DE69404496D1 - Cyanidfreie Plattierungslösung für monovalente Metalle - Google Patents
Cyanidfreie Plattierungslösung für monovalente MetalleInfo
- Publication number
- DE69404496D1 DE69404496D1 DE69404496T DE69404496T DE69404496D1 DE 69404496 D1 DE69404496 D1 DE 69404496D1 DE 69404496 T DE69404496 T DE 69404496T DE 69404496 T DE69404496 T DE 69404496T DE 69404496 D1 DE69404496 D1 DE 69404496D1
- Authority
- DE
- Germany
- Prior art keywords
- plating solution
- monovalent metals
- free plating
- cyanide free
- cyanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/019,949 US5302278A (en) | 1993-02-19 | 1993-02-19 | Cyanide-free plating solutions for monovalent metals |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404496D1 true DE69404496D1 (de) | 1997-09-04 |
DE69404496T2 DE69404496T2 (de) | 1997-12-18 |
Family
ID=21795943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404496T Expired - Lifetime DE69404496T2 (de) | 1993-02-19 | 1994-02-18 | Cyanidfreie Plattierungslösung für monovalente Metalle |
Country Status (4)
Country | Link |
---|---|
US (2) | US5302278A (de) |
EP (1) | EP0611840B1 (de) |
JP (1) | JP3300519B2 (de) |
DE (1) | DE69404496T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6911887B1 (en) * | 1994-09-12 | 2005-06-28 | Matsushita Electric Industrial Co., Ltd. | Inductor and method for producing the same |
US5845847A (en) * | 1996-05-14 | 1998-12-08 | S. C. Johnson & Son, Inc. | Air freshener dispenser device |
DE19629658C2 (de) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
US5750018A (en) * | 1997-03-18 | 1998-05-12 | Learonal, Inc. | Cyanide-free monovalent copper electroplating solutions |
TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
US6126807A (en) | 1999-04-30 | 2000-10-03 | Lucent Technologies Inc. | Process for making sodium gold sulfite solution |
ATE353377T1 (de) * | 1999-07-26 | 2007-02-15 | Tokyo Electron Ltd | Plattierungsverfahren, -vorrichtung und -system |
DE19937843C1 (de) * | 1999-08-13 | 2001-02-08 | Bolta Werke Gmbh | Verfahren zur Herstellung einer selbsttragenden Kupferfolie |
JP4375702B2 (ja) * | 2001-10-25 | 2009-12-02 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | めっき組成物 |
EP1310582A1 (de) * | 2001-11-07 | 2003-05-14 | Shipley Company LLC | Verfahren zur elektrolytischen Kupfer Plattierung |
US6911230B2 (en) * | 2001-12-14 | 2005-06-28 | Shipley Company, L.L.C. | Plating method |
SG117440A1 (en) * | 2002-11-23 | 2005-12-29 | Shipley Co Llc | Plating method |
US7235165B2 (en) * | 2004-04-02 | 2007-06-26 | Richard Lacey | Electroplating solution and method for electroplating |
CN1308493C (zh) * | 2004-07-27 | 2007-04-04 | 滕先弟 | 硫代硫酸金铵络合物及其制备方法 |
US20060024502A1 (en) * | 2004-07-30 | 2006-02-02 | Mcfarland Eric W | Electrodeposition of C60 thin films |
JP4499502B2 (ja) * | 2004-08-05 | 2010-07-07 | 荏原ユージライト株式会社 | めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法 |
GB0518613D0 (en) * | 2005-09-13 | 2005-10-19 | Eastman Kodak Co | Method of forming conductive tracks |
FR2890983B1 (fr) * | 2005-09-20 | 2007-12-14 | Alchimer Sa | Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal. |
FR2890984B1 (fr) * | 2005-09-20 | 2009-03-27 | Alchimer Sa | Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal. |
US9512012B2 (en) * | 2007-12-08 | 2016-12-06 | Comsats Institute Of Information Technology | Sonoelectrolysis for metal removal |
DE102009024396A1 (de) | 2009-06-09 | 2010-12-16 | Coventya Spa | Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen |
JP5566743B2 (ja) * | 2010-03-26 | 2014-08-06 | 古河電気工業株式会社 | 銅合金微粒子の製造方法 |
DE102010053676A1 (de) | 2010-12-07 | 2012-06-14 | Coventya Spa | Elektrolyt für die galvanische Abscheidung von Gold-Legierungen und Verfahren zu dessen Herstellung |
CN102242381A (zh) * | 2011-06-29 | 2011-11-16 | 杭州阿玛尔科技有限公司 | 以亚甲基二膦酸为主配位剂的碱性无氰镀铜电镀液 |
US9611550B2 (en) * | 2012-12-26 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Formaldehyde free electroless copper plating compositions and methods |
CN103469261B (zh) * | 2013-09-16 | 2016-02-03 | 杭州和韵科技有限公司 | 一种无氰镀银溶液添加剂 |
US10889907B2 (en) | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
CN104131320A (zh) * | 2014-06-25 | 2014-11-05 | 济南大学 | 一种含硫羰基络合剂的无氰亚铜电镀铜溶液及其稳定化方法 |
CN104120463B (zh) * | 2014-06-25 | 2016-06-22 | 济南大学 | 钢铁基体的一种无氰亚铜电镀铜表面改性方法 |
CN104120468B (zh) * | 2014-06-25 | 2016-08-03 | 济南大学 | 一种无氰亚铜电镀铜锌合金溶液 |
US20160355939A1 (en) * | 2015-06-05 | 2016-12-08 | Lam Research Corporation | Polarization stabilizer additive for electroplating |
CN106894063A (zh) * | 2017-03-17 | 2017-06-27 | 湖北吉和昌化工科技有限公司 | 无氰、无毒仿金电镀配位剂和无氰、无磷、无氨仿金电镀液 |
US20200095693A1 (en) | 2017-05-23 | 2020-03-26 | Saxonia Edelmetalle Gmbh | Noble metal salt preparation, a method for production thereof and use for electroplating |
EP3586884A1 (de) | 2018-06-27 | 2020-01-01 | SABIC Global Technologies B.V. | Thermoplastische implantatmaterialien |
JP2022111432A (ja) * | 2021-01-20 | 2022-08-01 | 株式会社Jcu | 電解銀めっき浴およびこれを用いた電解銀めっき方法 |
CN115627505B (zh) * | 2022-12-19 | 2023-04-28 | 深圳创智芯联科技股份有限公司 | 一种脉冲无氰电镀金液及其电镀工艺 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1969553A (en) * | 1934-08-07 | Electrolyte for the deposition of | ||
DE2410441C2 (de) * | 1974-03-01 | 1982-11-11 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber |
US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
US4067784A (en) * | 1976-06-09 | 1978-01-10 | Oxy Metal Industries Corporation | Non-cyanide acidic silver electroplating bath and additive therefore |
US4540473A (en) * | 1983-11-22 | 1985-09-10 | International Business Machines Corporation | Copper plating bath having increased plating rate, and method |
-
1993
- 1993-02-19 US US08/019,949 patent/US5302278A/en not_active Ceased
-
1994
- 1994-02-18 JP JP02088994A patent/JP3300519B2/ja not_active Expired - Lifetime
- 1994-02-18 DE DE69404496T patent/DE69404496T2/de not_active Expired - Lifetime
- 1994-02-18 EP EP94102479A patent/EP0611840B1/de not_active Expired - Lifetime
-
1996
- 1996-04-10 US US08/633,271 patent/USRE35513E/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
USRE35513E (en) | 1997-05-20 |
DE69404496T2 (de) | 1997-12-18 |
EP0611840B1 (de) | 1997-07-30 |
US5302278A (en) | 1994-04-12 |
EP0611840A1 (de) | 1994-08-24 |
JPH06287791A (ja) | 1994-10-11 |
JP3300519B2 (ja) | 2002-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: MUELLER-BORE & PARTNER, PATENTANWAELTE, EUROPEAN PAT |