MX2021005722A - Electrodo con lente termica en generadores termoelectricos para mejorar el rendimiento. - Google Patents

Electrodo con lente termica en generadores termoelectricos para mejorar el rendimiento.

Info

Publication number
MX2021005722A
MX2021005722A MX2021005722A MX2021005722A MX2021005722A MX 2021005722 A MX2021005722 A MX 2021005722A MX 2021005722 A MX2021005722 A MX 2021005722A MX 2021005722 A MX2021005722 A MX 2021005722A MX 2021005722 A MX2021005722 A MX 2021005722A
Authority
MX
Mexico
Prior art keywords
thermoelectric
perimeter
wafer
chip
improved performance
Prior art date
Application number
MX2021005722A
Other languages
English (en)
Spanish (es)
Inventor
Ronald Petkie
John B Newman
Ion M Basa
Original Assignee
Berken Energy Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Berken Energy Llc filed Critical Berken Energy Llc
Publication of MX2021005722A publication Critical patent/MX2021005722A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Photovoltaic Devices (AREA)
  • Die Bonding (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
MX2021005722A 2018-11-16 2019-11-16 Electrodo con lente termica en generadores termoelectricos para mejorar el rendimiento. MX2021005722A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862768679P 2018-11-16 2018-11-16
PCT/US2019/061894 WO2020102785A1 (en) 2018-11-16 2019-11-16 Thermal lensing electrode in thermoelectric generators for improved performance

Publications (1)

Publication Number Publication Date
MX2021005722A true MX2021005722A (es) 2021-09-23

Family

ID=70730616

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2021005722A MX2021005722A (es) 2018-11-16 2019-11-16 Electrodo con lente termica en generadores termoelectricos para mejorar el rendimiento.

Country Status (11)

Country Link
US (3) US11552235B2 (https=)
EP (2) EP4733436A2 (https=)
JP (2) JP7453973B2 (https=)
KR (3) KR102623260B1 (https=)
CN (1) CN113272979B (https=)
AU (3) AU2019381834B2 (https=)
BR (2) BR112021009454B1 (https=)
CA (2) CA3119766A1 (https=)
MX (1) MX2021005722A (https=)
PH (1) PH12021551110A1 (https=)
WO (1) WO2020102785A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021039168A1 (ja) * 2019-08-30 2021-03-04 住友電気工業株式会社 熱電変換材料、熱電変換素子、熱電変換モジュールおよび光センサ
US20250324909A1 (en) * 2022-04-15 2025-10-16 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing
WO2023201062A1 (en) * 2022-04-15 2023-10-19 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing

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US4320251A (en) * 1980-07-28 1982-03-16 Solamat Inc. Ohmic contacts for solar cells by arc plasma spraying
US4654224A (en) 1985-02-19 1987-03-31 Energy Conversion Devices, Inc. Method of manufacturing a thermoelectric element
JP2636119B2 (ja) * 1992-09-08 1997-07-30 工業技術院長 熱電素子シートとその製造方法
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JP2003197987A (ja) 2001-12-25 2003-07-11 Kyocera Corp 熱電素子モジュールならびに半導体素子収納用パッケージおよび半導体モジュール
JP2004087827A (ja) 2002-08-27 2004-03-18 Kyocera Corp 熱電素子搭載用配線基板および熱電素子モジュール
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WO2010090460A2 (ko) * 2009-02-05 2010-08-12 주식회사 엘지화학 열전 소자 모듈 및 열전 소자 제조 방법
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Also Published As

Publication number Publication date
WO2020102785A1 (en) 2020-05-22
KR20210090679A (ko) 2021-07-20
KR102623260B1 (ko) 2024-01-10
BR112021009454A2 (pt) 2021-08-10
EP3881364A1 (en) 2021-09-22
KR20240010530A (ko) 2024-01-23
AU2023274153A1 (en) 2023-12-21
BR112021009454B1 (pt) 2023-09-26
US20230144491A1 (en) 2023-05-11
US20210005803A1 (en) 2021-01-07
US20200403135A1 (en) 2020-12-24
US11476401B2 (en) 2022-10-18
KR20230142637A (ko) 2023-10-11
JP7453973B2 (ja) 2024-03-21
EP3881364A4 (en) 2022-08-10
US12538705B2 (en) 2026-01-27
EP3881364B1 (en) 2026-04-15
AU2019381834B2 (en) 2023-12-07
JP2024060023A (ja) 2024-05-01
EP4733436A2 (en) 2026-04-29
AU2019381834A1 (en) 2021-06-03
CA3220666A1 (en) 2020-05-22
US11552235B2 (en) 2023-01-10
KR102755045B1 (ko) 2025-01-21
CN113272979B (zh) 2024-12-27
KR102582909B1 (ko) 2023-09-26
CN113272979A (zh) 2021-08-17
BR112021009454A8 (pt) 2022-12-20
PH12021551110A1 (en) 2021-12-13
AU2025283525A1 (en) 2026-01-15
CA3119766A1 (en) 2020-05-22
JP7702215B2 (ja) 2025-07-03
JP2022513060A (ja) 2022-02-07
AU2023274153B2 (en) 2025-10-09
BR122022021687B1 (pt) 2023-10-10

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