ES535227A0 - Un procedimiento para electrodepositar una capa de cobre ductil y adherente - Google Patents

Un procedimiento para electrodepositar una capa de cobre ductil y adherente

Info

Publication number
ES535227A0
ES535227A0 ES535227A ES535227A ES535227A0 ES 535227 A0 ES535227 A0 ES 535227A0 ES 535227 A ES535227 A ES 535227A ES 535227 A ES535227 A ES 535227A ES 535227 A0 ES535227 A0 ES 535227A0
Authority
ES
Spain
Prior art keywords
ductile
depositing
procedure
copper layer
adhesive copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES535227A
Other languages
English (en)
Other versions
ES8506112A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/455,353 external-priority patent/US4469569A/en
Priority claimed from US06/551,135 external-priority patent/US4462874A/en
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of ES535227A0 publication Critical patent/ES535227A0/es
Publication of ES8506112A1 publication Critical patent/ES8506112A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES535227A 1983-01-03 1984-08-16 Un procedimiento para electrodepositar una capa de cobre ductil y adherente Expired ES8506112A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US06/551,135 US4462874A (en) 1983-11-16 1983-11-16 Cyanide-free copper plating process

Publications (2)

Publication Number Publication Date
ES535227A0 true ES535227A0 (es) 1985-06-16
ES8506112A1 ES8506112A1 (es) 1985-06-16

Family

ID=27037829

Family Applications (2)

Application Number Title Priority Date Filing Date
ES528624A Granted ES528624A0 (es) 1983-01-03 1984-01-02 Un procedimiento para electrodepositar una capa primaria de cobre ductil y adherente.
ES535227A Expired ES8506112A1 (es) 1983-01-03 1984-08-16 Un procedimiento para electrodepositar una capa de cobre ductil y adherente

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES528624A Granted ES528624A0 (es) 1983-01-03 1984-01-02 Un procedimiento para electrodepositar una capa primaria de cobre ductil y adherente.

Country Status (8)

Country Link
AU (1) AU575037B2 (es)
BR (1) BR8400007A (es)
CA (1) CA1225064A (es)
DE (1) DE3347593A1 (es)
ES (2) ES528624A0 (es)
FR (1) FR2538815B1 (es)
GB (2) GB2133040B (es)
MX (1) MX165687B (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
TWI268966B (en) 2001-06-07 2006-12-21 Shipley Co Llc Electrolytic copper plating method
CN102605401B (zh) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 一种表面处理槽在线锡回收结构
DE102013021502A1 (de) 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen
CN113652720B (zh) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 一种无氰镀铜打底的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB539882A (en) * 1939-09-16 1941-09-26 Mond Nickel Co Ltd Improvements relating to apparatus for electroplating
DE1496917A1 (de) * 1964-09-22 1969-05-22 Monsanto Co Elektrolytbaeder sowie Verfahren fuer die Herstellung galvanischer UEberzuege
US3796634A (en) * 1970-03-19 1974-03-12 Us Health Education & Welfare Insolubilized biologically active enzymes
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
NL7306732A (es) * 1972-05-17 1973-11-20
US3806429A (en) * 1972-07-03 1974-04-23 Oxy Metal Finishing Corp Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths
US3974044A (en) * 1975-03-31 1976-08-10 Oxy Metal Industries Corporation Bath and method for the electrodeposition of bright nickel-iron deposits
US4179343A (en) * 1979-02-12 1979-12-18 Oxy Metal Industries Corporation Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen

Also Published As

Publication number Publication date
GB2133040A (en) 1984-07-18
GB2167447B (en) 1987-03-04
GB2133040B (en) 1987-02-04
GB8529856D0 (en) 1986-01-15
GB8400009D0 (en) 1984-02-08
DE3347593C2 (es) 1990-05-31
BR8400007A (pt) 1984-07-31
AU575037B2 (en) 1988-07-21
ES8501454A1 (es) 1984-12-01
FR2538815B1 (fr) 1990-02-02
MX165687B (es) 1992-11-27
CA1225064A (en) 1987-08-04
GB2167447A (en) 1986-05-29
AU2305483A (en) 1984-07-05
FR2538815A1 (fr) 1984-07-06
ES8506112A1 (es) 1985-06-16
ES528624A0 (es) 1984-12-01
DE3347593A1 (de) 1984-07-05

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20040601