MX2018013681A - Metodo de proceso de tratamiento superficial y dispositivo de proceso de tratamiento superficial. - Google Patents

Metodo de proceso de tratamiento superficial y dispositivo de proceso de tratamiento superficial.

Info

Publication number
MX2018013681A
MX2018013681A MX2018013681A MX2018013681A MX2018013681A MX 2018013681 A MX2018013681 A MX 2018013681A MX 2018013681 A MX2018013681 A MX 2018013681A MX 2018013681 A MX2018013681 A MX 2018013681A MX 2018013681 A MX2018013681 A MX 2018013681A
Authority
MX
Mexico
Prior art keywords
treatment
inspection
surface treatment
shot
treatment processing
Prior art date
Application number
MX2018013681A
Other languages
English (en)
Inventor
Kobayashi Yuji
Iwata Kyoichi
Koyama Takuya
Matsui Akinori
Original Assignee
Sintokogio Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintokogio Ltd filed Critical Sintokogio Ltd
Publication of MX2018013681A publication Critical patent/MX2018013681A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/10—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for compacting surfaces, e.g. shot-peening
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/34—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
    • G01B7/345—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/25—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/207—Diffractometry using detectors, e.g. using a probe in a central position and one or more displaceable detectors in circumferential positions
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Mechanical Engineering (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Un primer paso de inspección inspecciona de manera no destructiva un estado del lado superficial de un objetivo de tratamiento que será sometido a proceso de granallado que consiste en disparar medios de granalla al objetivo de tratamiento y evalúa que el objetivo de tratamiento es fallido cuando un resultado de inspección se desvía de un primer rango admisible predeterminado. Un paso de ajuste de condición ajusta una condición de proceso de granallado en respuesta al resultado de inspección del primer paso de inspección para el objetivo de tratamiento evaluado como no fallido en el primer paso de inspección. Un paso de proceso de granallado lleva a cabo proceso de granallado que consiste en disparar medios de granalla al objetivo de tratamiento evaluado como no fallido en el primer paso de inspección en la condición de proceso de granallado ajustada en el paso de ajuste de condición. Un segundo paso de inspección después del paso de proceso de granallado inspecciona de manera no destructiva un estado del lado superficial del objetivo de tratamiento.
MX2018013681A 2016-05-16 2017-05-16 Metodo de proceso de tratamiento superficial y dispositivo de proceso de tratamiento superficial. MX2018013681A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016098179 2016-05-16
PCT/JP2017/018377 WO2017199959A1 (ja) 2016-05-16 2017-05-16 表面処理加工方法及び表面処理加工装置

Publications (1)

Publication Number Publication Date
MX2018013681A true MX2018013681A (es) 2019-05-02

Family

ID=60325184

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018013681A MX2018013681A (es) 2016-05-16 2017-05-16 Metodo de proceso de tratamiento superficial y dispositivo de proceso de tratamiento superficial.

Country Status (9)

Country Link
US (1) US11045922B2 (es)
EP (1) EP3388196B1 (es)
JP (1) JP6756366B2 (es)
KR (1) KR102373431B1 (es)
CN (1) CN109153109B (es)
BR (1) BR112018014159A2 (es)
MX (1) MX2018013681A (es)
TW (1) TWI776811B (es)
WO (1) WO2017199959A1 (es)

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JP6848838B2 (ja) * 2017-11-30 2021-03-24 新東工業株式会社 ショット装置
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JP6973277B2 (ja) * 2018-04-27 2021-11-24 新東工業株式会社 中子検査装置、中子検査システム、及び中子検査方法
JP7101040B2 (ja) 2018-05-09 2022-07-14 三菱製鋼株式会社 ばねの製造方法及びばね
JP6676241B1 (ja) * 2018-12-11 2020-04-08 パルステック工業株式会社 Ｘ線回折測定装置
JP6984623B2 (ja) * 2019-02-01 2021-12-22 新東工業株式会社 スラリー供給装置、湿式ブラスト加工装置及びスラリー供給方法
JP6818224B2 (ja) * 2019-02-12 2021-01-20 パルステック工業株式会社 Ｘ線回折測定装置
JP7270572B2 (ja) * 2020-03-24 2023-05-10 日立Astemo株式会社 投射材の投射条件決定方法及びコイルばねの製造方法
US11625844B2 (en) * 2020-05-11 2023-04-11 The Boeing Company Rapid effective case depth measurement of a metal component using physical surface conditioning
CN214107934U (zh) * 2020-09-25 2021-09-03 鸿富锦精密电子(郑州)有限公司 检测装置
CN114473876B (zh) * 2022-02-08 2023-03-24 成都中科翼能科技有限公司 一种清除叶片表面残余渗层的方法

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Also Published As

Publication number Publication date
CN109153109A (zh) 2019-01-04
EP3388196A1 (en) 2018-10-17
CN109153109B (zh) 2020-11-20
EP3388196B1 (en) 2024-07-17
US20190143482A1 (en) 2019-05-16
EP3388196A4 (en) 2019-07-31
JPWO2017199959A1 (ja) 2019-03-28
TWI776811B (zh) 2022-09-11
BR112018014159A2 (pt) 2018-12-11
KR102373431B1 (ko) 2022-03-11
KR20190008182A (ko) 2019-01-23
US11045922B2 (en) 2021-06-29
TW201801856A (zh) 2018-01-16
WO2017199959A1 (ja) 2017-11-23
JP6756366B2 (ja) 2020-09-16

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