KR970707590A - 바리캡 다이오드와 바리캡 다이오드를 만나는 방법(A Varicap diode and method of manufacturing a varicap diode) - Google Patents

바리캡 다이오드와 바리캡 다이오드를 만나는 방법(A Varicap diode and method of manufacturing a varicap diode) Download PDF

Info

Publication number
KR970707590A
KR970707590A KR1019970703314A KR19970703314A KR970707590A KR 970707590 A KR970707590 A KR 970707590A KR 1019970703314 A KR1019970703314 A KR 1019970703314A KR 19970703314 A KR19970703314 A KR 19970703314A KR 970707590 A KR970707590 A KR 970707590A
Authority
KR
South Korea
Prior art keywords
band
conductivity type
epitaxial layer
layer
dopant atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019970703314A
Other languages
English (en)
Korean (ko)
Inventor
프레데리커스 로롤프 요하네스 휘스만
오스카 요하네스 안토이네타 부이크
빈트케 볼프강
Original Assignee
요트. 게. 아 롤페즈
필립스 일렉트로닉스 엔. 브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요트. 게. 아 롤페즈, 필립스 일렉트로닉스 엔. 브이. filed Critical 요트. 게. 아 롤페즈
Publication of KR970707590A publication Critical patent/KR970707590A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/045Manufacture or treatment of capacitors having potential barriers, e.g. varactors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/62Capacitors having potential barriers
    • H10D1/64Variable-capacitance diodes, e.g. varactors 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6349Deposition of epitaxial materials

Landscapes

  • Bipolar Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Recrystallisation Techniques (AREA)
KR1019970703314A 1995-09-18 1996-09-11 바리캡 다이오드와 바리캡 다이오드를 만나는 방법(A Varicap diode and method of manufacturing a varicap diode) Withdrawn KR970707590A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP95202519.5 1995-09-18
EP95202519 1995-09-18

Publications (1)

Publication Number Publication Date
KR970707590A true KR970707590A (ko) 1997-12-01

Family

ID=8220643

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970703314A Withdrawn KR970707590A (ko) 1995-09-18 1996-09-11 바리캡 다이오드와 바리캡 다이오드를 만나는 방법(A Varicap diode and method of manufacturing a varicap diode)

Country Status (7)

Country Link
US (1) US5854117A (enExample)
EP (1) EP0792525B1 (enExample)
JP (1) JPH10509563A (enExample)
KR (1) KR970707590A (enExample)
CN (1) CN1165586A (enExample)
DE (1) DE69617628T2 (enExample)
WO (1) WO1997011498A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE511721C2 (sv) * 1997-06-18 1999-11-15 Ericsson Telefon Ab L M Substrat för integrerade högfrekvenskretsar samt förfarande för substratframställning
EP1214737B1 (en) * 2000-03-03 2011-06-01 Nxp B.V. A method of producing a schottky varicap diode
EP1139434A3 (en) * 2000-03-29 2003-12-10 Tyco Electronics Corporation Variable capacity diode with hyperabrubt junction profile
US6995068B1 (en) * 2000-06-09 2006-02-07 Newport Fab, Llc Double-implant high performance varactor and method for manufacturing same
DE10032389A1 (de) * 2000-07-06 2002-01-17 Philips Corp Intellectual Pty Empfänger mit Kapazitätsvariationsdiode
US6521939B1 (en) 2000-09-29 2003-02-18 Chartered Semiconductor Manufacturing Ltd. High performance integrated varactor on silicon
US6933774B2 (en) * 2000-11-28 2005-08-23 Precision Dynamics Corporation Rectifying charge storage element with transistor
US6859093B1 (en) 2000-11-28 2005-02-22 Precision Dynamics Corporation Rectifying charge storage device with bi-stable states
US7031182B2 (en) * 2000-11-28 2006-04-18 Beigel Michael L Rectifying charge storage memory circuit
US6982452B2 (en) * 2000-11-28 2006-01-03 Precision Dynamics Corporation Rectifying charge storage element
US6414543B1 (en) 2000-11-28 2002-07-02 Precision Dynamics Corporation Rectifying charge storage element
US6924691B2 (en) * 2000-11-28 2005-08-02 Precision Dynamics Corporation Rectifying charge storage device with sensor
US6835977B2 (en) * 2002-03-05 2004-12-28 United Microelectronics Corp. Variable capactor structure
US7204425B2 (en) * 2002-03-18 2007-04-17 Precision Dynamics Corporation Enhanced identification appliance
CN100353567C (zh) * 2003-11-19 2007-12-05 联华电子股份有限公司 制作可变电容的方法
CN100442542C (zh) * 2003-12-15 2008-12-10 松下电器产业株式会社 制造可变电容二极管的方法及可变电容二极管
WO2006022623A1 (en) * 2004-07-22 2006-03-02 Precision Dynamics Corporation Rectifying charge storage device with sensor
US7919382B2 (en) * 2008-09-09 2011-04-05 Freescale Semicondcutor, Inc. Methods for forming varactor diodes
CN101834134B (zh) * 2009-03-12 2012-03-21 中芯国际集成电路制造(上海)有限公司 提高金属-氧化物半导体变容二极管的品质因子的方法
DE102009059873A1 (de) 2009-12-21 2011-06-22 Epcos Ag, 81669 Varaktor und Verfahren zur Herstellung eines Varaktors
KR101138407B1 (ko) * 2010-03-15 2012-04-26 고려대학교 산학협력단 버랙터가 구비된 반도체 집적 회로, 및 그 제조 방법
RU2447541C1 (ru) * 2010-12-03 2012-04-10 Федеральное государственное унитарное предприятие "Научно-исследовательский институт микроприборов-К" Мдп-варикап
RU2569906C1 (ru) * 2014-08-26 2015-12-10 Акционерное общество "Научно-исследовательский институт микроприборов-К" (АО "НИИМП-К") Многоэлементный мдп варикап
KR102013867B1 (ko) 2015-08-05 2019-08-26 한국전자통신연구원 병렬 처리 장치 및 방법
RU2614663C1 (ru) * 2015-12-29 2017-03-28 Общество с ограниченной ответственностью "Лаборатория Микроприборов" Варикап и способ его изготовления
RU167582U1 (ru) * 2016-06-08 2017-01-10 Акционерное общество "Научно-исследовательский институт микроприборов-К" Свч мдп-варикап с переносом заряда
JP6299835B1 (ja) * 2016-10-07 2018-03-28 株式会社Sumco エピタキシャルシリコンウェーハおよびエピタキシャルシリコンウェーハの製造方法
RU192894U1 (ru) * 2019-07-09 2019-10-04 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" СВЧ МДП-варикап
CN115911136A (zh) * 2022-11-21 2023-04-04 捷捷半导体有限公司 芯片结构及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7513161A (nl) * 1975-11-11 1977-05-13 Philips Nv Werkwijze ter vervaardiging van een halfgeleider- inrichting, en inrichting vervaardigd volgens de werkwijze.
US4106953A (en) * 1976-12-28 1978-08-15 Motorola, Inc. Method of producing an ion implanted tuning diode
DE2833319C2 (de) * 1978-07-29 1982-10-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Kapazitätsdiode
JPS5669869A (en) * 1979-11-09 1981-06-11 Toshiba Corp Manufacture of variable capacity diode
US4534806A (en) * 1979-12-03 1985-08-13 International Business Machines Corporation Method for manufacturing vertical PNP transistor with shallow emitter
US4656498A (en) * 1980-10-27 1987-04-07 Texas Instruments Incorporated Oxide-isolated integrated Schottky logic
JPS6057952A (ja) * 1983-09-09 1985-04-03 Toshiba Corp 半導体装置の製造方法
JPS6247166A (ja) * 1985-08-26 1987-02-28 Toshiba Corp 半導体装置の製造方法
JPS6459874A (en) * 1987-08-31 1989-03-07 Toko Inc Manufacture of variable-capacitance diode
US5197077A (en) * 1992-02-28 1993-03-23 Mcdonnell Douglas Corporation Low divergence laser

Also Published As

Publication number Publication date
DE69617628T2 (de) 2002-08-14
CN1165586A (zh) 1997-11-19
DE69617628D1 (de) 2002-01-17
WO1997011498A1 (en) 1997-03-27
US5854117A (en) 1998-12-29
EP0792525A1 (en) 1997-09-03
JPH10509563A (ja) 1998-09-14
EP0792525B1 (en) 2001-12-05

Similar Documents

Publication Publication Date Title
US5854117A (en) Method of manufacturing a varicap diode, a varicap diode, a receiver device, and a TV receiver set
EP0738006A3 (en) Method for producing a semiconductor trench capacitor cell
KR940006248A (ko) 반도체장치 및 그 제조방법
US6387769B2 (en) Method of producing a schottky varicap
WO2006100640B1 (en) Method of manufacturing a semiconductor device having a buried doped region
KR910010732A (ko) 반도체 디바이스 및 그 제조방법
JPH0412628B2 (enExample)
JPH04112565A (ja) 半導体抵抗素子及びその製造方法
JPH01268172A (ja) 半導体装置
WO2003007361A3 (de) Verfahren zur herstellung eines bipolartransistors mit polysiliziumemitter
KR100305674B1 (ko) 가변용량 다이오드 및 그 제조방법
KR100332626B1 (ko) 가변용량 다이오드 및 그 제조방법
JPS5910278A (ja) 半導体装置
KR100358306B1 (ko) 수직형 바이폴라 트랜지스터의 제조방법
KR920008951A (ko) 더블도우프된 채널스톱층을 가지는 반도체장치 및 그 제조방법
EP0296771A2 (en) Semiconductor device with a buried layer, and method of manufacture
JPH07321347A (ja) 高濃度pn接合面を有する半導体装置の製造方法
KR970030784A (ko) 반도체 장치 및 그 제조 방법
KR940004711A (ko) 폴리실리콘층 형성방법
KR970053032A (ko) 반도체 소자 제조 방법
KR960039346A (ko) 반도체 소자의 구조 및 제조방법
KR970053907A (ko) 씨모스(cmos)에서 듀얼 게이트 전극 제조방법
KR910001930A (ko) 자기정렬된 저도핑된 접합형성방법
KR920007230A (ko) 선택적 애피택시를 이용한 바이폴라 트랜지스터의 제조방법
JPS59175774A (ja) 半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000