JP7453973B2 - 性能向上のための熱電発電器における熱レンズ電極 - Google Patents

性能向上のための熱電発電器における熱レンズ電極 Download PDF

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JP7453973B2
JP7453973B2 JP2021526725A JP2021526725A JP7453973B2 JP 7453973 B2 JP7453973 B2 JP 7453973B2 JP 2021526725 A JP2021526725 A JP 2021526725A JP 2021526725 A JP2021526725 A JP 2021526725A JP 7453973 B2 JP7453973 B2 JP 7453973B2
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pellet
metal
thermoelectric
metal layer
semiconductor
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JP2022513060A5 (https=
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ロナルド ペトキー，
ジョン ビー． ニューマン，
イオン エム． バサ，
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エーティーエス アイピー， エルエルシー
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Photovoltaic Devices (AREA)
  • Die Bonding (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2021526725A 2018-11-16 2019-11-16 性能向上のための熱電発電器における熱レンズ電極 Active JP7453973B2 (ja)

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JP2024035687A JP7702215B2 (ja) 2018-11-16 2024-03-08 性能向上のための熱電発電器における熱レンズ電極

Applications Claiming Priority (3)

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US201862768679P 2018-11-16 2018-11-16
US62/768,679 2018-11-16
PCT/US2019/061894 WO2020102785A1 (en) 2018-11-16 2019-11-16 Thermal lensing electrode in thermoelectric generators for improved performance

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US (3) US11552235B2 (https=)
EP (2) EP4733436A2 (https=)
JP (2) JP7453973B2 (https=)
KR (3) KR102623260B1 (https=)
CN (1) CN113272979B (https=)
AU (3) AU2019381834B2 (https=)
BR (2) BR112021009454B1 (https=)
CA (2) CA3119766A1 (https=)
MX (1) MX2021005722A (https=)
PH (1) PH12021551110A1 (https=)
WO (1) WO2020102785A1 (https=)

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WO2021039168A1 (ja) * 2019-08-30 2021-03-04 住友電気工業株式会社 熱電変換材料、熱電変換素子、熱電変換モジュールおよび光センサ
US20250324909A1 (en) * 2022-04-15 2025-10-16 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing
WO2023201062A1 (en) * 2022-04-15 2023-10-19 Ats Ip, Llc Unipolar thermoelectric generator with vertical interconnects and thermal focusing

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JP2006294935A (ja) 2005-04-12 2006-10-26 Kiyoshi Inaizumi 高能率低損失熱電モジュール
JP2008166638A (ja) 2007-01-04 2008-07-17 Toyota Motor Corp 熱電素子モジュール
JP2009117645A (ja) 2007-11-07 2009-05-28 Showa Denko Kk 熱電素子用電極および熱電モジュール
JP2013026567A (ja) 2011-07-25 2013-02-04 Denso Corp 熱電素子の製造方法

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JP2004087827A (ja) 2002-08-27 2004-03-18 Kyocera Corp 熱電素子搭載用配線基板および熱電素子モジュール
JP2006294935A (ja) 2005-04-12 2006-10-26 Kiyoshi Inaizumi 高能率低損失熱電モジュール
JP2008166638A (ja) 2007-01-04 2008-07-17 Toyota Motor Corp 熱電素子モジュール
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JP2013026567A (ja) 2011-07-25 2013-02-04 Denso Corp 熱電素子の製造方法

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WO2020102785A1 (en) 2020-05-22
KR20210090679A (ko) 2021-07-20
KR102623260B1 (ko) 2024-01-10
BR112021009454A2 (pt) 2021-08-10
EP3881364A1 (en) 2021-09-22
KR20240010530A (ko) 2024-01-23
AU2023274153A1 (en) 2023-12-21
BR112021009454B1 (pt) 2023-09-26
US20230144491A1 (en) 2023-05-11
US20210005803A1 (en) 2021-01-07
US20200403135A1 (en) 2020-12-24
US11476401B2 (en) 2022-10-18
KR20230142637A (ko) 2023-10-11
EP3881364A4 (en) 2022-08-10
US12538705B2 (en) 2026-01-27
EP3881364B1 (en) 2026-04-15
AU2019381834B2 (en) 2023-12-07
JP2024060023A (ja) 2024-05-01
MX2021005722A (es) 2021-09-23
EP4733436A2 (en) 2026-04-29
AU2019381834A1 (en) 2021-06-03
CA3220666A1 (en) 2020-05-22
US11552235B2 (en) 2023-01-10
KR102755045B1 (ko) 2025-01-21
CN113272979B (zh) 2024-12-27
KR102582909B1 (ko) 2023-09-26
CN113272979A (zh) 2021-08-17
BR112021009454A8 (pt) 2022-12-20
PH12021551110A1 (en) 2021-12-13
AU2025283525A1 (en) 2026-01-15
CA3119766A1 (en) 2020-05-22
JP7702215B2 (ja) 2025-07-03
JP2022513060A (ja) 2022-02-07
AU2023274153B2 (en) 2025-10-09
BR122022021687B1 (pt) 2023-10-10

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