MX165687B - Mejoras a composicion de baño para electrodepositar cobre sobre un substrato conductivo - Google Patents
Mejoras a composicion de baño para electrodepositar cobre sobre un substrato conductivoInfo
- Publication number
- MX165687B MX165687B MX19994584A MX19994584A MX165687B MX 165687 B MX165687 B MX 165687B MX 19994584 A MX19994584 A MX 19994584A MX 19994584 A MX19994584 A MX 19994584A MX 165687 B MX165687 B MX 165687B
- Authority
- MX
- Mexico
- Prior art keywords
- amount
- present
- mixture
- acid
- bath
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 7
- 239000000758 substrate Substances 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 abstract 2
- -1 carbonate compound Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910001431 copper ion Inorganic materials 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 239000012670 alkaline solution Substances 0.000 abstract 1
- 239000013522 chelant Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002659 electrodeposit Substances 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/455,353 US4469569A (en) | 1983-01-03 | 1983-01-03 | Cyanide-free copper plating process |
| US06/551,135 US4462874A (en) | 1983-11-16 | 1983-11-16 | Cyanide-free copper plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX165687B true MX165687B (es) | 1992-11-27 |
Family
ID=27037829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX19994584A MX165687B (es) | 1983-01-03 | 1984-01-02 | Mejoras a composicion de baño para electrodepositar cobre sobre un substrato conductivo |
Country Status (8)
| Country | Link |
|---|---|
| AU (1) | AU575037B2 (en:Method) |
| BR (1) | BR8400007A (en:Method) |
| CA (1) | CA1225064A (en:Method) |
| DE (1) | DE3347593A1 (en:Method) |
| ES (2) | ES528624A0 (en:Method) |
| FR (1) | FR2538815B1 (en:Method) |
| GB (2) | GB2133040B (en:Method) |
| MX (1) | MX165687B (en:Method) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4933051A (en) * | 1989-07-24 | 1990-06-12 | Omi International Corporation | Cyanide-free copper plating process |
| CA2053342A1 (en) * | 1990-10-22 | 1992-04-23 | Robert A. Tremmel | Nickel electroplating process with reduced nickel ion build up |
| KR100877923B1 (ko) * | 2001-06-07 | 2009-01-12 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 전해 구리 도금법 |
| RU2334831C2 (ru) * | 2006-10-31 | 2008-09-27 | Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" | Электролит меднения |
| CN102605401B (zh) * | 2012-03-23 | 2015-11-18 | 如皋市易达电子有限责任公司 | 一种表面处理槽在线锡回收结构 |
| DE102013021502A1 (de) | 2013-12-19 | 2015-06-25 | Schlenk Metallfolien Gmbh & Co. Kg | Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen |
| CN113652720B (zh) * | 2021-07-15 | 2023-06-13 | 江门市瑞期精细化学工程有限公司 | 一种无氰镀铜打底的方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB539882A (en) * | 1939-09-16 | 1941-09-26 | Mond Nickel Co Ltd | Improvements relating to apparatus for electroplating |
| DE1496916B1 (de) * | 1964-09-22 | 1969-10-23 | Monsanto Co | Cyanidfreies,galvanisches Bad und Verfahren zum Abscheiden galvanischer UEberzuege |
| US3796634A (en) * | 1970-03-19 | 1974-03-12 | Us Health Education & Welfare | Insolubilized biologically active enzymes |
| BE791401A (fr) * | 1971-11-15 | 1973-05-14 | Monsanto Co | Compositions et procedes electrochimiques |
| NL7306732A (en:Method) * | 1972-05-17 | 1973-11-20 | ||
| US3806429A (en) * | 1972-07-03 | 1974-04-23 | Oxy Metal Finishing Corp | Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating |
| US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
| US3914162A (en) * | 1973-06-25 | 1975-10-21 | Monsanto Co | Compositions and process for the electrodeposition of metals |
| US3928147A (en) * | 1973-10-09 | 1975-12-23 | Monsanto Co | Method for electroplating |
| US3879270A (en) * | 1974-01-10 | 1975-04-22 | Monsanto Co | Compositions and process for the electrodeposition of metals |
| GB1419613A (en) * | 1974-06-13 | 1975-12-31 | Lea Ronal Inc | Cyanidefree electroplating baths |
| US3974044A (en) * | 1975-03-31 | 1976-08-10 | Oxy Metal Industries Corporation | Bath and method for the electrodeposition of bright nickel-iron deposits |
| US4179343A (en) * | 1979-02-12 | 1979-12-18 | Oxy Metal Industries Corporation | Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits |
| DE3012168A1 (de) * | 1980-03-27 | 1981-10-01 | Schering Ag Berlin Und Bergkamen, 1000 Berlin | Verfahren zur galvanischen abscheidung von kupferniederschlaegen |
-
1983
- 1983-12-30 DE DE19833347593 patent/DE3347593A1/de active Granted
- 1983-12-30 AU AU23054/84A patent/AU575037B2/en not_active Ceased
- 1983-12-30 FR FR8321129A patent/FR2538815B1/fr not_active Expired - Lifetime
-
1984
- 1984-01-02 BR BR8400007A patent/BR8400007A/pt not_active IP Right Cessation
- 1984-01-02 MX MX19994584A patent/MX165687B/es unknown
- 1984-01-02 ES ES528624A patent/ES528624A0/es active Granted
- 1984-01-03 GB GB08400009A patent/GB2133040B/en not_active Expired
- 1984-01-03 CA CA000444571A patent/CA1225064A/en not_active Expired
- 1984-08-16 ES ES535227A patent/ES535227A0/es active Granted
-
1985
- 1985-12-04 GB GB08529856A patent/GB2167447B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BR8400007A (pt) | 1984-07-31 |
| GB2167447B (en) | 1987-03-04 |
| GB2133040B (en) | 1987-02-04 |
| ES8506112A1 (es) | 1985-06-16 |
| GB8400009D0 (en) | 1984-02-08 |
| GB2167447A (en) | 1986-05-29 |
| GB8529856D0 (en) | 1986-01-15 |
| FR2538815A1 (fr) | 1984-07-06 |
| AU2305483A (en) | 1984-07-05 |
| GB2133040A (en) | 1984-07-18 |
| ES535227A0 (es) | 1985-06-16 |
| ES8501454A1 (es) | 1984-12-01 |
| DE3347593C2 (en:Method) | 1990-05-31 |
| DE3347593A1 (de) | 1984-07-05 |
| AU575037B2 (en) | 1988-07-21 |
| FR2538815B1 (fr) | 1990-02-02 |
| CA1225064A (en) | 1987-08-04 |
| ES528624A0 (es) | 1984-12-01 |
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