DE69306189D1 - Verbesserte stromlose Kupferplattierung - Google Patents

Verbesserte stromlose Kupferplattierung

Info

Publication number
DE69306189D1
DE69306189D1 DE69306189T DE69306189T DE69306189D1 DE 69306189 D1 DE69306189 D1 DE 69306189D1 DE 69306189 T DE69306189 T DE 69306189T DE 69306189 T DE69306189 T DE 69306189T DE 69306189 D1 DE69306189 D1 DE 69306189D1
Authority
DE
Germany
Prior art keywords
copper plating
electroless copper
improved electroless
improved
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69306189T
Other languages
English (en)
Other versions
DE69306189T2 (de
Inventor
Richard Arthur Mayernik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMP Akzo Corp
Original Assignee
AMP Akzo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Akzo Corp filed Critical AMP Akzo Corp
Application granted granted Critical
Publication of DE69306189D1 publication Critical patent/DE69306189D1/de
Publication of DE69306189T2 publication Critical patent/DE69306189T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
DE69306189T 1992-08-04 1993-07-23 Verbesserte stromlose Kupferplattierung Expired - Lifetime DE69306189T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/924,842 US5258200A (en) 1992-08-04 1992-08-04 Electroless copper deposition

Publications (2)

Publication Number Publication Date
DE69306189D1 true DE69306189D1 (de) 1997-01-09
DE69306189T2 DE69306189T2 (de) 1997-05-28

Family

ID=25450813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69306189T Expired - Lifetime DE69306189T2 (de) 1992-08-04 1993-07-23 Verbesserte stromlose Kupferplattierung

Country Status (5)

Country Link
US (2) US5258200A (de)
EP (1) EP0582336B1 (de)
JP (1) JPH06173018A (de)
CA (1) CA2101881A1 (de)
DE (1) DE69306189T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition
US5633047A (en) * 1994-02-22 1997-05-27 International Business Machines Corporation Electronic devices having metallurgies containing copper-semiconductor compounds
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
US8354046B2 (en) * 2004-07-08 2013-01-15 Los Alamos National Security, Llc Germanium films by polymer-assisted deposition
EP1550739B1 (de) * 2002-09-09 2010-04-28 Sumitomo Electric Industries, Ltd. Metallbeschichteter polyesterharzgegenstand und herstellungsverfahren dafür
US7029529B2 (en) 2002-09-19 2006-04-18 Applied Materials, Inc. Method and apparatus for metallization of large area substrates
JP4990966B2 (ja) * 2006-04-13 2012-08-01 コーロン インダストリーズ インク 金属電極の製造方法
US8172627B2 (en) * 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle
US20170073815A1 (en) * 2015-09-10 2017-03-16 Lam Research Corporation Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating
US3485643A (en) * 1966-05-06 1969-12-23 Photocircuits Corp Electroless copper plating
US3615735A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3615732A (en) * 1968-08-13 1971-10-26 Shipley Co Electroless copper plating
US3959351A (en) * 1972-07-24 1976-05-25 Research Corporation Haloalkylbenzoyl esters of di-lower alkylamino alkanols and quaternary lower alkyl salts thereof
GB2083080A (en) * 1981-09-01 1982-03-17 Philips Nv Electroless deposition of copper alloy layers
EP0132594B1 (de) * 1983-07-25 1988-09-07 Hitachi, Ltd. Lösung zum stromlosen Plattieren mit Kupfer
JPS6070183A (ja) * 1983-09-28 1985-04-20 C Uyemura & Co Ltd 化学銅めっき方法
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
US4695505A (en) * 1985-10-25 1987-09-22 Shipley Company Inc. Ductile electroless copper
US4666683A (en) * 1985-11-21 1987-05-19 Eco-Tec Limited Process for removal of copper from solutions of chelating agent and copper
JPS63312983A (ja) * 1987-06-16 1988-12-21 Hitachi Ltd 無電解銅めっき方法
JPH0634448B2 (ja) * 1988-07-25 1994-05-02 株式会社日立製作所 多層プリント配線板及びその製造方法
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition

Also Published As

Publication number Publication date
DE69306189T2 (de) 1997-05-28
JPH06173018A (ja) 1994-06-21
EP0582336A2 (de) 1994-02-09
EP0582336A3 (de) 1995-02-01
CA2101881A1 (en) 1994-02-05
EP0582336B1 (de) 1996-11-27
US5429861A (en) 1995-07-04
US5258200A (en) 1993-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition