MX2015004055A - Componentes electricos y metodos y sistemas de fabricacion de componentes electricos. - Google Patents

Componentes electricos y metodos y sistemas de fabricacion de componentes electricos.

Info

Publication number
MX2015004055A
MX2015004055A MX2015004055A MX2015004055A MX2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A MX 2015004055 A MX2015004055 A MX 2015004055A
Authority
MX
Mexico
Prior art keywords
coating layer
electrical components
irradiating
layer
electrical conductor
Prior art date
Application number
MX2015004055A
Other languages
English (en)
Other versions
MX350165B (es
Inventor
Helge Schmidt
Michael Leidner
Soenke Sachs
Marjorie Kay Myers
Dominique Marie M Freckmann
Eva Henshel
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of MX2015004055A publication Critical patent/MX2015004055A/es
Publication of MX350165B publication Critical patent/MX350165B/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Un método para fabricar un componente eléctrico (100) incluye proporcionar un sustrato aislante eléctrico (104) que tiene una superficie exterior (108) aplicar una capa de recubrimiento en la superficie exterior e irradiar la capa de revestimiento (106) con un haz de electrones (110) para formar un conductor eléctrico (102) sobre el sustrato. La irradiación puede incluir calentar la capa de revestimiento para fundir la capa de revestimiento para formar el conductor eléctrico. La capa de revestimiento puede tener una baja concentración de aglutinante y un una elevada concentración de metal. La irradiación puede incluir vaporizar sustancialmente todo el aglutinante dejando una capa metálica sustancialmente pura para formar el conductor eléctrico. La capa de recubrimiento puede ser irradiada hasta que el material no metálico de la capa de revestimiento se haya eliminado por completo.
MX2015004055A 2012-10-05 2013-09-23 Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos. MX350165B (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261710365P 2012-10-05 2012-10-05
US13/836,861 US20140097002A1 (en) 2012-10-05 2013-03-15 Electrical components and methods and systems of manufacturing electrical components
PCT/US2013/061107 WO2014055271A1 (en) 2012-10-05 2013-09-23 Electrical components and methods and systems of manufacturing electrical components

Publications (2)

Publication Number Publication Date
MX2015004055A true MX2015004055A (es) 2016-02-22
MX350165B MX350165B (es) 2017-08-29

Family

ID=50431849

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015004055A MX350165B (es) 2012-10-05 2013-09-23 Componentes eléctricos y métodos y sistemas de fabricación de componentes eléctricos.

Country Status (8)

Country Link
US (2) US20140097002A1 (es)
EP (1) EP2904883A1 (es)
JP (1) JP2015530760A (es)
KR (1) KR101728619B1 (es)
CN (1) CN104704930B (es)
BR (1) BR112015007557A2 (es)
MX (1) MX350165B (es)
WO (1) WO2014055271A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013113485A1 (de) * 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Ausbilden einer elektrisch leitfähigen Struktur auf einem Kunststoffsubstrat
DE102015210460B4 (de) * 2015-06-08 2021-10-07 Te Connectivity Germany Gmbh Verfahren zur Veränderung mechanischer und/oder elektrischer Eigenschaften zumindest eines Bereichs eines elektrischen Kontaktelements
US20170105287A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Process of Producing Electronic Component and an Electronic Component
US20170100916A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
TWI608639B (zh) * 2016-12-06 2017-12-11 財團法人工業技術研究院 可撓熱電結構與其形成方法
JP6699827B2 (ja) * 2016-12-27 2020-05-27 Ｎｅｘｔ Ｉｎｎｏｖａｔｉｏｎ合同会社 ダイヤモンド系通電構造の製造方法
US20190059158A1 (en) * 2017-08-17 2019-02-21 Avery Dennison Retail Information Services, Llc Use of rf driven coherence between conductive particles for rfid antennas
TWI662872B (zh) * 2018-01-26 2019-06-11 謝孟修 陶瓷電路板及其製法
CN110233170B (zh) 2019-06-21 2021-10-12 京东方科技集团股份有限公司 显示基板及其制作方法、显示装置
EP3761452A1 (de) * 2019-07-03 2021-01-06 Gebauer & Griller Kabelwerke Gesellschaft m.b.H. Elektrische verbindung zwischen einem elektrischen leiter und einem kontaktelement
US11554537B2 (en) * 2021-02-09 2023-01-17 Xerox Corporation Polymer filaments comprising a metal precursor for additive manufacturing and methods associated therewith
US20230268682A1 (en) * 2022-02-23 2023-08-24 TE Connectivity Services Gmbh Metal polymer composite films as contact finish for low normal load sockets

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3081485A (en) * 1958-11-20 1963-03-19 Steigerwald Karl Heinz Process and apparatus for treating synthetic plastic materials
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3968056A (en) * 1974-09-27 1976-07-06 General Electric Company Radiation curable inks
JPS59204036A (ja) * 1983-05-06 1984-11-19 Dainippon Ink & Chem Inc レジストパタ−ンの形成法
JPS60167491A (ja) * 1984-02-10 1985-08-30 株式会社東芝 導体路形成方法
US4942110A (en) * 1988-08-29 1990-07-17 Xerox Corporation High resolution conductor patterning
JPH04247681A (ja) * 1991-02-04 1992-09-03 Fujitsu Ltd 導体パターンの形成方法
US5141602A (en) * 1991-06-18 1992-08-25 International Business Machines Corporation High-productivity method and apparatus for making customized interconnections
US5599468A (en) 1994-10-03 1997-02-04 Frederick M. Mako Pulsed electron beam joining of materials
US5855755A (en) * 1995-06-19 1999-01-05 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
JPH09110534A (ja) * 1995-10-13 1997-04-28 Dainippon Printing Co Ltd 焼結体膜の形成方法
US5825123A (en) * 1996-03-28 1998-10-20 Retsky; Michael W. Method and apparatus for deflecting a charged particle stream
US5780970A (en) * 1996-10-28 1998-07-14 University Of Maryland Multi-stage depressed collector for small orbit gyrotrons
US5897794A (en) 1997-01-30 1999-04-27 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for ablative bonding using a pulsed electron
JP3422233B2 (ja) 1997-09-26 2003-06-30 株式会社村田製作所 バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法
US6235353B1 (en) 1998-02-24 2001-05-22 Alliedsignal Inc. Low dielectric constant films with high glass transition temperatures made by electron beam curing
JP3232051B2 (ja) * 1998-09-28 2001-11-26 京セラ株式会社 電子装置の製造方法
US6187418B1 (en) 1999-07-19 2001-02-13 International Business Machines Corporation Multilayer ceramic substrate with anchored pad
KR20030076925A (ko) * 2000-02-21 2003-09-29 도요 잉키 세이조 가부시끼가이샤 활성 에너지선 경화형 도전성 페이스트, 도체 회로 기판의제조방법과 장치, 및 비접촉 ｉｄ와 그 제조 방법
US20040209190A1 (en) * 2000-12-22 2004-10-21 Yoshiaki Mori Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting device
EP1223615A1 (en) * 2001-01-10 2002-07-17 Eidgenössische Technische Hochschule Zürich A method for producing a structure using nanoparticles
US7069645B2 (en) 2001-03-29 2006-07-04 Ngk Insulators, Ltd. Method for producing a circuit board
US20050191439A1 (en) * 2002-06-05 2005-09-01 Toyo Ink Mfg. Co., Ltd. Shrink film, process for producing the same, printing ink, print produced therewith and process for producing print
JP4378476B2 (ja) * 2004-03-10 2009-12-09 独立行政法人産業技術総合研究所 新規な金属クラスター集合体、ポリメチルメタクリレート−金属クラスター複合体及びその新規な製造方法
US7321098B2 (en) 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
JP4536601B2 (ja) 2004-06-14 2010-09-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7494923B2 (en) * 2004-06-14 2009-02-24 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of wiring substrate and semiconductor device
JP4535797B2 (ja) * 2004-07-21 2010-09-01 ハリマ化成株式会社 金属微粒子焼結体型の薄膜導電体層の形成方法、該方法を応用した金属配線ならびに金属薄膜の形成方法
US7569331B2 (en) * 2005-06-01 2009-08-04 Hewlett-Packard Development Company, L.P. Conductive patterning
TW200643124A (en) * 2005-06-08 2006-12-16 Yung-Shu Yang The radiation hardening conductive ink and the manufacturing method of conductive substrate by using radiation hardening conductive ink
JP4378334B2 (ja) 2005-09-09 2009-12-02 日本碍子株式会社 ヒートスプレッダモジュール及びその製造方法
US7427765B2 (en) * 2005-10-03 2008-09-23 Jeol, Ltd. Electron beam column for writing shaped electron beams
US7833427B2 (en) * 2006-08-14 2010-11-16 Micron Technology, Inc. Electron beam etching device and method
US20090011143A1 (en) * 2007-06-22 2009-01-08 Matsushita Electric Industrial Co., Ltd. Pattern forming apparatus and pattern forming method
JP2009283547A (ja) * 2008-05-20 2009-12-03 Dainippon Printing Co Ltd 導電性パターンの形成方法とその形成装置並びに導電性基板
JP2009290112A (ja) * 2008-05-30 2009-12-10 Fujifilm Corp 導電性無機膜とその製造方法、配線基板、半導体装置
JP5387034B2 (ja) * 2009-02-20 2014-01-15 大日本印刷株式会社 導電性基板
KR20100137216A (ko) 2009-06-22 2010-12-30 주식회사 이그잭스 엘이디 어레이 기판 및 이의 제조방법
JP5616070B2 (ja) * 2010-01-21 2014-10-29 株式会社フジクラ 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法
JP2012178486A (ja) * 2011-02-28 2012-09-13 Hitachi Computer Peripherals Co Ltd 抵抗器化回路付きプリント配線板、該配線板の作製装置及び該配線板の作製方法
KR101310479B1 (ko) 2011-02-28 2013-09-24 삼성전기주식회사 도전성 금속 페이스트 조성물 및 이의 제조방법

Also Published As

Publication number Publication date
JP2015530760A (ja) 2015-10-15
US20150319865A1 (en) 2015-11-05
CN104704930A (zh) 2015-06-10
EP2904883A1 (en) 2015-08-12
KR101728619B1 (ko) 2017-04-19
CN104704930B (zh) 2019-01-15
BR112015007557A2 (pt) 2017-07-04
MX350165B (es) 2017-08-29
KR20150052279A (ko) 2015-05-13
US20140097002A1 (en) 2014-04-10
US10154595B2 (en) 2018-12-11
WO2014055271A1 (en) 2014-04-10

Similar Documents

Publication Publication Date Title
MX2015004055A (es) Componentes electricos y metodos y sistemas de fabricacion de componentes electricos.
TR201910192T4 (tr) İzole elektrik iletkeni.
MX2018006611A (es) Pelicula y metodo para producir una pelicula.
EA201690433A1 (ru) Способ получения подложки, снабженной покрытием, содержащим несплошной тонкий металлический слой
GB2499560A (en) Insulated metal substrate
MX2014007900A (es) Dispositivos electroluminiscentes y su fabricacion.
MY178732A (en) Carbon-coated metal powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder
MX2019001401A (es) Vaporizador de un dispositivo de vaporizacion electronico y metodo de formacion de un vaporizador.
GB2522825A (en) Cobalt based interconnects and methods of fabrication thereof
MX342484B (es) Blindaje para componentes de cable y metodo.
TW200733145A (en) Electron attachment assisted formation of electrical conductors
PH12015502726A1 (en) Method for producing plated laminate, and plated laminate
GB201212407D0 (en) Composition for forming a seed layer
MX2013011590A (es) Metodo para fabricar por lo menos un area funcional en un elemento de contacto electrico tal como un contacto de conmutacion o un contacto de enchufe.
MY172597A (en) Metal-film forming apparatus and metal-film forming method
WO2012137572A9 (ja) リン酸鉄リチウム正極材料およびその製造方法
MY166609A (en) Connector assembly and method of manufacture
MX362937B (es) Compuestos de contacto eléctrico y método para producir compuestos de contacto eléctrico.
CL2012003442A1 (es) Metodo para depositar una capa de metal con particulas luminescentes incorporadas a un sustrato de metal, que comprende mezclar dichas particulas con un material metalico para producir una solucion de galvanizado, insertar el sustrato en dicha solucion y realizar un proceso de galvanizado; sutrato de metal; y metodo para autenticar un objeto metalico.
MX2014001980A (es) Metodo de formación de una imagen conductora sobre una superficie no conductora.
SG10201808518RA (en) Bonding electronic components to patterned nanowire transparent conductors
WO2016146323A3 (de) Chipanordnung und verfahren zur ausbildung einer kontaktverbindung
MX2019002691A (es) Metodos para revestir un sustrato electricamente conductivo y composiciones electrodepositables relacionadas, que incluyen particulas de carbono grafenico.
MX2020005381A (es) Empaque con recubrimiento de aislamiento electrico.
WO2015156894A3 (en) Carbon nanotube-coated substrates and methods of making the same

Legal Events

Date Code Title Description
HC Change of company name or juridical status

Owner name: MOERAE MATRIX, INC.

Owner name: SIEMENS AKTIENGESELLSCHAFT

FG Grant or registration