DE69404496D1 - Cyanidfreie Plattierungslösung für monovalente Metalle - Google Patents

Cyanidfreie Plattierungslösung für monovalente Metalle

Info

Publication number
DE69404496D1
DE69404496D1 DE69404496T DE69404496T DE69404496D1 DE 69404496 D1 DE69404496 D1 DE 69404496D1 DE 69404496 T DE69404496 T DE 69404496T DE 69404496 T DE69404496 T DE 69404496T DE 69404496 D1 DE69404496 D1 DE 69404496D1
Authority
DE
Germany
Prior art keywords
plating solution
monovalent metals
free plating
cyanide free
cyanide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69404496T
Other languages
English (en)
Other versions
DE69404496T2 (de
Inventor
Fred I Nobel
William R Brasch
Anthony J Drago
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE69404496D1 publication Critical patent/DE69404496D1/de
Publication of DE69404496T2 publication Critical patent/DE69404496T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE69404496T 1993-02-19 1994-02-18 Cyanidfreie Plattierungslösung für monovalente Metalle Expired - Lifetime DE69404496T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/019,949 US5302278A (en) 1993-02-19 1993-02-19 Cyanide-free plating solutions for monovalent metals

Publications (2)

Publication Number Publication Date
DE69404496D1 true DE69404496D1 (de) 1997-09-04
DE69404496T2 DE69404496T2 (de) 1997-12-18

Family

ID=21795943

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404496T Expired - Lifetime DE69404496T2 (de) 1993-02-19 1994-02-18 Cyanidfreie Plattierungslösung für monovalente Metalle

Country Status (4)

Country Link
US (2) US5302278A (de)
EP (1) EP0611840B1 (de)
JP (1) JP3300519B2 (de)
DE (1) DE69404496T2 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
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US6911887B1 (en) * 1994-09-12 2005-06-28 Matsushita Electric Industrial Co., Ltd. Inductor and method for producing the same
US5845847A (en) * 1996-05-14 1998-12-08 S. C. Johnson & Son, Inc. Air freshener dispenser device
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6126807A (en) 1999-04-30 2000-10-03 Lucent Technologies Inc. Process for making sodium gold sulfite solution
WO2001007687A1 (en) * 1999-07-26 2001-02-01 Tokyo Electron Limited Plating method and device, and plating system
DE19937843C1 (de) * 1999-08-13 2001-02-08 Bolta Werke Gmbh Verfahren zur Herstellung einer selbsttragenden Kupferfolie
JP4375702B2 (ja) * 2001-10-25 2009-12-02 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． めっき組成物
EP1310582A1 (de) * 2001-11-07 2003-05-14 Shipley Company LLC Verfahren zur elektrolytischen Kupfer Plattierung
US6911230B2 (en) * 2001-12-14 2005-06-28 Shipley Company, L.L.C. Plating method
SG117440A1 (en) * 2002-11-23 2005-12-29 Shipley Co Llc Plating method
US7235165B2 (en) * 2004-04-02 2007-06-26 Richard Lacey Electroplating solution and method for electroplating
CN1308493C (zh) * 2004-07-27 2007-04-04 滕先弟 硫代硫酸金铵络合物及其制备方法
US20060024502A1 (en) * 2004-07-30 2006-02-02 Mcfarland Eric W Electrodeposition of C60 thin films
JP4499502B2 (ja) * 2004-08-05 2010-07-07 荏原ユージライト株式会社 めっき用レベリング剤、酸性銅めっき浴用添加剤組成物、酸性銅めっき浴および該めっき浴を用いるめっき方法
GB0518613D0 (en) * 2005-09-13 2005-10-19 Eastman Kodak Co Method of forming conductive tracks
FR2890984B1 (fr) * 2005-09-20 2009-03-27 Alchimer Sa Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal.
FR2890983B1 (fr) * 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
US9512012B2 (en) * 2007-12-08 2016-12-06 Comsats Institute Of Information Technology Sonoelectrolysis for metal removal
DE102009024396A1 (de) 2009-06-09 2010-12-16 Coventya Spa Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
JP5566743B2 (ja) * 2010-03-26 2014-08-06 古河電気工業株式会社 銅合金微粒子の製造方法
DE102010053676A1 (de) 2010-12-07 2012-06-14 Coventya Spa Elektrolyt für die galvanische Abscheidung von Gold-Legierungen und Verfahren zu dessen Herstellung
CN102242381A (zh) * 2011-06-29 2011-11-16 杭州阿玛尔科技有限公司 以亚甲基二膦酸为主配位剂的碱性无氰镀铜电镀液
US9611550B2 (en) * 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
CN103469261B (zh) * 2013-09-16 2016-02-03 杭州和韵科技有限公司 一种无氰镀银溶液添加剂
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN104120468B (zh) * 2014-06-25 2016-08-03 济南大学 一种无氰亚铜电镀铜锌合金溶液
CN104120463B (zh) * 2014-06-25 2016-06-22 济南大学 钢铁基体的一种无氰亚铜电镀铜表面改性方法
CN104131320A (zh) * 2014-06-25 2014-11-05 济南大学 一种含硫羰基络合剂的无氰亚铜电镀铜溶液及其稳定化方法
US20160355939A1 (en) * 2015-06-05 2016-12-08 Lam Research Corporation Polarization stabilizer additive for electroplating
CN106894063A (zh) * 2017-03-17 2017-06-27 湖北吉和昌化工科技有限公司 无氰、无毒仿金电镀配位剂和无氰、无磷、无氨仿金电镀液
EP3443146B1 (de) 2017-05-23 2019-12-25 SAXONIA Edelmetalle GmbH Edelmetallsalzaufbereitung, verfahren zur herstellung davon und verwendung zur elektroplattierung
EP3586884A1 (de) 2018-06-27 2020-01-01 SABIC Global Technologies B.V. Thermoplastische implantatmaterialien
JP2022111432A (ja) * 2021-01-20 2022-08-01 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
CN115627505B (zh) * 2022-12-19 2023-04-28 深圳创智芯联科技股份有限公司 一种脉冲无氰电镀金液及其电镀工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1969553A (en) * 1934-08-07 Electrolyte for the deposition of
DE2410441C2 (de) * 1974-03-01 1982-11-11 Schering Ag, 1000 Berlin Und 4619 Bergkamen Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Silber
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
US4067784A (en) * 1976-06-09 1978-01-10 Oxy Metal Industries Corporation Non-cyanide acidic silver electroplating bath and additive therefore
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method

Also Published As

Publication number Publication date
DE69404496T2 (de) 1997-12-18
JP3300519B2 (ja) 2002-07-08
JPH06287791A (ja) 1994-10-11
EP0611840B1 (de) 1997-07-30
EP0611840A1 (de) 1994-08-24
US5302278A (en) 1994-04-12
USRE35513E (en) 1997-05-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: MUELLER-BORE & PARTNER, PATENTANWAELTE, EUROPEAN PAT