KR970070232A - 스퍼터성막장치 - Google Patents
스퍼터성막장치 Download PDFInfo
- Publication number
- KR970070232A KR970070232A KR1019970014310A KR19970014310A KR970070232A KR 970070232 A KR970070232 A KR 970070232A KR 1019970014310 A KR1019970014310 A KR 1019970014310A KR 19970014310 A KR19970014310 A KR 19970014310A KR 970070232 A KR970070232 A KR 970070232A
- Authority
- KR
- South Korea
- Prior art keywords
- rocking
- target
- substrate
- forming apparatus
- film forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Abstract
타게트표면의 전면을 스퍼터하고, 타게트표면상의 에로젼영역의 깊이를 균일화하여, 타게트의 이용효율을 향상시키고, 성막된 기판상의 막두께 분포와 막질 분포를 개선한다.
진공용기(11)와, 진공용기내를 배기하는 배기기구(18)와, 타게트(14)를 부착한 마그네트론 음극(12a, 12b)과, 스퍼터가스를 도입하는 가스도입기구(19)와, 기판 반송기구를 구비한다. 타게트 근처에서는 방전이 생성되어, 이에 따라 타게트가 스퍼터되고, 타게트표면에 대향하여 통과하는 기판(15)상에 스퍼터성막이 행해진다. 마그네트론 음극은, 마그네트론 자기회로(32)를 이동가능하게 구비하고, 마그네트론 자기회로를 타게트표면에 평행하게 기판반송방향으로 요동하는 좌우방향 요동부와, 기판반송방향에 대하여 수직인 방향으로 요동하는 상하방향 요동부를 포함하는 마그네트론 요동기구(33)를 구비한다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 스퍼터성막장치(sputter deposition system)의 주요부의 종단면도이다.
Claims (6)
- 스퍼터성막챔버를 형성하는 진공용기와, 이 진공용기의 내부를 진공배기하는 배기기구와, 상기 진공용기의 내부에 임하는 타게트를 부착한 마그네트론 음극과, 상기 진공용기내에 스퍼터가스를 도입하는 가스도입기구와, 상기 진공용기의 내부에 기판을 반송하는 기판반송기구를 구비한 스퍼터성막을 행하는 스퍼터성막장치에 있어서, 상기 마그네트론 음극은, 상기 타게트의 배면측에 위치하는 마그네트론 자기회로와, 상기 마그네트론 자기회로를 상기 타게트의 표면에 평행하게 기판반송방향으로 요동하는 제1요동수단과, 상기 마그네트론 자기회로를 상기 타게트의 표면에 평행하고 기판반송방향에 대하여 수직인 방향으로 요동하는 제2요동수단을 구비한 것을 특징으로 한 스퍼터성막장치.
- 제1항에 있어서, 상기 제1요동수단에 의한 요동동작과 제2요동수단에 의한 요동동작중 적어도 한쪽은 정현함수의 요동을 가지는 것을 특징으로 하는 스퍼터성막장치.
- 제1항에 있어서, 상기 제1요동수단에 의한 요동동작과 상기 제2요동수단에 의한 요동동작중 적어도 한쪽은 양단의 근처를 제외하고 등속의 요동특성을 가지는 것을 특징으로 하는 스퍼터성막장치.
- 제2항에 있어서, 상기 제1요동수단에 의한 요동동작과 상기 제2요동수단에 의한 요동동작의 각 위상을 임의로 제어하는 수단을 가지는 것을 특징으로 하는 스퍼터성막장치.
- 제2항에 있어서, 상기 제1요동수단에 의한 요동동작의 주기가 상기 제2요동수단에 의한 요동동작의 주기의 4배 이상인 것을 특징으로 하는 스퍼터성막장치.
- 제2항에 있어서, 상기 타게트를 상기 기판의 어떤 1점이 통과하는 시간 동안에 상기 제1요동수단은 기판반송방향으로 복수주기의 요동동작을 행하는 것을 특징으로 하는 스퍼터성막장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP96-127923 | 1996-04-24 | ||
JP12792396 | 1996-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970070232A true KR970070232A (ko) | 1997-11-07 |
KR100262768B1 KR100262768B1 (ko) | 2000-08-01 |
Family
ID=14971984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970014310A KR100262768B1 (ko) | 1996-04-24 | 1997-04-18 | 스퍼터성막장치 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5833815A (ko) |
KR (1) | KR100262768B1 (ko) |
Families Citing this family (45)
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US6093290A (en) | 1997-05-14 | 2000-07-25 | Canon Kabushiki Kaisha | Method of generating a reciprocating plurality of magnetic fluxes on a target |
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DE69937948D1 (de) | 1999-06-21 | 2008-02-21 | Bekaert Advanced Coatings N V | Magnetron mit beweglicher Magnetanordnung zur Kompensation des Erosionsprofils |
JP4429418B2 (ja) * | 1999-07-19 | 2010-03-10 | 株式会社カネカ | マグネトロンスパッタ装置による金属酸化物薄膜の成膜方法 |
TW574385B (en) * | 2002-06-25 | 2004-02-01 | Hannstar Display Corp | Method of pre-sputtering with an increased rate of use of sputtering target |
US7381661B2 (en) * | 2002-10-15 | 2008-06-03 | Oc Oerlikon Balzers Ag | Method for the production of a substrate with a magnetron sputter coating and unit for the same |
US7182461B2 (en) * | 2003-07-15 | 2007-02-27 | Visteon Global Technologies, Inc. | Integrated docking assembly for portable multimedia unit |
US20060049040A1 (en) * | 2004-01-07 | 2006-03-09 | Applied Materials, Inc. | Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels |
US7513982B2 (en) * | 2004-01-07 | 2009-04-07 | Applied Materials, Inc. | Two dimensional magnetron scanning for flat panel sputtering |
US8500975B2 (en) * | 2004-01-07 | 2013-08-06 | Applied Materials, Inc. | Method and apparatus for sputtering onto large flat panels |
TWI403603B (zh) * | 2004-12-17 | 2013-08-01 | Oerlikon Solar Ag | 磁控管濺鍍設備 |
US7794574B2 (en) * | 2005-04-14 | 2010-09-14 | Tango Systems, Inc. | Top shield for sputtering system |
US7682495B2 (en) * | 2005-04-14 | 2010-03-23 | Tango Systems, Inc. | Oscillating magnet in sputtering system |
KR20070121838A (ko) * | 2005-04-14 | 2007-12-27 | 탱고 시스템즈 인코포레이티드 | 스퍼터링 시스템 |
US20060272935A1 (en) * | 2005-06-06 | 2006-12-07 | Applied Materials, Inc. | Multiple scanning magnetrons |
JP4923450B2 (ja) * | 2005-07-01 | 2012-04-25 | 富士ゼロックス株式会社 | バッチ処理支援装置および方法、プログラム |
US20070012559A1 (en) * | 2005-07-13 | 2007-01-18 | Applied Materials, Inc. | Method of improving magnetron sputtering of large-area substrates using a removable anode |
US20070012558A1 (en) * | 2005-07-13 | 2007-01-18 | Applied Materials, Inc. | Magnetron sputtering system for large-area substrates |
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US20070012663A1 (en) * | 2005-07-13 | 2007-01-18 | Akihiro Hosokawa | Magnetron sputtering system for large-area substrates having removable anodes |
US20070051616A1 (en) * | 2005-09-07 | 2007-03-08 | Le Hienminh H | Multizone magnetron assembly |
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JP4721878B2 (ja) * | 2005-11-22 | 2011-07-13 | キヤノンアネルバ株式会社 | スパッタリング装置 |
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EP1959028A1 (en) * | 2007-02-13 | 2008-08-20 | Galileo Vacuum Systems S.p.A. | Vacuum deposition system with mobile magnetron sputtering target |
TWI410511B (zh) * | 2007-03-16 | 2013-10-01 | Univ Tohoku Nat Univ Corp | 磁控管濺鍍裝置 |
JP5283084B2 (ja) * | 2007-04-06 | 2013-09-04 | 国立大学法人東北大学 | マグネトロンスパッタ装置 |
WO2008149891A1 (ja) * | 2007-06-04 | 2008-12-11 | Canon Anelva Corporation | 成膜装置 |
US8628645B2 (en) * | 2007-09-04 | 2014-01-14 | Front Edge Technology, Inc. | Manufacturing method for thin film battery |
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JP2010001565A (ja) * | 2008-05-20 | 2010-01-07 | Canon Anelva Corp | スパッタリング装置、それを用いた太陽電池及び画像表示装置の製造方法 |
US20100012481A1 (en) * | 2008-07-21 | 2010-01-21 | Guo G X | Deposition system having improved material utilization |
US8500962B2 (en) * | 2008-07-21 | 2013-08-06 | Ascentool Inc | Deposition system and methods having improved material utilization |
US20100018855A1 (en) * | 2008-07-24 | 2010-01-28 | Seagate Technology Llc | Inline co-sputter apparatus |
US8048277B2 (en) * | 2008-08-18 | 2011-11-01 | Canon Anelva Corporation | Magnet unit and magnetron sputtering apparatus |
US20100101937A1 (en) * | 2008-10-29 | 2010-04-29 | Applied Vacuum Coating Technologies Co., Ltd. | Method of fabricating transparent conductive film |
JP5336151B2 (ja) * | 2008-10-31 | 2013-11-06 | キヤノンアネルバ株式会社 | 薄膜形成装置及び磁気記録媒体の製造方法 |
US10106883B2 (en) | 2011-11-04 | 2018-10-23 | Intevac, Inc. | Sputtering system and method using direction-dependent scan speed or power |
JP2014532813A (ja) * | 2011-11-04 | 2014-12-08 | インテヴァック インコーポレイテッド | 線走査スパッタリングシステムおよび線走査スパッタリング方法 |
CN111826624A (zh) | 2013-02-08 | 2020-10-27 | 瑞士艾发科技 | Hipims溅射的方法和hipims溅射系统 |
JP6542466B2 (ja) * | 2016-03-29 | 2019-07-10 | 株式会社アルバック | 成膜装置、および、成膜方法 |
KR20220038145A (ko) * | 2019-08-08 | 2022-03-25 | 도쿄엘렉트론가부시키가이샤 | 성막 장치 및 성막 방법 |
JP7273739B2 (ja) * | 2020-01-08 | 2023-05-15 | 東京エレクトロン株式会社 | 成膜装置及び成膜方法 |
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DE2707144A1 (de) * | 1976-02-19 | 1977-08-25 | Sloan Technology Corp | Kathodenzerstaeubungsvorrichtung |
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JPH04193950A (ja) * | 1990-11-28 | 1992-07-14 | Seiko Epson Corp | プレーナマグネトロンスパッタリング装置 |
US5171415A (en) * | 1990-12-21 | 1992-12-15 | Novellus Systems, Inc. | Cooling method and apparatus for magnetron sputtering |
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JP3558655B2 (ja) * | 1992-06-28 | 2004-08-25 | 株式会社アルバック | マグネトロンスパッタ装置 |
-
1997
- 1997-04-18 KR KR1019970014310A patent/KR100262768B1/ko not_active IP Right Cessation
- 1997-04-24 US US08/842,356 patent/US5833815A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100262768B1 (ko) | 2000-08-01 |
US5833815A (en) | 1998-11-10 |
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