 2016-07-28 Continental Teves Ag & Co. Ohg Sensor mit symmetrisch eingebetteten Sensorelementen
KR20170108023A (ko) 2015-01-28 2017-09-26 콘티넨탈 테베스 아게 운트 코. 오하게 센서용 매립형 필터 컴포넌트들을 갖는 어댑터
DE102015224257A1 (de) * 2015-12-03 2017-06-08 Continental Teves Ag & Co. Ohg Elektrische Leiterbahn, Verfahren und Verwendung
DE102015225071B4 (de) * 2015-12-14 2023-02-16 Continental Automotive Technologies GmbH Verfahren zur Fertigung eines Raddrehzahlsensors und Raddrehzahlsensor
DE102016207664A1 (de) 2016-05-03 2017-11-09 Continental Teves Ag & Co. Ohg Sensorelement für ein kraftfahrzeug
JP7415731B2 (ja) * 2020-03-27 2024-01-17 住友電装株式会社 センサ装置
JP7342761B2 (ja) * 2020-03-27 2023-09-12 住友電装株式会社 センサ装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910244A (ja) 1982-07-09 1984-01-19 Hitachi Ltd 樹脂封止半導体装置
JPS6433955A (en) 1987-07-30 1989-02-03 Matsushita Electronics Corp Lead frame
JPH025450A (ja) 1988-06-24 1990-01-10 Hitachi Ltd 半導体装置
US5925927A (en) * 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
JP2004198240A (ja) 2002-12-18 2004-07-15 Denso Corp センサ装置
US7012324B2 (en) 2003-09-12 2006-03-14 Freescale Semiconductor, Inc. Lead frame with flag support structure
DE112005000168T5 (de) 2004-01-13 2006-11-30 Mitsui Mining & Smelting Co., Ltd. Verfahren zur Herstellung eines Kunstharzformgehäuses, Alkoholkonzentrationssensor und Vorrichtung zum Messen einer Alkoholkonzentration
ATE341729T1 (de) * 2004-04-19 2006-10-15 Delphi Tech Inc Beleuchtungseinrichtung
US20080013298A1 (en) * 2006-07-14 2008-01-17 Nirmal Sharma Methods and apparatus for passive attachment of components for integrated circuits
DE102008064046A1 (de) * 2008-10-02 2010-04-08 Continental Teves Ag & Co. Ohg Verfahren zur Herstellung eines Geschwindigkeits-Sensorelementes
DE102010005771B4 (de) 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modulares Metallband, Verfahren zur seiner Herstellung und Bauteil mit verbesserter Ebenheit
CN103153729B (zh) 2010-08-10 2016-08-03 大陆-特韦斯贸易合伙股份公司及两合公司 用于调节行驶稳定性的方法和系统
JP5910244B2 (ja) 2012-03-29 2016-04-27 ブラザー工業株式会社 工作機械用制御装置

Also Published As

Publication number Publication date
BR112015002057A2 (pt) 2017-07-04
KR102107262B1 (ko) 2020-05-06
KR20150037930A (ko) 2015-04-08
US9661775B2 (en) 2017-05-23
EP2880682A1 (de) 2015-06-10
CN104508816B (zh) 2017-08-01
US20150189783A1 (en) 2015-07-02
DE102013214915A1 (de) 2014-01-30
WO2014020034A1 (de) 2014-02-06
MX341106B (es) 2016-08-08
CN104508816A (zh) 2015-04-08

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