MX164110B - Proceso de chapeado de cobre libre de cianuro - Google Patents

Proceso de chapeado de cobre libre de cianuro

Info

Publication number
MX164110B
MX164110B MX21681A MX2168190A MX164110B MX 164110 B MX164110 B MX 164110B MX 21681 A MX21681 A MX 21681A MX 2168190 A MX2168190 A MX 2168190A MX 164110 B MX164110 B MX 164110B
Authority
MX
Mexico
Prior art keywords
copper plating
plating process
free copper
cyanide free
cyanide
Prior art date
Application number
MX21681A
Other languages
English (en)
Inventor
George A Kline
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of MX164110B publication Critical patent/MX164110B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Conductive Materials (AREA)
  • Removal Of Specific Substances (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
MX21681A 1989-07-24 1990-07-20 Proceso de chapeado de cobre libre de cianuro MX164110B (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/382,441 US4933051A (en) 1989-07-24 1989-07-24 Cyanide-free copper plating process

Publications (1)

Publication Number Publication Date
MX164110B true MX164110B (es) 1992-07-16

Family

ID=23508963

Family Applications (1)

Application Number Title Priority Date Filing Date
MX21681A MX164110B (es) 1989-07-24 1990-07-20 Proceso de chapeado de cobre libre de cianuro

Country Status (8)

Country Link
US (1) US4933051A (es)
JP (1) JP3131648B2 (es)
AU (1) AU647402B2 (es)
DE (1) DE4023444C2 (es)
FR (1) FR2649996B1 (es)
GB (1) GB2234260B (es)
IT (1) IT1240490B (es)
MX (1) MX164110B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5273637A (en) * 1989-08-09 1993-12-28 Poly Techs, Inc. Electrodeposition coating system
GB9005337D0 (en) * 1990-03-09 1990-05-02 Dowty Electronic Components Electrodeposition of lithium
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
GB2337765A (en) * 1998-05-27 1999-12-01 Solicitor For The Affairs Of H Aluminium diffusion of copper coatings
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
US20050145499A1 (en) * 2000-06-05 2005-07-07 Applied Materials, Inc. Plating of a thin metal seed layer
US7273535B2 (en) 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
KR100877923B1 (ko) * 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 전해 구리 도금법
JP4806498B2 (ja) * 2001-08-01 2011-11-02 凸版印刷株式会社 プリント配線基板の製造装置および製造方法
US7422673B2 (en) * 2003-05-22 2008-09-09 Ufs Corporation Membrane electrode assemblies and electropaint systems incorporating same
US7252706B2 (en) * 2003-06-17 2007-08-07 Phibro-Tech, Inc. Inhibition of calcium and magnesium precipitation from wood preservatives
US7105879B2 (en) * 2004-04-20 2006-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Write line design in MRAM
US7803257B2 (en) 2004-10-22 2010-09-28 Taiwan Semiconductor Manufacturing Company Current-leveling electroplating/electropolishing electrode
CN101405435B (zh) * 2006-02-07 2010-11-03 日立金属株式会社 表面具有镀铜覆膜的稀土类永久磁铁的制造方法
US20080156652A1 (en) * 2006-12-28 2008-07-03 Chang Gung University Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof
US20090250352A1 (en) * 2008-04-04 2009-10-08 Emat Technology, Llc Methods for electroplating copper
CN103388164A (zh) * 2013-08-09 2013-11-13 湖北德美科技有限公司 一种无氰碱铜电镀工艺及配方
CN105177684A (zh) * 2015-07-17 2015-12-23 武汉吉和昌化工科技股份有限公司 一种无氰碱性镀铜的不溶性阳极及其电镀工艺

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1465034A (en) * 1921-11-03 1923-08-14 Frank L Antisell Process for the electrolytic deposition of copper
DE1496917A1 (de) * 1964-09-22 1969-05-22 Monsanto Co Elektrolytbaeder sowie Verfahren fuer die Herstellung galvanischer UEberzuege
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
JPS5321048A (en) * 1976-08-10 1978-02-27 Nippon Electric Co Constant current density plating device
DE3012168A1 (de) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren zur galvanischen abscheidung von kupferniederschlaegen
CA1190514A (en) * 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
DE3144128C1 (de) * 1981-11-06 1983-06-09 Bayerische Motoren Werke AG, 8000 München Vorrichtung zum galvanischen Abscheiden eines Metalls auf einem metallischen Werkstueck
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
FR2540153B1 (fr) * 1982-10-12 1987-02-13 Roquette Freres Composition et procede de couchage du papier et du carton, procede de preparation de la composition et papier et carton ainsi obtenus
US4462874A (en) * 1983-11-16 1984-07-31 Omi International Corporation Cyanide-free copper plating process
DE3347593A1 (de) * 1983-01-03 1984-07-05 Omi International Corp., Warren, Mich. Waessriger alkalischer cyanidfreier kupferelektrolyt und verfahren zur galvanischen abscheidung einer kornverfeinerten duktilen und haftfesten kupferschicht auf einem leitfaehigen substrat
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
SU1157146A1 (ru) * 1983-07-25 1985-05-23 Предприятие П/Я М-5353 Способ гальванического меднени и одновременной очистки электролита от примесей
US4521282A (en) * 1984-07-11 1985-06-04 Omi International Corporation Cyanide-free copper electrolyte and process
US4762601A (en) * 1986-11-10 1988-08-09 Morton Thiokol, Inc. Copper bath for electroless plating having excess counter-cation and process using same
JPS63317698A (ja) * 1987-06-20 1988-12-26 Toyota Motor Corp 電気めっき液の金属イオン濃度と水素イオン濃度の制御装置
US4906340A (en) * 1989-05-31 1990-03-06 Eco-Tec Limited Process for electroplating metals
EP0871213A3 (en) * 1997-03-27 1999-03-03 Siemens Aktiengesellschaft Method for producing vias having variable sidewall profile

Also Published As

Publication number Publication date
GB9016194D0 (en) 1990-09-05
JPH0375400A (ja) 1991-03-29
GB2234260B (en) 1994-01-12
FR2649996B1 (fr) 1993-03-19
AU647402B2 (en) 1994-03-24
IT1240490B (it) 1993-12-17
DE4023444A1 (de) 1991-01-31
DE4023444C2 (de) 1995-02-23
FR2649996A1 (fr) 1991-01-25
IT9067561A1 (it) 1992-01-18
US4933051A (en) 1990-06-12
JP3131648B2 (ja) 2001-02-05
GB2234260A (en) 1991-01-30
AU5970490A (en) 1991-01-24
IT9067561A0 (it) 1990-07-18

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