KR970705839A - 다층 전자 소자 제조 방법(Method of manufacturning multilayer electronic components) - Google Patents

다층 전자 소자 제조 방법(Method of manufacturning multilayer electronic components)

Info

Publication number
KR970705839A
KR970705839A KR1019970701229A KR19970701229A KR970705839A KR 970705839 A KR970705839 A KR 970705839A KR 1019970701229 A KR1019970701229 A KR 1019970701229A KR 19970701229 A KR19970701229 A KR 19970701229A KR 970705839 A KR970705839 A KR 970705839A
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KR
South Korea
Prior art keywords
sheet
multilayer electronic
segments
laser
electronic device
Prior art date
Application number
KR1019970701229A
Other languages
English (en)
Inventor
안토니우스 그레고리우스 리즌비크
작케스 바르니에르
Original Assignee
제이.쥐.에이.롤페즈
필립스 일렉트로닉스 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이.쥐.에이.롤페즈, 필립스 일렉트로닉스 엔.브이. filed Critical 제이.쥐.에이.롤페즈
Publication of KR970705839A publication Critical patent/KR970705839A/ko

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/304—Stacked capacitors obtained from a another capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)

Abstract

세라믹 테이프층(3,3')이 각각 전극 패턴(5,5')으로 일측부상에 제공되며, 연속적인 층상의 전극 패턴(5,5')이 서로에 대해 전,후방으로 옵셋되도록 적층되어 함께 압축된 박막시트(1)를 제조하는 단계(가)와, 연속적인 전극들이 다른 세그먼트 모서리에서 교대로 노출되는 세그먼트로 상기 박막시트(1)를 절단하는 단계(나)와, 상기 세그먼트를 소결하는 단계(다)와, 주어진 세그먼트 모서리에 노출된 전극들이 접속되는 전기접촉부를 제공하는 단계(라)로 구성되는 복수의 다층 전자소자 제조방법에 있어서, 상기 절단 단계(나)는 상기 박막시트(1)의 형태상에 촛점 형성된 레이저 빔(7)을 투사시키고, 선택된 절단경로(13)를 따라 상기 빔(7)을 추적하도록 상기 시트(1)에 대해 상기 빔(7)을 상대적으로 투사시킴으로써 상기 빔(7)의 간섭과 상기 시트(1)를 비가연성 기체의 유동으로 냉각시키는 것을 특징으로 한다.

Description

다층 전자 소자 제조 방법(Method of manufacturning multilayer electronic components)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명 방법을 이용하여 절단된 박막 시트의 부분 사시도, 제3도는 전기 접촉부가 제공된 박막 시트의 세그먼트의 도면, 제4도는 본 발명에 따른 인쇄회로 기판에서 표면 장착이 용이한 전자소자의 도면.

Claims (6)

  1. 세라믹 테이프층이 각각 전극 패턴으로 일측부상에 제공되며, 연속적인 층상의 전극 패턴이 서로에 대해 전, 후방으로 옵셋되도록 적층되어 함께 압축된 박막시트를 제조하는 단계(가)와, 연속적인 전극들이 다른 세그먼트 모서리에서 교대로 노출되는 세그먼트로 상기 박막시트를 절단하는 단계(나)와, 상기 세그먼트를 소결하는 단계(다)와, 주어진 세그먼트 모서리에 노출된 전극들이 접속되는 전기접촉부를 제공하는 단계(라)로 구성되는 복수의 다층 전자소자 제조방법에 있어서, 상기 절단 단계(나)는 상기 박막시트의 평면상에 촛점 형성된 레이저 빔을 투사시키고, 선택된 절단경로를 따라 상기 빔을 추적하도록 상기 시트에 대해 상기 빔을 상대적으로 투사시킴으로서, 상기 빔의 간섭과 시트를 비가연성 기체의 유동으로 냉각시키는 것을 특징으로 하는 다층 전자소자 제조 방법.
  2. 제1항에 있어서, 상기 레이저는 이산화탄소(CO2) 레이저인 것을 특징으로 하는 다층 전자소자 제조 방법.
  3. 제1항 또는 제2항에 있어서, 상기 박막시트의 두께는 0.1 내지 3.0mm이고, 상기 레이저 빔의 촛점에서의 세기는 50 내지 500kw/㎟ 인 것을 특징으로 하는 다층 전자소자 제조 방법.
  4. 제1항 내지 제3항중 어느 한 항에 있어서, 상기 상기 비가연성 기체는 공기이며, 그 유량은 0.1 내지 1.01ℓ/s(1기압, 25℃에서 측정)인 것을 특징으로 하는 다층 전자소자 제조 방법.
  5. 제1항 내지 제4항 중 어느 한 항에 청구된 바와 같은 방법을 이용하여 제조되는 것을 특징으로 하는 다층 캐패시터.
  6. 제1항 내지 제4항 중 어느 한 항에 청구된 바와 같은 방법을 이용하여 제조되는 것을 특징으로 하는 다층 압전 액츄에이터.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970701229A 1995-06-27 1996-05-31 다층 전자 소자 제조 방법(Method of manufacturning multilayer electronic components) KR970705839A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP95201740 1995-06-27
EP95201740.8 1995-06-27
PCT/IB1996/000524 WO1997001868A1 (en) 1995-06-27 1996-05-31 Method of manufacturing multilayer electronic components

Publications (1)

Publication Number Publication Date
KR970705839A true KR970705839A (ko) 1997-10-09

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ID=8220421

Family Applications (1)

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KR1019970701229A KR970705839A (ko) 1995-06-27 1996-05-31 다층 전자 소자 제조 방법(Method of manufacturning multilayer electronic components)

Country Status (7)

Country Link
US (1) US5758398A (ko)
EP (1) EP0777913B1 (ko)
JP (1) JPH10505463A (ko)
KR (1) KR970705839A (ko)
DE (1) DE69603931T2 (ko)
TW (1) TW337021B (ko)
WO (1) WO1997001868A1 (ko)

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Also Published As

Publication number Publication date
EP0777913B1 (en) 1999-08-25
EP0777913A1 (en) 1997-06-11
US5758398A (en) 1998-06-02
TW337021B (en) 1998-07-21
JPH10505463A (ja) 1998-05-26
WO1997001868A1 (en) 1997-01-16
DE69603931D1 (de) 1999-09-30
DE69603931T2 (de) 2000-03-30

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